Patents by Inventor Glen P. Gordon

Glen P. Gordon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10205292
    Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: February 12, 2019
    Assignee: INTEL CORPORATION
    Inventors: Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny, Jeffory L. Smalley, Srikant Nekkanty, Michael Garcia, Joshua D. Heppner
  • Publication number: 20180019558
    Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 26, 2017
    Publication date: January 18, 2018
    Inventors: Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny, Jeffory L. Smalley, Srikant Nekkanty, Michael Garcia, Joshua D. Heppner
  • Patent number: 9780510
    Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: October 3, 2017
    Assignee: INTEL CORPORATION
    Inventors: Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny, Jeffory L. Smalley, Srikant Nekkanty, Michael Garcia, Joshua D. Heppner
  • Publication number: 20160254629
    Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 26, 2014
    Publication date: September 1, 2016
    Applicant: Intel Corporation
    Inventors: Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny, Jeffory L. Smalley, Srikant Nekkanty, Michael Garcia, Joshua D. Heppner
  • Patent number: 8819917
    Abstract: According to some embodiments, a device having a pliant portion may be utilized to secure a circuit board.
    Type: Grant
    Filed: January 2, 2013
    Date of Patent: September 2, 2014
    Assignee: Intel Corporation
    Inventor: Glen P. Gordon
  • Publication number: 20130117991
    Abstract: According to some embodiments, a device having a pliant portion may be utilized to secure a circuit board.
    Type: Application
    Filed: January 2, 2013
    Publication date: May 16, 2013
    Inventor: Glen P. Gordon
  • Patent number: 8355261
    Abstract: In some embodiments, a device includes a first element to couple the device to a first portion of a computer chassis; and a first pliant portion coupled to the first element and to inhibit disconnection of a circuit board. In some embodiments, a system includes a chassis having a circuit board slot coupled thereto; a circuit board coupled to the circuit board slot; and a device coupled to the chassis, the device having a first pliant portion to inhibit disconnection of the circuit board from the circuit board slot. In some embodiments, a system includes a chassis having a circuit board slot coupled thereto; a SONET interface card coupled to the circuit board slot; and a device coupled to the chassis, the device having a first pliant portion to inhibit disconnection of the SONET interface card from the circuit board slot.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: January 15, 2013
    Assignee: Intel Corporation
    Inventor: Glen P. Gordon
  • Patent number: 8279596
    Abstract: A fan mounting system includes a fan chassis defining a plurality of fan housings. A guide member is located on the fan chassis. At least one board support member extends from the fan chassis and is operable to extend through a board to engage an Information Handling System (IHS) chassis when the fan chassis is positioned in the IHS chassis. An IHS chassis cover anchor is located on the fan chassis and is operable to engage an IHS chassis cover and secure the IHS chassis cover to the IHS chassis when the fan chassis is coupled to the IHS chassis.
    Type: Grant
    Filed: July 29, 2010
    Date of Patent: October 2, 2012
    Assignee: Dell Products L.P.
    Inventors: Alejandro Z. Rodriguez, Brian T. Whitman, Char Damneun, Corey D. Hartman, Glen P. Gordon, Jeffory L. Smalley
  • Publication number: 20120026678
    Abstract: A fan mounting system includes a fan chassis defining a plurality of fan housings. A guide member is located on the fan chassis. At least one board support member extends from the fan chassis and is operable to extend through a board to engage an Information Handling System (IHS) chassis when the fan chassis is positioned in the IHS chassis. An IHS chassis cover anchor is located on the fan chassis and is operable to engage an IHS chassis cover and secure the IHS chassis cover to the IHS chassis when the fan chassis is coupled to the IHS chassis.
    Type: Application
    Filed: July 29, 2010
    Publication date: February 2, 2012
    Applicant: DELL PRODUCTS L.P.
