Patents by Inventor Giuseppe Marchisi
Giuseppe Marchisi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6002173Abstract: A structure is disclosed which comprises a metal plate, a chip of a semiconductor material attached to the plate, terminal leads, interconnection wires between the leads and the metallized regions of the chip, and a polymer body encapsulating all this with the exception of a surface of the plate and part of the leads. To achieve improved bond between the polymer and the metal, predetermined areas of the plate and the leads have a higher roughness than 1 (R.sub.a .gtoreq.1 .mu.m).Type: GrantFiled: December 21, 1992Date of Patent: December 14, 1999Assignee: SGS-Thomson Microelectronics S.r.l.Inventors: Paolo Casati, Pierangelo Magni, Giuseppe Marchisi
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Patent number: 5763296Abstract: A process for making an electronic device structure which comprises a metal plate, a semiconductor material chip attached to the plate, terminal leads, interconnection wires between the leads and metallized regions of the chip, and a plastic body which encapsulates the whole with the exception of a surface of the plate and part of the leads. This structure has means of electrical connection between at least one metallized region and the metal plate which comprise at least one metal beam resting onto the plate and being attached thereto by studs integral with the plate, and at least one wire welded between a metallized region of the chip and the metal beam between the studs. At least a portion of the beam and its connection wire are encapsulated within the plastics body.Type: GrantFiled: August 12, 1994Date of Patent: June 9, 1998Assignee: SGS-Thomson Microelectronics S.r.l.Inventors: Paolo Casati, Marziano Corno, Giuseppe Marchisi
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Patent number: 5629574Abstract: A control interface device for an electric motor, particularly an electric motor for operating servomechanisms on a vehicle, which includes a conductor frame, an active integrated component mounted on the conductor frame, and a plurality of electric connectors. A single insulating, one-piece enclosing body contains the conductor frame with the active integrated component and the electric connectors included to the conductor frame. Thus, all of the elements required for powering and controlling the motor are gathered inside a single enclosing body which is convenient to handle and connect.Type: GrantFiled: June 30, 1993Date of Patent: May 13, 1997Assignee: SGS-Thomson Microelectronics, S.r.l.Inventors: Carlo Cognetti, Giuseppe Marchisi
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Patent number: 5521439Abstract: A combination of an electronic semiconductor device comprising a metal plate and a plastics body which encapsulates the metal plate leaving at least a major surface thereof exposed, a heat sink, and means of fastening the heat sink to the device. To enable securement of the heat sink on the device without any external fastening arrangement having to be used, and without unduly straining the solder spot of the device pins to a printed circuit, the device is provided with undercut regions on opposite sides adjacent to the exposed surface of the plate for releasable engagement by the fastening means.Type: GrantFiled: April 5, 1994Date of Patent: May 28, 1996Assignee: SGS-Microelectronics S.r.l.Inventors: Paolo Casati, Giuseppe Marchisi
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Patent number: 5370517Abstract: A die-stamped frame is fastened to a heat sink metal baseplate by wedging flexible tabs into receiving indentations of the baseplate while keeping the frame substantially in contact with the surface of the baseplate. The wire welding operations may then take place on the end of the fingers of the patterned metal frame while the same are solidly resting on the surface of the baseplate thus facilitating the welding. The backing-off of the metal frame from the surface of the heat sink baseplate takes place upon the closing of the mold used for encapsulating in resin the device. The injection of the resin and its solidification "freezes" the pins in the backed-off position imposed by the mold upon closing, thus ensuring the electrical isolation between the pins and the integral heat sink baseplate.Type: GrantFiled: April 9, 1993Date of Patent: December 6, 1994Assignee: SGS-Thomson Microelectronics s.r.l.Inventors: Paolo Casati, Carlo C. De Martiis, Giuseppe Marchisi
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Patent number: 5338971Abstract: An electronic device structure which comprises a metal plate, a semiconductor material chip attached to the plate, terminal leads, interconnection wires between the leads and metallized regions of the chip, and a plastic body which encapsulates the whole with the exception of a surface of the plate and part of the leads. This structure has highly reliable means of electrical connection between at least one metallized region and the metal plate which comprise at least one metal beam resting onto the plate and being attached thereto by studs integral with the plate, and at least one wire welded between a metallized region of the chip and the metal beam between the studs. At least a portion of the beam and its connection wire are encapsulated within the plastics body.Type: GrantFiled: November 27, 1992Date of Patent: August 16, 1994Assignee: SGS-Thomson Microelectronics, S.r.l.Inventors: Paolo Casati, Marziano Corno, Giuseppe Marchisi
