Abstract: A method and apparatus are disclosed for handling multi-board panels in order to liberate therefrom individual circuit boards which may or may not have been prepopulated with the electrical components. Each panel is supported above a receiving tray on a top shuttle and transported from a load/unload station to a routing station at which tabs or webs which retain the circuit boards in the panel are removed. Removal of the boards is facilitated by X-positioning of the panel and Y-positioning of the router according to a programmable controller. The tray receives liberated boards from the top shuttle which is then cycled back to the load/unload station for unloading scrap, acquiring another tray, and reloading the shuttle with another multi-board panel. During subsequent translation of the loaded top shuttle to the routing station, a bottom shuttle transfers the first tray and liberated circuit boards to the load/unload station for unloading thereof.

Abstract: A manufacturing line along which PCB's are fed and operated on includes a processing fixture for receiving an individual board and displacing it clear of the line toward a router bit. The router bit is shiftable transverse of the line, and the processing fixture is shiftable parallel to the line and in an underlapping relation to adjacent stations so as to address the whole area of the board with the router bit without increasing the length of the manufacturing line.

Abstract: A printed circuit board has a conductive terminal mounted in an aperture extending therethrough. The terminal has a shoulder portion, adjacent a side surface of the terminal, which contacts one surface of the board adjacent the aperture, and a bottom portion which flares outward to contact a conductive coating disposed, adjacent the aperture, on the opposite surface of the board. The bottom portion is rolled over sufficiently to allow a distal end surface of the bottom portion, adjacent the side surface, to contact the conductive coating at an orientation wherein the distal end surface is substantially parallel to the coating.