    Inventors: Alejandro Z. Rodriguez, Brian T. Whitman, Char Damneun, Corey D. Hartman, Glen P. Gordon, Jeffory L. Smalley
  • Patent number: 7035107
    Abstract: A method and an apparatus for releasably retaining a heatsink in contact with an IC attached to a circuitboard in which the heatsink is inserted into a spring cage that is pivotally connected with an actuation lever, wherein at least a pair of spring tabs engage the heatsink to press a thermal conductive surface of the heatsink towards a circuitboard and an IC attached to the circuitboard when the combination of the heatsink, actuation lever and spring cage are inserted into the rectangular frame of a retention module mounted on the circuitboard so as to surround the IC and the lever portion of the actuation lever is pivoted towards the spring cage so as to cause retention points on the actuator portions of the actuation lever and on the rectangular frame of the spring cage to engage corresponding retention points on the rectangular frame of the retention module.
    Type: Grant
    Filed: July 11, 2003
    Date of Patent: April 25, 2006
    Assignee: Intel Corporation
    Inventors: Michael Z. Eckblad, Eric D. McAfee, Andy F. Thompson, Glen P. Gordon
  • Patent number: 6704825
    Abstract: A system to connect cards in a chassis is provided. The system includes a chassis frame having a slot to receive a card. A rocker is coupled to the chassis frame and positioned in a closed state when the card is in the slot. A magnetic element is positioned on the rocker and a sensor positioned to detect a magnetic field generated by the magnetic element. The sensor then determines whether the rocker is positioned an open state or said closed state.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: March 9, 2004
    Assignee: Intel Corporation
    Inventors: Michael A. Lascu, Michael Z. Eckblad, Brian R. Peil, Glen P. Gordon, Ron Flamm, Dan C. Plitt, Eryan Eylon, Ronald B. Sutherland, Mark W. Anderson
  • Patent number: 6473305
    Abstract: A fastening system and a method for retaining temperature control devices used on semiconductor dies transfers the load of the temperature control devices around the semiconductor dies using a spring collet arrangement. An elongated spring collet is installed in a hole in the temperature control device so as to extend outwardly from the temperature control device with the spring collet being movable in the hole relative to the temperature control device in the direction of elongation of the spring collet. An expansion spring resiliently biases the spring collet so as to extend outwardly. An outer end of the spring collet is positioned in a pocket of a retention mechanism of a support member. An electrical connection is made as the temperature control device with semiconductor die is forced down until a pin grid array thereon is properly seated in a socket on the support member.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: October 29, 2002
    Assignee: Intel Corporation
    Inventors: Glen P. Gordon, Pardeep K. Bhatti
  • Patent number: 6320760
    Abstract: A card support releasably retains the edges of a plurality of electronic cards in a card guide panel. The card support is formed with a card support bracket and a plurality of card retention tabs connected to the bracket by way of flexible members for releasably retaining the edges of respective cards in guide channels of the card guide panel. The retention tabs have ramps on one side for engagement with the edges of the cards being installed for momentarily moving the tabs back out of the way, allowing the cards to slide past the tabs. Once installed, the opposite sides of the tabs, which are flat, extend over the rear edge of the installed cards to retain them in the guide channels, especially during shock and vibration, including dropping the box upside down.
    Type: Grant
    Filed: August 27, 1999
    Date of Patent: November 20, 2001
    Assignee: Intel Corporation
    Inventors: Ronald C. Flamm, Anthony P. Valpiani, Glen P. Gordon
  • Patent number: 6215673
    Abstract: A hot plug retainer and actuator is used on a chassis for releasably securing a component on the chassis. The retainer and actuator includes a one piece body having a first portion, a second portion and a living hinge pivotably connecting the first and second portions to one another for opening and closing the actuator.
    Type: Grant
    Filed: August 27, 1999
    Date of Patent: April 10, 2001
    Assignee: Intel Corporation
    Inventors: Glen P. Gordon, Anthony P. Valpiani, Ronald C. Flamm, Anthony Leuthe