Abstract: An improved leadframe structure and an improved IC package and process using such structure are disclosed. The improved leadframe structure eliminates the dambar commonly found on leadframes for use in plastic packages. A polymer structure is formed and employed primarily to act as a barrier to flashing during the epoxy encapsulation process and secondarily to provide support for the leads. The polymer structure remains a permanent part of the IC package following molding. An improved IC packaging process using the improved leadframe design eliminates common debar, dejunk and deflash operations, resulting in reduced capital costs and higher yields.

Abstract: An analytical system for determining whether separator materials should function satisfactorily in the alkaline environment of a secondary alkaline system comprises determining the rate at which zinc diffusion is occurring as well as whether or not the separator material is serving as a complete barrier. The overall analytical sequence also includes determining the following characteristics of the separator material: (1) freedom from either defects in the film or pores with larger than acceptable sizes, (2) suitability of the porosity, (3) satisfactory electrolyte transport, and (4) satisfactory resistance to chemical attack in the operating environment of the cell or battery system.