Abstract: The present invention relates to method to improve RF measurements accuracy on an automatic testing equipment (ATE) for IC wafers by implementing a test board de-embedding phase, wherein each wafer includes a device under test located on a wafer die plane and being contacted by probecard needles of a probecard that is coupled to a configuration board through a probe interface board (PIB), the method including the following phases: performing an automatic calibration phase of the testing equipment up to an internal plane located inside the automatic testing equipment; performing a calibration plane transfer up to a plane of the configuration board using a predetermined number of calibration standard loads realized on the wafer; performing a test boards de-embedding phase up to the wafer die plane.

Abstract: A method is provided for testing an integrated circuit in an automatic test environment. According to the method, the automatic test environment is set up, and there is performed a repetitive measurement of at least one electrical quantity representative of an integrated circuit response to a set of prescribed integrated circuit test conditions. The automatic test environment is reset, and the integrated circuit test conditions are changed in synchrony with a synchronization signal having a prescribed periodicity, so that all of the measurements are allotted a time slot of the same length. Also provided is an automatic test equipment apparatus that includes a synchronization generator for supplying a synchronization signal having a prescribed periodicity to means for putting the integrated circuit in a set test condition. The means changes the set test condition in synchrony with the synchronization signal, so that all of the measurements are allotted a time slot of the same length.

Abstract: A method is provided for testing an integrated circuit in an automatic test environment. According to the method, the automatic test environment is set up, and there is performed a repetitive measurement of at least one electrical quantity representative of an integrated circuit response to a set of prescribed integrated circuit test conditions. The automatic test environment is reset, and the integrated circuit test conditions are changed in synchrony with a synchronization signal having a prescribed periodicity, so that all of the measurements are allotted a time slot of the same length. Also provided is an automatic test equipment apparatus for testing an integrated circuit. The apparatus includes a synchronization generator for supplying a synchronization signal having a prescribed periodicity to means for putting the integrated circuit in a set test condition. The means changes the set test condition in synchrony with the synchronization signal.

Abstract: The present invention relates to method to improve RF measurements accuracy on an automatic testing equipment (ATE) for IC wafers by implementing a test board de-embedding phase, wherein each wafer includes a device under test located on a wafer die plane and being contacted by probecard needles of a probecard that is coupled to a configuration board through a probe interface board (PIB), the method including the following phases: performing an automatic calibration phase of the testing equipment up to an internal plane located inside the automatic testing equipment; performing a calibration plane transfer up to a plane of the configuration board using a predetermined number of calibration standard loads realized on the wafer; performing a test boards de-embedding phase up to the wafer die plane.