Abstract: An optical inspection tool can feature a double-speed and other modes whereby the inspection rate is increased by using pixel binning. For instance, the tool may include an array of pixels provided by one or more detectors. Some or all of the pixels in one or more of the detectors may be binned according to inspection requirements. Based on the reduction in effective pixels due to the binning, in some embodiments, the rate of imaging and scanning rate of the wafer (or other object) can be increased. Different portions of the array may be binned differently to provide for increased throughput during inspections; for instance, the binning arrangement across an array can be correlated to the features that will be imaged using the array.

Abstract: An optical inspection tool can feature a double-speed and other modes whereby the inspection rate is increased by using pixel binning. For instance, the tool may include an array of pixels provided by one or more detectors. Some or all of the pixels in one or more of the detectors may be binned according to inspection requirements. Based on the reduction in effective pixels due to the binning, in some embodiments, the rate of imaging and scanning rate of the wafer (or other object) can be increased. Different portions of the array may be binned differently to provide for increased throughput during inspections; for instance, the binning arrangement across an array can be correlated to the features that will be imaged using the array.