Abstract: The invention relates to a high resolution full material Fresnel Zone Plate array comprising a plurality of full material Fresnel Zone Plates on a common carrier, a method for producing a full material Fresnel Zone Plate precursor array by providing a common carrier comprising a plurality of micro-pillars and deposition of alternating layers of at least two different materials onto at least some of the micro-pillars and an apparatus for producing high resolution full material Fresnel Zone Plate (FZP) arrays. The apparatus for producing a full material Fresnel Zone Plate arrays, comprises a first device for providing a plurality of micro-pillars in a common carrier, a deposition device which applies alternating layers of at least two different materials onto at least some of the micro-pillars arranged on the common carrier and a slicing device which slices a full material Fresnel Zone Plate out of a pillar.

Abstract: The present invention is directed to a method for printing a micro-scaled or nano-scaled XUV and/or X-ray Diffractive optic (1), including the following steps: a) providing a material (2) with a first component (2a) being photo-sensitive and being polymerizable by two-photon-absorption, b) providing data (3) of a desired geometrical structure (4) of the optic (1) and creating at least one trajectory (8) corresponding to the data (3) of the desired structure (4) of the optic (1), c) providing a high-intensity energy beam (5), in particular a laser beam, wherein the beam (5) comprises a focus (F) having a position being adjustable to a plurality of positions (F1, F2, <, Fp) being coincident with the at least one trajectory (8), d) polymerization of the material (2) by two-photon-absorption at a first position (Fn) of the focus (F), thereby creating a first voxel (vn1n2n3) of the structure (4) of the optic (1), adjusting the position of the focus (F) from the first position (Fn) to a subsequent position (Fn+1

Abstract: The invention concerns to a method of producing a Fresnel Zone Plate (1) for applications in high energy radiation including the following steps: supply of a substrate (2) transparent for high energy radiation, deposition of a layer (3) of a metal, a metal alloy or a metal compound on a planar surface (4) of the substrate (2), calculating a three dimensional geometrical profile (5) with a mathematical model, setting up a dosage profile (6) for an ion beam of the ion beam lithography inverse to the calculated three dimensional geometrical profile (5) and milling a three dimensional geometrical profile (5) with concentric zones into the layer (3) with ion beam lithography by means of focused ion beam.

Abstract: A method of producing a Fresnel zone plate (15) comprising: making available a substrate (1, 4, 7) which is rotationally symmetrical with respect to its center axis (1a, 4a, 7a); applying layers (2a-d; 5a-d; 8a-d; 11) following in succession by means of an atomic layer deposition (ALD) method to faces (1b-c; 4b-c; 7b-c) of the substrate (1, 4, 7) without rotation of the substrate (1, 4, 7) in order to form a coated substrate, and severing (3a, b; 6a, b; 9a, b) at least one slice (13) from the coated substrate (1, 4, 7), by the coated substrate (1, 4, 7) being divided at least once at a right angle to the center axis (1a, 4a, 7a).

Abstract: The invention concerns to a method of producing a Fresnel Zone Plate (1) for applications in high energy radiation including the following steps: supply of a substrate (2) transparent for high energy radiation, deposition of a layer (3) of a metal, a metal alloy or a metal compound on a planar surface (4) of the substrate (2), calculating a three dimensional geometrical profile (5) with a mathematical model, setting up a dosage profile (6) for an ion beam of the ion beam lithography inverse to the calculated three dimensional geometrical profile (5) and milling a three dimensional geometrical profile (5) with concentric zones into the layer (3) with ion beam lithography by means of focused ion beam.

Abstract: A method of producing a Fresnel zone plate (15) comprising: making available a substrate (1, 4, 7) which is rotationally symmetrical with respect to its centre axis (1a, 4a, 7a); applying layers (2a-d; 5a-d; 8a-d; 11) following in succession by means of an atomic layer deposition (ALD) method to faces (1b-c; 4b-c; 7b-c) of the substrate (1, 4, 7) without rotation of the substrate (1, 4, 7) in order to form a coated substrate, and severing (3a, b; 6a, b; 9a, b) at least one slice (13) from the coated substrate (1, 4, 7), by the coated substrate (1, 4, 7) being divided at least once at a right angle to the centre axis (1a, 4a, 7a).