Abstract: The present application describes a through-hole component insulator and assembly process which has the advantages of preventing solder from contacting the metal case of a through-hole component without an addition step or additional material from the standard fabrication process for a printed circuit board. The printed circuit board of the present invention includes a printed ink spacer disposed beneath the through-hole component wherein the printed ink spacer is included with a standard silk-screen artwork layer in the printed circuit board design stage. The printed ink spacer raises the through-hole component from the printed circuit board surface to prevent solder from contacting the metal case of the through-hole component during the printed circuit board soldering stage. Using a silk-screen artwork layer which includes at least one printed ink spacer in the artwork, the printed ink spacer is deposited during deposition of a standard printed design on the printed circuit board fabrication.

Abstract: A printed circuit board ground clip is provided having upwardly extending retainers and downwardly extending legs. The legs are designed to insert within plated-through holes of a variable thickness printed circuit board. The upwardly extending retainers terminate as a spaced pair of flanges which frictionally receive and electrically couple with a hook. The hook extends from the chassis of an electronic device, through a slot within the printed circuit board and between the spaced flanges. Accordingly, the hook and ground clip form an electrical conduit between a ground supply connected to the electronic device chassis and a ground conductor formed within the printed circuit board. Chassis-to-ground conductor attachment is performed during assembly of the board to the chassis backplane. Attachment can be quickly and easily reversed to allow board re-work, without requiring placement of heat upon the board.