Abstract: It is described a contact probe for a testing head of an apparatus for testing electronic devices including a body essentially extended along a longitudinal direction between a contact tip and a contact head, that contact probe comprising at least one multilayer structure, in turn including a superposition of at least one inner layer or core and a first inner coating layer, and an outer coating layer that completely covers the multilayer structure and made of a material having a higher hardness than a material realizing the core.

Abstract: A probe card for a testing apparatus of electronic devices comprises at least one testing head which houses a plurality of contact probes, each contact probe having at least one contact tip suitable to abut onto contact pads of a device under test, and a support plate of the testing head associated with a stiffener and an intermediate support, connected to the support plate and suitable to provide a spatial transformation of the distances between contact pads made on opposite sides thereof. Conveniently, the probe card comprises a support which is joined to the intermediate support, which is made of a material compatible with the printed circuit board technologies and has a coefficient of thermal expansion greater than 10×10?6° C.?1, the support being made of a metal material having a coefficient of thermal expansion lower than 6×10?6° C.?1.

Abstract: A manufacturing method of a semi-finished product that includes a plurality of contact for a testing head of electronic devices comprises the steps of: providing a substrate made of a conductive material; and defining each contact probe by removing material from the substrate, each contact probes being anchored to the substrate by at least one bridge of material. The step of defining the contact probes includes a step of laser cutting, in correspondence with a contour of the contact probes and of that at least one bridge of material.

Abstract: A contact probe of a testing head of a testing apparatus of electronic devices comprises respective end portions adapted to contact respective contact pads and a body essentially extended in a longitudinal direction between the end portions, at least one end portion comprising an insert made of a first conductive material having a hardness being greater than a second conductive material making the contact probe which is supported by a section of the end portion, the section being made of the second conductive material and being shaped in a complementary way with respect to the insert and having respective abutting surfaces facing and adhering to respective abutting surfaces of the insert.

Abstract: It is described a contact probe for a testing head of an apparatus for testing electronic devices including a body essentially extended along a longitudinal direction between a contact tip and a contact head, that contact probe comprising at least one multilayer structure, in turn including a superposition of at least one inner layer or core and a first inner coating layer, and an outer coating layer that completely covers the multilayer structure and made of a material having a higher hardness than a material realizing the core.

Abstract: A manufacturing method of a semi-finished product that includes a plurality of contact for a testing head of electronic devices comprises the steps of: providing a substrate made of a conductive material; and defining each contact probe by removing material from the substrate, each contact probes being anchored to the substrate by at least one bridge of material. The step of defining the contact probes includes a step of laser cutting, in correspondence with a contour of the contact probes and of that at least one bridge of material.

Abstract: A contact probe of a testing head of a testing apparatus of electronic devices comprises respective end portions adapted to contact respective contact pads and a body essentially extended in a longitudinal direction between the end portions, at least one end portion comprising an insert made of a first conductive material having a hardness being greater than a second conductive material making the contact probe which is supported by a section of the end portion, the section being made of the second conductive material and being shaped in a complementary way with respect to the insert and having respective abutting surfaces facing and adhering to respective abutting surfaces of the insert.

Abstract: A contact probe of a testing head of a testing apparatus of electronic devices comprises respective end portions adapted to contact respective contact pads and a body essentially extended in a longitudinal direction between the end portions, at least one end portion comprising an insert made of a first conductive material having a hardness being greater than a second conductive material making the contact probe which is supported by a section of the end portion, the section being made of the second conductive material and being shaped in a complementary way with respect to the insert and having respective abutting surfaces facing and adhering to respective abutting surfaces of the insert.

Abstract: A probe card for a testing apparatus of electronic devices comprises at least one testing head which houses a plurality of contact probes, each contact probe having at least one contact tip suitable to abut onto contact pads of a device under test, and a support plate of the testing head associated with a stiffener and an intermediate support, connected to the support plate and suitable to provide a spatial transformation of the distances between contact pads made on opposite sides thereof. Conveniently, the probe card comprises a support which is joined to the intermediate support, which is made of a material compatible with the printed circuit board technologies and has a coefficient of thermal expansion greater than 10×10?6° C.?1, the support being made of a metal material having a coefficient of thermal expansion lower than 6×10?6° C.?1.

