Abstract: Method and structure for creating multilayer printed circuit boards having integral flexible conductor appendages, involving the utilization of an array of flexible, circuit-containing layers bonded in properly aligned relationship between rigid layers equipped with suitable electrical connections. All of the layers are substantially larger than the size the finished circuit board is to be and selectively bonded and slotted in preselected locations, and maintained in this over-sized condition throughout the procedure in which holes for interconnections are drilled, and plated through with conductive material. Only after the plating procedure has been completed are the portions of the upper and lower rigid layers removed from locations above and below the appendage portions, thus allowing them to attain the desired, flexible condition.