Abstract: The transducer comprises a support structure carrying piezoresistive sensors, particularly of the thick-film type, which are intended to be resiliently deformed by the fluid pressure to be measured and to provide an electrical signal indicative of the value of the pressure. The support structure comprises a substantially mushroom-shaped metal body with a head and a shank. An axial blind hole is formed in the shank and is intended to contain the fluid whose pressure is to be measured. The hole also extends into the head and, with the end surface of the head, defines a wall which is resiliently deformable by the pressure to be measured. The piezoresistive sensors are connected to the end surface of the head of the mushroom-shaped body in correspondence with or adjacent the deformable wall so that they can in turn be deformed as a result of the deformation of the wall. The piezoresistive sensors are deposited on a thin plate fixed to the upper surface of the head of the mushroom-shaped body.

Abstract: A strain gauge sensor for sensing stresses and deformations in mechanical members or structures, comprising a support substrate in form of a thin plate, made of an electrically-insulating material, preferably ceramic material, bearing on one face at least one thick-film resistor; said support substrate being adapted to be firmly attached with its other face onto a member or structure of which stresses and deformations are to be locally sensed, so that said stresses or deformations determine through the substrate corresponding deformations of said at least one thick-film resistor.

Abstract: In a thick-film pressure sensor comprising a support plate on at least one surface of which are deposited at least one thick-film resistor acting as a piezo-resistive transducer and at least one pair of thick-film conductors acting as rheophores, the at least one thick-film resistor and the thick-film conductors are covered with a protective layer of dielectric material.

Abstract: A pressure measuring device comprises a support casing having an aperture, a substrate mounted in the casing and deformable through the effect of a pressure to be measured introduced into the casing through the aperture, at least one electrical deformation sensor, preferably a thick-film resistor, applied to the substrate, circuit means housed in the casing and connected to the at least one electrical deformation sensor for outputting electrical signals indicative, according to a predetermined response curve, of the deformations of the substrate and hence of the pressure acting thereon, and manually-operable electrical adjustment means mounted in the casing and connected to the circuit means, for modifying predetermined characteristics of the response curve.