Abstract: A contact probe for a testing head is presented. The contact probe for a testing head has a plurality of these probes which are inserted in guide holes realized in respective dies, the probe comprising a rod-shaped body equipped at an end with at least a contact tip effective to ensure the mechanical and electrical contact with a corresponding contact pad of an integrated electronic device to be tested. The rod-shaped body has a nonuniform cross section.

Abstract: A contact probe for a testing head effective to test a plurality of semiconductor-integrated electronic devices comprises a rod-like probe body having a cross section of prefixed contour and provided in correspondence with at least one end with an eccentric contact tip. The contact tip is positioned within the contour of the cross section of the probe body.

Abstract: A contact probe for a testing head effective to test a plurality of semiconductor-integrated electronic devices comprises a rod-like probe body having a cross section of prefixed contour and provided in correspondence with at least one end with an eccentric contact tip. The contact tip is positioned within the contour of the cross section of the probe body.

Abstract: A contact probe for a testing head is presented. The contact probe for a testing head has a plurality of these probes which are inserted in guide holes realized in respective dies, the probe comprising a rod-shaped body equipped at an end with at least a contact tip effective to ensure the mechanical and electrical contact with a corresponding contact pad of an integrated electronic device to be tested. The rod-shaped body has a nonuniform cross section.

Abstract: A testing head having vertical probes is presented. The testing head a first and a second plate-like holder provided with respective guide holes, a contact probe adapted to be received in the guide holes and having a contact tip adapted to establish mechanical and electrical contact to a corresponding contact pad of an integrated electronic device to be tested, the contact probe being deformed in a deflection region located between the plate-like holders as the contact tip abuts onto the contact pad. The contact probe further comprises a rigid arm extending laterally from a body of the contact probe and terminating in the contact tip, the rigid arm being adapted to offset the contact point of the contact probe with the corresponding contact pad with respect to a longitudinal axis of the contact probe.

Abstract: A testing head having cantilever probes is presented. The testing head, comprises a backing ring and a resin holder attached to the backing ring, as well as a plurality of contact probes held by the resin holder and formed with respective contact tips arranged to mechanically and electrically contact a plurality of contact pads of at least one device to be tested. The holder is formed with at least one suitably shaped outline to allow different probe rows to emerge in a cantilever manner.

Abstract: A contact probe for a testing head is described. The probe has at least a pointed rod-shaped body having a crook-shaped section capable to contact mechanically and electrically at least one contact pad of an electronic device to be tested and defined form an elbow point on the rod-shaped body. The rod-shaped body comprises at least one additional elbow point spaced form the elbow point and defining a concave angle in the rod-shaped body.

Abstract: A testing head for microstructures is presented. The testing head includes a top guide plate and bottom guide plate, separated by an air gap. Each of the plates include respective guide holes for accommodating a contact probe having a contact tip that is arranged to mechanically and electrically contact a contact pads on a device under test. The contacting tip of the testing head has a non-zero pitch angle (&agr;OUT) relative to the contact pad, and “scrubs” the pad as the device under test is drawn against the contacting tip, causing the contact probe to bend within the air gap.

Abstract: A testing head having vertical probes is presented. The testing head a first and a second plate-like holder provided with respective guide holes, a contact probe adapted to be received in the guide holes and having a contact tip adapted to establish mechanical and electrical contact to a corresponding contact pad of an integrated electronic device to be tested, the contact probe being deformed in a deflection region located between the plate-like holders as the contact tip abuts onto the contact pad. The contact probe further comprises a rigid arm extending laterally from a body of the contact probe and terminating in the contact tip, the rigid arm being adapted to offset the contact point of the contact probe with the corresponding contact pad with respect to a longitudinal axis of the contact probe.

Abstract: A testing head having vertical probes is presented. The testing head comprises a guide plate having a guide hole formed therethrough, for accommodating a contact probe having a contact tip that is arranged to mechanically and electrically contact a contact pads on a device under test. The contact probe has a pre-deformed section placed in a flexion region between the guide plate and the test device, arranged to further deform as the contact pad of the test device is drawn against the contacting tip.

Abstract: A testing head having cantilever probes is presented. The testing head, comprises a backing ring and a resin holder attached to the backing ring, as well as a plurality of contact probes held by the resin holder and formed with respective contact tips arranged to mechanically and electrically contact a plurality of contact pads of at least one device to be tested. The holder is formed with at least one suitably shaped outline to allow different probe rows to emerge in a cantilever manner.