Abstract: A method of lapping the air bearing surface of a magnetoresistive head which minimizes the likelihood of interelement shorts at the air bearing surface is described. In a final, linear lapping phase, the air bearing surface is lapped back and forth parallel to the longitudinal axis of the head elements in an oscillatory path across a stationary lapping surface. Any scratches or smears of the elements will be along the length of the elements rather than transverse to the elements. Any transverse scratches or smears occurring in earlier lapping phases will be removed during the linear lapping phase.

Abstract: In a disk drive actuator head stack assembly, magnetic transducers including magnetoresistive (MR) read heads are connected to a current source and configured to provide an MR sensor current to each MR head wherein the direction of current flow for the MR sensor current in each MR head is the same relative to the actuator for all of the MR heads in the actuator head stack. This configuration allows all of the MR heads in the head stack assembly to be initialized simultaneously by applying a homogeneous magnetic field to the head stack assembly, thus providing the capability of initializing the MR heads at the actuator or disk drive level rather than requiring that the MR heads be initialized individually.

Abstract: The present invention provides a test circuit and method for testing for short circuits in an MR head, merged MR head or piggyback MR head without contacting either of the shield layers. This is accomplished by a bridge circuit which employs part of the components of the head. The bridge circuit has four consecutively arranged branches which are interconnected by four consecutively arranged terminals. The first terminal comprises the substrate or one of the write pads and the second and fourth terminals comprise the first and second read pads. A signal generator is connected across the first and third terminals and a detector, such as a differential amplifier, is connected across the read pads.

Abstract: The magnetoresistive (MR) sensor in a magnetic read/write transducer is protected against the effects of electrical overstress and electrostatic discharge during the manufacture and assembly of a magnetic storage system. The conductive leads of a magnetoresistive (MR) sensor element are shorted together to provide a low resistance, conductive path bypassing the MR element and minimizing electrical current through the MR sensing element during discharge of static electrical charge. The MR sensor lead terminal pads provided on the transducer/slider surface are shorted together by soldering. The other transducer elements such as the MR magnetic shields, the inductive coil and the inductive magnetic yoke structure can also be shorted to the MR sensor leads by soldering together the lead terminal pads at the slider surface. Alternatively, a twisted conductor pair may be used to short the MR terminals together.