Patents by Inventor Giuseppe Selli
Giuseppe Selli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230275061Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: ApplicationFiled: May 8, 2023Publication date: August 31, 2023Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
-
Patent number: 11646290Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: GrantFiled: June 7, 2021Date of Patent: May 9, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
-
Publication number: 20220052016Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: ApplicationFiled: June 7, 2021Publication date: February 17, 2022Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
-
Patent number: 11031366Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: GrantFiled: June 10, 2019Date of Patent: June 8, 2021Assignee: Amkor Technology Singapore Pte. Ltd.Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
-
Publication number: 20190371760Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: ApplicationFiled: June 10, 2019Publication date: December 5, 2019Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
-
Patent number: 10424556Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: GrantFiled: August 15, 2016Date of Patent: September 24, 2019Assignee: Amkor Technology, Inc.Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
-
Publication number: 20160351525Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: ApplicationFiled: August 15, 2016Publication date: December 1, 2016Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
-
Patent number: 9433117Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: GrantFiled: May 18, 2012Date of Patent: August 30, 2016Assignee: AMKOR TECHNOLOGY, INC.Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly
-
Patent number: 8552517Abstract: In accordance with the present invention, there is provided a CPV module wherein a solder paste is used as an alternative to wire bonds or braided ribbon/mesh connectors to facilitate the electrical connectivity between the concentrated photovoltaic receiver cell or die of the CPV module and the conductive pattern of the underlying substrate thereof. In accordance with the present invention, the possibility of accidentally shorting the top of the receiver die with the other metal parts of the CPV module is avoided by molding at least the periphery of the receiver die with a mold body, and then dispensing or printing the conductive paste between the top of the receiver die and the substrate, the mold body defining a reservoir which facilities the flow of the conductive paste in a prescribed pattern.Type: GrantFiled: September 14, 2010Date of Patent: October 8, 2013Assignee: Amkor Technology, Inc.Inventors: Giuseppe Selli, Michael DeVita, Bob Shih-Wei Kuo
-
Patent number: 8199518Abstract: An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.Type: GrantFiled: February 18, 2010Date of Patent: June 12, 2012Assignee: Amkor Technology, Inc.Inventors: Jong Ok Chun, Nozad Karim, Richard Chen, Giuseppe Selli, Michael Kelly