Patents by Inventor Gleb Andreyevich EGOROV

Gleb Andreyevich EGOROV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11581640
    Abstract: The disclosed structures and methods are directed to antenna systems configured to transmit and receive a wireless signal in and from different directions. An antenna for transmission of electromagnetic (EM) waves comprises a phased array and a metastructure. The phased array has radiated elements configured to radiate the EM waves. The metastructure is located at a phased array distance from the phased array to receive the EM waves at the first angle and to transmit the EM waves at a second angle, the second angle being larger than the first angle. The metastructure comprises three impedance layers arranged in parallel to each other and each impedance layer comprising a plurality of metallization elements. Each metallization element has a first dipole and a pair of first capacitance arms located on each end of the first dipole approximately perpendicular to the first dipole.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: February 14, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Georgios V. Eleftheriades, Gleb Andreyevich Egorov
  • Publication number: 20210184351
    Abstract: The disclosed structures and methods are directed to antenna systems configured to transmit and receive a wireless signal in and from different directions. An antenna for transmission of electromagnetic (EM) waves comprises a phased array and a metastructure. The phased array has radiated elements configured to radiate the EM waves. The metastructure is located at a phased array distance from the phased array to receive the EM waves at the first angle and to transmit the EM waves at a second angle, the second angle being larger than the first angle. The metastructure comprises three impedance layers arranged in parallel to each other and each impedance layer comprising a plurality of metallization elements. Each metallization element has a first dipole and a pair of first capacitance arms located on each end of the first dipole approximately perpendicular to the first dipole.
    Type: Application
    Filed: December 16, 2019
    Publication date: June 17, 2021
    Inventors: Georgios V. ELEFTHERIADES, Gleb Andreyevich EGOROV