Patents by Inventor Giriraj Mantrawadi
Giriraj Mantrawadi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230403038Abstract: Methods, systems, and apparatus for using antennas for millimeter wave contactless communication. One of the apparatuses is a communication device that includes a transducer configured to convert electrical signals into extremely high frequency (EHF) electromagnetic signals, the EHF electromagnetic signals substantially emitted from a first surface of the communication device, wherein the transducer is positioned on a substrate of the communication device, and an integrated circuit coupled to the substrate, wherein the transducer includes multiple parallel resonant antenna elements in an array.Type: ApplicationFiled: August 28, 2023Publication date: December 14, 2023Inventors: Giriraj Mantrawadi, Bojana Zivanovic, Wen-Chi Cheng
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Publication number: 20230403037Abstract: Methods, systems, and apparatus for using antennas for millimeter wave contactless communication. One of the apparatuses is a communication device that includes a transducer configured to convert electrical signals into extremely high frequency (EHF) electromagnetic signals, the EHF electromagnetic signals substantially emitted from a first surface of the communication device, wherein the transducer is positioned on a substrate of the communication device, and an integrated circuit coupled to the substrate, wherein the transducer includes multiple parallel resonant antenna elements in an array.Type: ApplicationFiled: August 28, 2023Publication date: December 14, 2023Inventors: Giriraj Mantrawadi, Bojana Zivanovic, Wen-Chi Cheng
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Patent number: 11784670Abstract: Methods, systems, and apparatus for using antennas for millimeter wave contactless communication. One of the apparatuses is a communication device that includes a transducer configured to convert electrical signals into extremely high frequency (EHF) electromagnetic signals, the EHF electromagnetic signals substantially emitted from a first surface of the communication device, wherein the transducer is positioned on a substrate of the communication device, and an integrated circuit coupled to the substrate, wherein the transducer includes multiple parallel resonant antenna elements in an array.Type: GrantFiled: March 31, 2021Date of Patent: October 10, 2023Assignee: Molex, LLCInventors: Giriraj Mantrawadi, Bojana Zivanovic, Wen-Chi Cheng
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Publication number: 20220329271Abstract: Methods, systems, and apparatus for using antennas for millimeter wave contactless communication. One of the apparatuses is a communication device that includes a transducer configured to convert electrical signals into extremely high frequency (EHF) electromagnetic signals, the EHF electromagnetic signals substantially emitted from a first surface of the communication device, wherein the transducer is positioned on a substrate of the communication device, and an integrated circuit coupled to the substrate, wherein the transducer includes multiple parallel resonant antenna elements in an array.Type: ApplicationFiled: March 31, 2021Publication date: October 13, 2022Inventors: Giriraj Mantrawadi, Bojana Zivanovic, Wen-Chi Cheng
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Patent number: 10854989Abstract: Embodiments discussed herein refer to systems and structures for focusing dispersal of electromagnetic signals. Focusing of the electromagnetic signals is achieved by a reflective lens that is constructed from several extremely high frequency focusing layers. Each focusing layer can include an extremely high frequency focusing window that, collectively, define the geometry of a cavity backed reflective lens and its ability to focus electromagnetic signal dispersion.Type: GrantFiled: August 5, 2019Date of Patent: December 1, 2020Assignee: KEYSSA SYSTEMS, INC.Inventors: Dennis F. Rosenauer, Giriraj Mantrawadi
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Patent number: 10720689Abstract: Conduit structures for guiding extremely high frequency (EHF) signals are disclosed herein. The conduit structures can include EHF containment channels that define EHF signal pathways through which EHF signal energy is directed. The conduit structures can minimize or eliminate crosstalk among adjacent paths within a device and across devices. Launch structures that interface with waveguides are also disclosed herein. Launch structures can control the EHF interface impedance between a contactless communication unit and the waveguide. Waveguide structures discussed herein are designed to provide maximum bandwidth with minimal jitter over a desired distance.Type: GrantFiled: November 20, 2017Date of Patent: July 21, 2020Assignee: KEYSSA SYSTEMS, INC.Inventors: James Gill Shook, Stephan Lang, Alan Besel, Dennis F. Rosenauer, Giriraj Mantrawadi, Eric Sweetman, Bojana Zivanovic, Srikanth Gondi
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Publication number: 20200036100Abstract: Embodiments discussed herein refer to systems and structures for focusing dispersal of electromagnetic signals. Focusing of the electromagnetic signals is achieved by a reflective lens that is constructed from several extremely high frequency focusing layers. Each focusing layer can include an extremely high frequency focusing window that, collectively, define the geometry of a cavity backed reflective lens and its ability to focus electromagnetic signal dispersion.Type: ApplicationFiled: August 5, 2019Publication date: January 30, 2020Inventors: Dennis F. Rosenauer, Giriraj Mantrawadi
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Publication number: 20190356395Abstract: Systems and apparatus for electromagnetic communications are provided. One of the apparatuses include a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; a plurality of signal guiding structures, each signal guiding structure being associated with a corresponding integrated circuit package of the plurality of integrated circuit packages; and one or more signal blocking structures positioned between one or more pairs of integrated circuit packages.Type: ApplicationFiled: July 29, 2019Publication date: November 21, 2019Applicant: Keyssa Systems, Inc.Inventors: Giriraj Mantrawadi, Dennis F. Rosenauer, Ian A. Kyles, Eric Sweetman, Roger D. Issac, Stephan Lang
