Patents by Inventor Glen P. Gordon
Glen P. Gordon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10205292Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.Type: GrantFiled: September 26, 2017Date of Patent: February 12, 2019Assignee: INTEL CORPORATIONInventors: Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny, Jeffory L. Smalley, Srikant Nekkanty, Michael Garcia, Joshua D. Heppner
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Publication number: 20180019558Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.Type: ApplicationFiled: September 26, 2017Publication date: January 18, 2018Inventors: Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny, Jeffory L. Smalley, Srikant Nekkanty, Michael Garcia, Joshua D. Heppner
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Patent number: 9780510Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.Type: GrantFiled: September 26, 2014Date of Patent: October 3, 2017Assignee: INTEL CORPORATIONInventors: Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny, Jeffory L. Smalley, Srikant Nekkanty, Michael Garcia, Joshua D. Heppner
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Publication number: 20160254629Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.Type: ApplicationFiled: September 26, 2014Publication date: September 1, 2016Applicant: Intel CorporationInventors: Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny, Jeffory L. Smalley, Srikant Nekkanty, Michael Garcia, Joshua D. Heppner
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Patent number: 8819917Abstract: According to some embodiments, a device having a pliant portion may be utilized to secure a circuit board.Type: GrantFiled: January 2, 2013Date of Patent: September 2, 2014Assignee: Intel CorporationInventor: Glen P. Gordon
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Publication number: 20130117991Abstract: According to some embodiments, a device having a pliant portion may be utilized to secure a circuit board.Type: ApplicationFiled: January 2, 2013Publication date: May 16, 2013Inventor: Glen P. Gordon
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Patent number: 8355261Abstract: In some embodiments, a device includes a first element to couple the device to a first portion of a computer chassis; and a first pliant portion coupled to the first element and to inhibit disconnection of a circuit board. In some embodiments, a system includes a chassis having a circuit board slot coupled thereto; a circuit board coupled to the circuit board slot; and a device coupled to the chassis, the device having a first pliant portion to inhibit disconnection of the circuit board from the circuit board slot. In some embodiments, a system includes a chassis having a circuit board slot coupled thereto; a SONET interface card coupled to the circuit board slot; and a device coupled to the chassis, the device having a first pliant portion to inhibit disconnection of the SONET interface card from the circuit board slot.Type: GrantFiled: May 26, 2004Date of Patent: January 15, 2013Assignee: Intel CorporationInventor: Glen P. Gordon
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Patent number: 8279596Abstract: A fan mounting system includes a fan chassis defining a plurality of fan housings. A guide member is located on the fan chassis. At least one board support member extends from the fan chassis and is operable to extend through a board to engage an Information Handling System (IHS) chassis when the fan chassis is positioned in the IHS chassis. An IHS chassis cover anchor is located on the fan chassis and is operable to engage an IHS chassis cover and secure the IHS chassis cover to the IHS chassis when the fan chassis is coupled to the IHS chassis.Type: GrantFiled: July 29, 2010Date of Patent: October 2, 2012Assignee: Dell Products L.P.Inventors: Alejandro Z. Rodriguez, Brian T. Whitman, Char Damneun, Corey D. Hartman, Glen P. Gordon, Jeffory L. Smalley
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Publication number: 20120026678Abstract: A fan mounting system includes a fan chassis defining a plurality of fan housings. A guide member is located on the fan chassis. At least one board support member extends from the fan chassis and is operable to extend through a board to engage an Information Handling System (IHS) chassis when the fan chassis is positioned in the IHS chassis. An IHS chassis cover anchor is located on the fan chassis and is operable to engage an IHS chassis cover and secure the IHS chassis cover to the IHS chassis when the fan chassis is coupled to the IHS chassis.Type: ApplicationFiled: July 29, 2010Publication date: February 2, 2012Applicant: DELL PRODUCTS L.P.Inventors: Alejandro Z. Rodriguez, Brian T. Whitman, Char Damneun, Corey D. Hartman, Glen P. Gordon, Jeffory L. Smalley
