Patents by Inventor Glen Atkins

Glen Atkins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5987605
    Abstract: Methods and associated apparatus for using a dual-boot capable programmable device and for updating programmed information in such a dual-boot capable programmable device. The apparatus of the present invention includes a primary boot memory device, a secondary boot memory device, and means for selecting between the two memory devices for purposes of "booting" the dual-boot mode device. In particular, a reset switch of the apparatus of the present invention resets devices in the dual-boot capable programmable device and is coupled to a selection device. The selection device multiplexes signals from the two boot memory devices onto the corresponding bus signals of the dual-boot capable programmable device. When a "long" reset switch activation is sensed, the selection device selects a first of the two boot memory devices for coupling to the programmable device. A "short" activation of the reset switch selects the other boot memory device.
    Type: Grant
    Filed: February 28, 1998
    Date of Patent: November 16, 1999
    Assignee: Hewlett-Packard Co.
    Inventors: Gregory Hill, Raymond A. Purcell, Charles D. Platz, Glen Atkins, Lee Atchison
  • Patent number: 5200917
    Abstract: The invention relates to a stacked integrated circuit module 20 which is interchangeable with standard printed circuit boards. Module 20 has two PCBs 22 and 24 and multiple memory ICs 26a-26d mounted on the PCBs. A board alignment support 48 is provided between PCBs 22 and 24 to support the PCBs in a spaced and substantially parallel relation and to provide electrical interfacing between the two PCBs. PCB 22 has an edge connector 44 adapted to be inserted into standard receptacle connectors provided on a mother board. According to this stacked arrangement, memory ICs 26c and 26d are addressable through connector 44, conductive paths formed on PCB 22, board alignment support 48, and conductive paths formed on PCB 24.
    Type: Grant
    Filed: November 27, 1991
    Date of Patent: April 6, 1993
    Assignee: Micron Technology, Inc.
    Inventors: James M. Shaffer, Karl H. Mauritz, Glen Atkins