Abstract: One or more test probe access structures for accessing vias on a printed circuit assembly and method of fabrication thereof is presented. Each test probe access structure is conductively connected to a via at a test probe access location above an exposed surface of a via to be accessible for probing by a test probe.

Abstract: Methods and systems for improving a solder paste stenciling process include obtaining data pertaining to solder paste deposits on a printed circuit board, the solder paste deposits deposited by a solder paste stenciling process through multiple identical apertures of a solder paste stencil, statistically analyzing the data, and correlating the data with a plurality of solder paste stenciling process problems to identify at least one solder paste stenciling process problem in the solder paste stenciling process.

Abstract: A test access point structure for accessing test points of a printed circuit board and method of fabrication thereof is presented. In an x-, y-, z-coordinate system where traces are printed along an x-y plane, the z-dimension is used to implement test access point structures. Each test access point structure is conductively connected to a trace at a test access point directly on top of the trace and along the z axis of the x-, y-, z-coordinate system above an exposed surface of the printed circuit board to be accessible for electrical probing by an external device.

Abstract: An assembly and method for detecting defective and open solder joints of an area array packages attached to a printed circuit assembly is presented. The assembly employs offset pad layout on either or both of the printed circuit assembly or the area array package allowing improved solder joint defect detection.