Abstract: A polymer laminate includes a plurality of ultra-high molecular weight polyethylene thin films, where each polyethylene thin film has an in-plane thermal conductivity of at least approximately 5 W/mK and an in-plane elastic modulus of at least approximately 20 GPa. The polymer laminate may be incorporated into an eyewear device and may be configured to disperse heat during operation thereof in a manner effective to improve the functionality and/or wearability of the device.

Abstract: A device includes a micro-organic light emitting diode (µ-OLED) display panel and an electronic component. An electrical connector electrically couples the µ-OLED display panel and the electronic component. An air duct is physically coupled to the µ-OLED display panel and the electronic component. The air duct functions to cool the µ-OLED display panel when air flows through the air duct. A system fan provides air flow to the air duct and dissipates heat away from the display panel. A system fan can be located disconnected from the µ-OLED display panel and can provide air flow to the air duct to dissipate heat away from the display panel. The device can be implemented with a single fan solution or a multiple fan solution (e.g., two or more fans).

Abstract: A device includes a micro-organic light emitting diode (µ-OLED) display panel and an electronic component. An electrical connector electrically couples the µ-OLED display panel and the electronic component. A standoff is disposed between the electronic component and the µ-OLED display panel. The standoff physically couples the electronic component and the µ-OLED display panel with a gap therebetween. The gap thermally decouples the electronic component from the µ-OLED display panel. A fan that is integrated with the µ-OLED display panel is placed in the standoff and actively cools the display panel. When the fan provides air flow over the µ-OLED display panel, heat generated by the µ-OLED display is mitigated by cooling air.

Abstract: A device includes a micro-organic light emitting diode (?-OLED) display panel and an electronic component. An electrical connector electrically couples the ?-OLED display panel and the electronic component. A standoff is disposed between the electronic component and the ?-OLED display panel. The standoff physically couples the electronic component and the ?-OLED display panel with a gap therebetween. The gap thermally decouples the electronic component from the ?-OLED display panel. A U-shaped heat sink can be disposed in the standoff, and heat generated by the ?-OLED display can be mitigated by a system fan when a U-shaped heat sink is disposed in the standoff.

Abstract: A system and method for maintaining a temperature of a power system using a cooling system that includes an impeller and a phase change material. During normal operation of the cooling system, heat that is generated by the operation of an electronic device(s) of the power system can be transferred primarily by conduction through an upper base plate and fins of a heat sink, and dissipated via forced convection that is generated by the impeller. Additionally, the phase change material is positioned outside of a main heat flux path of the heat sink such that, during normal operation of the cooling system, the phase change material does not provide a heat flux obstruction. In the event of an impeller failure, the phase change material provides at least a temporary cooling source for an extended period of time via the relatively large latent heat capacity of the phase change material.

Abstract: The invention is concerned with a cooling arrangement for a high voltage power device in an enclosure and immersed in an insulating fluid. The arrangement includes a cooling device for placing in the interior of the enclosure and having a channel formed as a duct for the insulating fluid the duct having a first wall including a phase change material for cooling insulating fluid that passes through the channel. The invention is also concerned with a method of operating a valve of a cooling device in such a cooling arrangement.

Abstract: A system and method for maintaining a temperature of a power system using a cooling system that includes an impeller and a phase change material. During normal operation of the cooling system, heat that is generated by the operation of an electronic device(s) of the power system can be transferred primarily by conduction through an upper base plate and fins of a heat sink, and dissipated via forced convection that is generated by the impeller. Additionally, the phase change material is positioned outside of a main heat flux path of the heat sink such that, during normal operation of the cooling system, the phase change material does not provide a heat flux obstruction. In the event of an impeller failure, the phase change material provides at least a temporary cooling source for an extended period of time via the relatively large latent heat capacity of the phase change material.

Abstract: A pressure plate for a friction coupling such as a clutch or brake system includes one or more pockets with a phase change material disposed therein. The phase change material operates to absorb and release heat when the friction coupling cycles between activation and deactivation so as to minimize a maximum temperature of the pressure plate.

Abstract: A pressure plate for a friction coupling such as a clutch or brake system is disclosed in the present application. The pressure plate includes one or more pockets with a phase change material disposed therein. The phase change material operates to absorb and release heat when the friction coupling cycles between activation and deactivation so as to minimize a maximum temperature of the pressure plate.