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Patent number: 5244838Abstract: A die-stamped frame is fastened to a heat sink metal baseplate by wedging flexible tabs into receiving indentations of the baseplate while keeping the frame substantially in contact with the surface of the baseplate. The wire welding operations may then take place on the end of the fingers of the patterned metal frame while the same are solidly resting on the surface of the baseplate thus facilitating the welding. The backing-off of the metal frame from the surface of the heat sink baseplate takes place upon the closing of the mold used for encapsulating in resin the device. The injection of the resin and its solidification "freezes" the pins in the backed-off position imposed by the mold upon closing, thus ensuring the electrical isolation between the pins and the integral heat sink baseplate.Type: GrantFiled: October 31, 1991Date of Patent: September 14, 1993Assignee: SGS-Thomson Microelectronics S.r.l.Inventors: Paolo Casati, Carlo C. De Martiis, Giuseppe Marchisi
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Patent number: 5113240Abstract: An improved leadframe for packages of integrated power devices which, by virtue of its configuration, allows to press the dissipator on the bottom of the shell during the molding of the plastic case, without the dissipator having exposed portions of its inner face (which is in contact with the chip). In order to achieve this, the leadframe according to the invention comprises a monolithic body which defines a perimetric frame, the leads and the dissipator. The dissipator extends in a depressed plane with respect to the frame and is connected to the frame and to the leads in at least three step-like points which are mutually spaced and non-aligned. During the molding of the plastic case, a pressure is exerted on the frame and is transmitted to the dissipator by the three step-like points, so that the dissipator is effectively pressed flat against the bottom of the mold without using pushers which pass through the plastic case.Type: GrantFiled: February 19, 1991Date of Patent: May 12, 1992Assignee: SGS-Thomson Microelectronics S.r.l.Inventors: Pieramedeo Bozzini, Giuseppe Marchisi
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Patent number: 5102828Abstract: Two superimposed series of electric contacts in the shape of metal-sheet strips, electrically connected to a metallic place which supports a semiconductor chip, are electrically separated but mechanically connected by an interposed layer of adhesive material at high insulation. The whole is completely inserted in a covering of insulating material, which forms a flat support, from which, at opposite faces, only limited adjacent contact portions of said electric contacts emerge.The place and at least one of the two series of contacts make part of a single starting metallic frame, on which the other series of contacts is superimposed. This latter in its turn can make part of the same metallic frame and to be superimposed by refolding or can be prepared separately and then applied on the first series.Type: GrantFiled: April 20, 1989Date of Patent: April 7, 1992Assignee: SGS-Ates Componenti Elettronici S.p.A.Inventor: Giuseppe Marchisi
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Patent number: 5034350Abstract: A semiconductor device in a plastic or ceramic package contains at least one silicon die on each side of a central die pad of a single metal frame, thus allowing a substantial space saving on the printed circuit assembly card.The bonding of the silicon dies and the soldering of the connecting wires are performed on both sides of the frame by emplying a special slotted clamp fixture inside which a strip of frames is clamped during these assembly operations and relative quality control operations.Type: GrantFiled: March 14, 1990Date of Patent: July 23, 1991Assignee: SGS Thomson Microelectronics s.r.l.Inventor: Giuseppe Marchisi
