Abstract: A system and/or method can include power of Ethernet (PoE) controller including a PoE interface, a device interface and a controller, communicatively coupled to the PoE interface and the device interface. The controller can be configured to receive device control information via the PoE interface and to generate control instructions in response to the device control information for the device interface.

Abstract: A system and/or method can include power of Ethernet (PoE) controller including a PoE interface, a device interface and a controller, communicatively coupled to the PoE interface and the device interface. The controller can be configured to receive device control information via the PoE interface and to generate control instructions in response to the device control information for the device interface.

Abstract: Emergency power control systems enable Power-over-Ethernet (PoE) devices to be powered by primary and emergency power sources.

Abstract: A luminaire with a removable rail is disclosed. The luminaire can be powered with power provided by a power over Ethernet (PoE) solution. The rail can include a sensor that can provide feedback to the luminaire. The sensor can detect ambient information. A controller can modify output of the luminaire based on sensed information.

Abstract: A luminaire with a removable rail is disclosed. The luminaire can be powered with power provided by a power over Ethernet (PoE) solution. The rail can include a sensor that can provide feedback to the luminaire. The sensor can detect ambient information. A controller can modify output of the luminaire based on sensed information.

Abstract: Emergency power control systems enable Power-over-Ethernet (PoE) devices to be powered by primary and emergency power sources.

Abstract: In an embodiment, a luminaire includes a housing with a reflector. A rail is positioned near the reflector and has a light thereon which is configured to emit light into the reflector. The light is reflected from the reflector and passes through a diffuser that can act to ensure the emitted light is desirably defuse. In an embodiment, the diffuser can be removed from the housing for service or replacement.

Abstract: A beacon includes an interface, a sensor, an indicator and a controller. The controller is communicatively coupled to the interface, the sensor and the indicator, the controller configured to receive control information via the interface and the sensor and to generate control instructions in response to the control information for the indicator.

Abstract: A system and/or method can include power of Ethernet (PoE) controller including a PoE interface, a device interface and a controller, communicatively coupled to the PoE interface and the device interface. The controller can be configured to receive device control information via the PoE interface and to generate control instructions in response to the device control information for the device interface.

Abstract: A method is provided for manufacturing a fully moulded Multi Media Card package obtained by laser cutting wherein at least some edges and the corners around the package have rounded profile and a sufficient smoothness for a safe handling. The method includes providing a rounded groove on a substrate back side of the package, all around the package profile, and cutting the edges of said package by a laser cutting line passing through said groove. This new technique allows the use of all the 24.0 mm width of the MMC package for the substrate 2, thus increasing the surface available for electronic components.

Abstract: A manufacturing process of a stacked semiconductor device, comprising the following steps: integrating a plurality of electronic devices in a plurality of active areas realized in a semiconductor wafer; distributing an adhesive layer on active areas, splitting the semiconductor wafer into a plurality of first dies, each one comprising at least one of the active areas; mounting the plurality of first dies, which are already equipped with the adhesive layer, on a support; and mounting a plurality of second dies on the adhesive layer.

Abstract: A method is provided for manufacturing a fully moulded Multi Media Card package obtained by laser cutting wherein at least some edges and the corners around the package have rounded profile and a sufficient smoothness for a safe handling. The method includes providing a rounded groove on a substrate back side of the package, all around the package profile, and cutting the edges of said package by a laser cutting line passing through said groove. This new technique allows the use of all the 24.0 mm width of the MMC package for the substrate 2, thus increasing the surface available for electronic components.

Abstract: A process for the fabrication of devices that integrate protected microstructures, comprising the following steps: forming, in a body of semiconductor material, at least one microstructure having at least one first portion and one second portion which are relatively mobile with respect to one another and are separated from one another by at least one gap region, which is accessible through a face of the body; and sealing the gap. The sealing step includes depositing on the face of the body a layer of protective material, in such a way as to close the gap region, the protective layer being such as to enable relative motion between the first portion and the second portion of the microstructure.

Abstract: The present invention relates to leads of a No-Lead type package which includes a chip having an active surface and a rear surface opposite the active surface. The active surface has a plurality of connection points with a plurality of leads arranged around the perimeter of the chip and a first and a second surface orthogonal to said first surface. A plurality of connection wires connect electrically the bonding pads of the chip to the first surface of the leads respectively. The package also includes a welding compound suitable for encapsulating the chip, the first surface of the leads and the bonding pads. The leads possess at least one hole in the second surface of the leads.

Abstract: A manufacturing process of a stacked semiconductor device is described, comprising the following steps: integrating a plurality of electronic devices in a plurality of active areas realized in a semiconductor wafer (9a); distributing an adhesive layer on active areas, splitting the semiconductor wafer into a plurality of first dies, each one comprising at least one of the active areas; mounting the plurality of first dies, which are already equipped with the adhesive layer, on a support; and mounting a plurality of second dies on the adhesive layer. A stacked semiconductor device is also described, which comprises a first die mounted on a support, an intermediate adhesive layer and a second die mounted on the adhesive layer which is a polymeric layer.

Abstract: A process for the fabrication of devices that integrate protected microstructures, comprising the following steps: forming, in a body of semiconductor material, at least one microstructure having at least one first portion and one second portion which are relatively mobile with respect to one another and are separated from one another by at least one gap region, which is accessible through a face of the body; and sealing the gap. The sealing step includes depositing on the face of the body a layer of protective material, in such a way as to close the gap region, the protective layer being such as to enable relative motion between the first portion and the second portion of the microstructure.

Abstract: The present invention relates to leads of a No-Lead type package which includes a chip having an active surface and a rear surface opposite the active surface. The active surface has a plurality of connection points with a plurality of leads arranged around the perimeter of the chip and a first and a second surface orthogonal to said first surface. A plurality of connection wires connect electrically the bonding pads of the chip to the first surface of the leads respectively. The package also includes a welding compound suitable for encapsulating the chip, the first surface of the leads and the bonding pads. The leads possess at least one hole in the second surface of the leads.

Abstract: A method for forming by molding a plastic protective package for an electronic integrated circuit that includes an electronic device activated from the outside of said protective package. The method includes: dispensing a covering layer of elastic material on a portion of said electronic device; shaping said covering layer to form a projecting portion from a surface of said electronic device; molding said electronic integrated circuit in said plastic protective package using a mold including at least a half-mold abutting against said projecting portion; and obtaining a hole or a window formed in alignment with said projecting portion in said protective package.