Patents by Inventor Giuseppe Luigi Malgioglio

Giuseppe Luigi Malgioglio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing of a heat sink by wave soldering
    Patent number: 9615444
    Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder is applied to the second surface. The solder penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to join a thermal radiator and/or electronic contact of the electronic device to the vias. The solder further remains in the cavity to form a corresponding heat sink.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: April 4, 2017
    Assignee: STMicroelectronics S.r.l.
    Inventors: Cristiano Gianluca Stella, Giuseppe Luigi Malgioglio, Rosalba Cacciola
  • MANUFACTURING OF A HEAT SINK BY WAVE SOLDERING
    Publication number: 20160081179
    Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink.
    Type: Application
    Filed: November 24, 2015
    Publication date: March 17, 2016
    Applicant: STMicroelectronics S.r.l.
    Inventors: Cristiano Gianluca Stella, Giuseppe Luigi Malgioglio, Rosalba Cacciola
  • Manufacturing of a heat sink by wave soldering
    Patent number: 9237644
    Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink.
    Type: Grant
    Filed: March 26, 2014
    Date of Patent: January 12, 2016
    Assignee: STMicroelectronics S.r.l.
    Inventors: Cristiano Gianluca Stella, Rosalba Cacciola, Giuseppe Luigi Malgioglio
  • MANUFACTURING OF A HEAT SINK BY WAVE SOLDERING
    Publication number: 20140301042
    Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink.
    Type: Application
    Filed: March 26, 2014
    Publication date: October 9, 2014
    Applicant: STMicroelectronics S.r.l.
    Inventors: Cristiano Gianluca Stella, Rosalba Cacciola, Giuseppe Luigi Malgioglio