Abstract: A bobbin assembly for a soldering/desoldering device may be readily produced by utilization of a heater assembly comprising an electrically insulating tape having an etched foil heater in the form of serpentine comprising a plurality of coextensive side by side parallel leg portions bonded to one side thereof. The bobbin assembly is formed by wrapping the heater assembly about a cylindrical bobbin with the heater leg portions parallel to the bobbin axis so as to form a first insulating layer in contact with the bobbin, a layer comprising the heater in contact with the first layer and a second insulating layer in contact with the heater. A wire is then wound about the entire assembly, in a helical manner, to hold all elements in place. Additionally, a dissimilar metal lead may be spot welded to the bobbin to form a thermocouple junction used for sensing the bobbin assembly temperature.