Abstract: A method for the immersion application of solder to printed wiring boards, including the steps of producing a printed wiring board with electrically conductive regions, which are to be provided with a solder deposit, surrounding the regions with a limiting layer of defined layer thickness for preventing an application of solder, which thickness substantially corresponds to the height of the solder deposit to be produced thus forming voids, immersing the thus-prepared printing wiring board into a soldering bath containing a suitable soldering alloy, covering the voids, filled in the soldering bath with liquid solder and located above the regions to which solder is to be appled, with at least one closure element at a defined contact pressure, removing the covered printed wiring board from the soldering bath, dropping the temperature of the solder trapped in the voids below the setting temperature of the solder alloy, removing the closure element, and optionally, removing the limiting layer.