Abstract: A spring clip for clamping a heat sink module to an electronic module. The heat sink module has a flat upper surface and a plurality of vertical cooling elements which extend upwardly from the upper surface of the heat sink module. The clip includes a central potion which engages the upper surface of the heat sink module and a pair of oppositely extending resilient end potions which are cantilevered from the central potion. A vertical leg portion is connected to the free end of each end portion of the clip and extends downwardly along one of the end surfaces of the electronic module. Each leg potion has an inwardly extending projection which has an upwardly facing edge surface for engaging a downwardly facing edge surface of the electronic module at one of the lower corners of the electronic module upon downward bending of the end potion so that the projection is biased upwardly against the lower corner of the electronic module due to the resiliency of the end potion.