Patents by Inventor Girish Upadhaya

Girish Upadhaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
    Patent number: 7836597
    Abstract: An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
    Type: Grant
    Filed: January 6, 2006
    Date of Patent: November 23, 2010
    Assignee: Cooligy Inc.
    Inventors: Madhav Datta, Mark McMaster, Rick Brewer, Peng Zhou, Paul Tsao, Girish Upadhaya, Mark Munch
  • Fabrication of high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systems
    Publication number: 20080210405
    Abstract: An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
    Type: Application
    Filed: January 6, 2006
    Publication date: September 4, 2008
    Inventors: Madhav Datta, Mark McMaster, Rick Brewer, Peng Zhou, Paul Tsao, Girish Upadhaya, Mark Munch