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Patent number: 5034800Abstract: A hollow-type package of optically and non-optically active semiconductor devices is entirely made of moldable plastic material by utilizing a preformed box-like shell of a rigid plastic material for enclosing the semiconductor dye and the electrical connection wires before molding the shell in an epoxy resin. The protective shell is composed of two corresponding half parts and, in the case of optically active devices, the top half of the shell is provided with a window closed by a transparent pane which is sealed during the encapsulation. Preferably, the two halves of the protection shell have two spaced lateral walls forming two spaced sealing perimeters and a perimetral chamber which is formed therebetween and surrounds a central cavity of the shell for accommodating any encapsulating resin which may eventually enter through the outer sealing perimeter during molding. The central cavity of the shell may be filled with a nonrigid silicon resin before molding for further increasing the protection.Type: GrantFiled: June 15, 1989Date of Patent: July 23, 1991Assignee: SGS-Thomson Microelectronics s.r.l.Inventor: Giuseppe Marchisi
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Patent number: 5032894Abstract: Two superimposed series of electric contacts in the shape of metal-sheet strips, electrically connected to a metallic plate which supports a semiconductor chip, are electrically separated but mechanically connected by an interposed layer of insulating adhesive material. The whole is completely inserted in a covering of insulating material, which forms a flat support, from which, at opposite faces, only limited ajdacent contact portions of the electric contacts emerge.The place and at least one of the two series of contacts are part of a single starting metallic frame, on which the second series of contacts is superimposed. The latter series of contacts can be part of the same metallic frame as the first series in which case the device is formed by a folding operation. Alternatively the second series can be prepared separately and then applied on the first series.Type: GrantFiled: February 8, 1989Date of Patent: July 16, 1991Assignee: SGS-ATES Componenti Elettronici S.p.A.Inventor: Giuseppe Marchisi
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Patent number: 4711023Abstract: Method for making an insulating package premolded on a metallic frame with electrical contacts containing in an inner space a semiconductor chip which rests on a thermic dissipator and is connected to the electrical contacts. The inner space of the package is closed on top by a cover provided with a lateral extension with a bent end, which operates not only as a cover, but also as a means for fastening and thrusting the package toward a support surface.Type: GrantFiled: December 15, 1986Date of Patent: December 8, 1987Assignee: SGS-Antes Componenti Elettronici S.p.A.Inventors: Giuseppe Marchisi, Carlo Cognetti De Martiis
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Patent number: 4649460Abstract: An insulating package premolded on a metallic frame with electrical contacts contains in an inner space a semiconductor chip which rests on a thermic dissipator and is connected to the electrical contacts. The inner space of the package is closed on top by a cover provided with a lateral extension with a bent end, which operates not only as a cover, but also as a means for fastening and thrusting the package toward a support surface.Type: GrantFiled: February 13, 1985Date of Patent: March 10, 1987Assignee: SGS-ATES Compnenti Elettronici S.p.A.Inventors: Giuseppe Marchisi, Carlo C. De Martiis
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Patent number: 4467522Abstract: A metal mass serving as a heat disperser is placed in a die in which a number of plastic containers are to be die-cast at each outlet hole of the extractors in the die. The thrust surfaces of the extractors have a central depression and the dispersers have a projection matching the depression.Type: GrantFiled: April 12, 1982Date of Patent: August 28, 1984Inventor: Giuseppe Marchisi
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Patent number: RE37707Abstract: An improved leadframe for packages of integrated power devices which, by virtue of its configuration, allows to press the dissipator on the bottom of the shell during the molding of the plastic case, without the dissipator having exposed portions of its inner face (which is in contact with the chip). In order to achieve this, the leadframe according to the invention comprises a monolithic body which defines a perimetric frame, the leads and the dissipator. The dissipator extends in a depressed plane with respect to the frame and is connected to the frame and to the leads in at least three step-like points which are mutually spaced and non-aligned. During the molding of the plastic case, a pressure is exerted on the frame and is transmitted to the dissipator by the three step-like points, so that the dissipator is effectively pressed flat against the bottom of the mold without using pushers which pass through the plastic case.Type: GrantFiled: July 2, 1996Date of Patent: May 21, 2002Assignee: STMicroelectronics S.r.l.Inventors: Pieramedeo Bozzini, Giuseppe Marchisi
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Patent number: D264853Type: GrantFiled: December 3, 1979Date of Patent: June 8, 1982Assignee: SGS-Ates Componenti Elettronici S.P.A.Inventors: Mario Scavino, Giuseppe Marchisi