Patents by Inventor Girish Bohra

Girish Bohra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing integrated circuit with smaller grains of tungsten
    Patent number: 9230863
    Abstract: Integrated circuits with tungsten components having a smooth surface and methods for producing such integrated circuits are provided. A method of producing the integrated circuits includes forming a nucleation layer overlying a substrate and within a cavity, where the nucleation layer includes tungsten. A nucleation layer thickness is reduced, and a fill layer if formed overlying the nucleation layer.
    Type: Grant
    Filed: February 11, 2014
    Date of Patent: January 5, 2016
    Assignee: GLOBALFOUNDRIES, INC.
    Inventors: Jialin Yu, Huang Liu, Jilin Xia, Girish Bohra
  • INTEGRATED CIRCUITS WITH A TUNGSTEN COMPONENT AND METHODS FOR PRODUCING SUCH INTEGRATED CIRCUITS
    Publication number: 20150228543
    Abstract: Integrated circuits with tungsten components having a smooth surface and methods for producing such integrated circuits are provided. A method of producing the integrated circuits includes forming a nucleation layer overlying a substrate and within a cavity, where the nucleation layer includes tungsten. A nucleation layer thickness is reduced, and a fill layer if formed overlying the nucleation layer.
    Type: Application
    Filed: February 11, 2014
    Publication date: August 13, 2015
    Applicant: GLOBALFOUNDRIES, Inc.
    Inventors: Jialin Yu, Huang Liu, Jilin Xia, Girish Bohra