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Patent number: 10403586Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.Type: GrantFiled: February 5, 2018Date of Patent: September 3, 2019Assignee: Keyssa Systems, Inc.Inventors: Mostafa Naguib Abdulla, Mohamed Sameh Mahmoud, Alan Besel, Eric Sweetman, Bojana Zivanoic, Giriraj Mantrawadi
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Patent number: 10389454Abstract: Systems and apparatus for electromagnetic communications are provided. One of the apparatuses include a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; a plurality of signal guiding structures, each signal guiding structure being associated with a corresponding integrated circuit package of the plurality of integrated circuit packages; and one or more signal blocking structures positioned between one or more pairs of integrated circuit packages.Type: GrantFiled: December 14, 2015Date of Patent: August 20, 2019Assignee: Keyssa Systems, Inc.Inventors: Giriraj Mantrawadi, Dennis F. Rosenauer, Ian A. Kyles, Eric Sweetman, Roger D. Isaac, Stephan Lang
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Patent number: 10374320Abstract: Embodiments discussed herein refer to systems and structures for focusing dispersal of electromagnetic signals. Focusing of the electromagnetic signals is achieved by a reflective lens that is constructed from several extremely high frequency focusing layers. Each focusing layer can include an extremely high frequency focusing window that, collectively, define the geometry of a cavity backed reflective lens and its ability to focus electromagnetic signal dispersion.Type: GrantFiled: July 11, 2016Date of Patent: August 6, 2019Assignee: KEYSSA SYSTEMS, INC.Inventors: Dennis F. Rosenauer, Giriraj Mantrawadi
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Publication number: 20190157738Abstract: Conduit structures for guiding extremely high frequency (EHF) signals are disclosed herein. The conduit structures can include EHF containment channels that define EHF signal pathways through which EHF signal energy is directed. The conduit structures can minimize or eliminate crosstalk among adjacent paths within a device and across devices. Launch structures that interface with waveguides are also disclosed herein. Launch structures can control the EHF interface impedance between a contactless communication unit and the waveguide. Waveguide structures discussed herein are designed to provide maximum bandwidth with minimal jitter over a desired distance.Type: ApplicationFiled: November 20, 2017Publication date: May 23, 2019Inventors: James Gill Shook, Stephan Lang, Alan Besel, Dennis F. Rosenauer, Giriraj Mantrawadi, Eric Sweetman, Bojana Zivanovic, Srikanth Gondi
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Publication number: 20180182723Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.Type: ApplicationFiled: February 5, 2018Publication date: June 28, 2018Inventors: Mostafa Naguib Abdulla, Mohamed Sameh Mahmoud, Alan Besel, Eric Sweetman, Bojana Zivanoic, Giriraj Mantrawadi
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Patent number: 9887169Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.Type: GrantFiled: March 11, 2016Date of Patent: February 6, 2018Assignee: Keyssa Systems, Inc.Inventors: Mostafa Naguib Abdulla, Mohamed Sameh Mahmoud, Alan Besel, Eric Sweetman, Bojana Zivanoic, Giriraj Mantrawadi
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Publication number: 20180013205Abstract: Embodiments discussed herein refer to systems and structures for focusing dispersal of electromagnetic signals. Focusing of the electromagnetic signals is achieved by a reflective lens that is constructed from several extremely high frequency focusing layers. Each focusing layer can include an extremely high frequency focusing window that, collectively, define the geometry of a cavity backed reflective lens and its ability to focus electromagnetic signal dispersion.Type: ApplicationFiled: July 11, 2016Publication date: January 11, 2018Inventors: Dennis F. Rosenauer, Giriraj Mantrawadi
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Publication number: 20170263576Abstract: Methods, systems, and apparatus for EM isolation structures. One of the apparatus includes a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; and one or more metallic blocking structures configured to at least partially encircle a corresponding one of the plurality of integrated circuit packages, wherein each metallic blocking structure is configured to reduce signal leakage from the corresponding integrated circuit package.Type: ApplicationFiled: March 11, 2016Publication date: September 14, 2017Applicant: Keyssa Systems, Inc.Inventors: Mostafa Naguib Abdulla, Mohamed Sameh Mahmoud, Alan Besel, Eric Sweetman, Bojana Zivanoic, Giriraj Mantrawadi
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Publication number: 20170170913Abstract: Systems and apparatus for electromagnetic communications are provided. One of the apparatuses include a communication module, the communication module including: a printed circuit board; a plurality of integrated circuit packages, each integrated circuit package including at least one transmitter, receiver, or transceiver; a plurality of signal guiding structures, each signal guiding structure being associated with a corresponding integrated circuit package of the plurality of integrated circuit packages; and one or more signal blocking structures positioned between one or more pairs of integrated circuit packages.Type: ApplicationFiled: December 14, 2015Publication date: June 15, 2017Applicant: Keyssa Systems, Inc.Inventors: Giriraj Mantrawadi, Dennis F. Rosenauer, Ian A. Kyles, Eric Sweetman, Roger D. Isaac, Stephan Lang