Abstract: It is described an electronic device 1 comprising a temperature detection component 2 and an integrated electronic power component 3, the device being adapted to be mounted on the substrate S. The electronic integrated power component 3 has a first surface portion 31, adapted to be mounted on the substrate S, and a second surface portion 32, opposite to the first surface portion. The temperature detection component 2 comprises two sensor terminals 21, 22, adapted to be connected to the substrate S by means of wire bonding W, and further comprises a temperature sensor 20, configured to detect a temperature T representative of the temperature T3 of the integrated electronic power component 3 and to provide, by means of the two sensor terminals 21, 22, an electrical signal V representative of the detected temperature T.