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Patent number: 7035107Abstract: A method and an apparatus for releasably retaining a heatsink in contact with an IC attached to a circuitboard in which the heatsink is inserted into a spring cage that is pivotally connected with an actuation lever, wherein at least a pair of spring tabs engage the heatsink to press a thermal conductive surface of the heatsink towards a circuitboard and an IC attached to the circuitboard when the combination of the heatsink, actuation lever and spring cage are inserted into the rectangular frame of a retention module mounted on the circuitboard so as to surround the IC and the lever portion of the actuation lever is pivoted towards the spring cage so as to cause retention points on the actuator portions of the actuation lever and on the rectangular frame of the spring cage to engage corresponding retention points on the rectangular frame of the retention module.Type: GrantFiled: July 11, 2003Date of Patent: April 25, 2006Assignee: Intel CorporationInventors: Michael Z. Eckblad, Eric D. McAfee, Andy F. Thompson, Glen P. Gordon
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Patent number: 6704825Abstract: A system to connect cards in a chassis is provided. The system includes a chassis frame having a slot to receive a card. A rocker is coupled to the chassis frame and positioned in a closed state when the card is in the slot. A magnetic element is positioned on the rocker and a sensor positioned to detect a magnetic field generated by the magnetic element. The sensor then determines whether the rocker is positioned an open state or said closed state.Type: GrantFiled: June 30, 2000Date of Patent: March 9, 2004Assignee: Intel CorporationInventors: Michael A. Lascu, Michael Z. Eckblad, Brian R. Peil, Glen P. Gordon, Ron Flamm, Dan C. Plitt, Eryan Eylon, Ronald B. Sutherland, Mark W. Anderson
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Patent number: 6473305Abstract: A fastening system and a method for retaining temperature control devices used on semiconductor dies transfers the load of the temperature control devices around the semiconductor dies using a spring collet arrangement. An elongated spring collet is installed in a hole in the temperature control device so as to extend outwardly from the temperature control device with the spring collet being movable in the hole relative to the temperature control device in the direction of elongation of the spring collet. An expansion spring resiliently biases the spring collet so as to extend outwardly. An outer end of the spring collet is positioned in a pocket of a retention mechanism of a support member. An electrical connection is made as the temperature control device with semiconductor die is forced down until a pin grid array thereon is properly seated in a socket on the support member.Type: GrantFiled: October 26, 2000Date of Patent: October 29, 2002Assignee: Intel CorporationInventors: Glen P. Gordon, Pardeep K. Bhatti
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Patent number: 6320760Abstract: A card support releasably retains the edges of a plurality of electronic cards in a card guide panel. The card support is formed with a card support bracket and a plurality of card retention tabs connected to the bracket by way of flexible members for releasably retaining the edges of respective cards in guide channels of the card guide panel. The retention tabs have ramps on one side for engagement with the edges of the cards being installed for momentarily moving the tabs back out of the way, allowing the cards to slide past the tabs. Once installed, the opposite sides of the tabs, which are flat, extend over the rear edge of the installed cards to retain them in the guide channels, especially during shock and vibration, including dropping the box upside down.Type: GrantFiled: August 27, 1999Date of Patent: November 20, 2001Assignee: Intel CorporationInventors: Ronald C. Flamm, Anthony P. Valpiani, Glen P. Gordon
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Patent number: 6215673Abstract: A hot plug retainer and actuator is used on a chassis for releasably securing a component on the chassis. The retainer and actuator includes a one piece body having a first portion, a second portion and a living hinge pivotably connecting the first and second portions to one another for opening and closing the actuator.Type: GrantFiled: August 27, 1999Date of Patent: April 10, 2001Assignee: Intel CorporationInventors: Glen P. Gordon, Anthony P. Valpiani, Ronald C. Flamm, Anthony Leuthe