Patents by Inventor Glenn A. Pomerantz
Glenn A. Pomerantz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11393759Abstract: An alignment carrier, assembly and methods that enable the precise alignment and assembly of two or more semiconductor die using an interconnect bridge. The alignment carrier includes a substrate composed of a material that has a coefficient of thermal expansion that substantially matches that of an interconnect bridge. The alignment carrier further includes a plurality of solder balls located on the substrate and configured for alignment of two or more semiconductor die.Type: GrantFiled: October 4, 2019Date of Patent: July 19, 2022Assignee: International Business Machines CorporationInventors: Thomas Weiss, Charles L. Arvin, Glenn A. Pomerantz, Rachel E. Olson, Mark W. Kapfhammer, Bhupender Singh
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Publication number: 20210104464Abstract: An alignment carrier, assembly and methods that enable the precise alignment and assembly of two or more semiconductor die using an interconnect bridge. The alignment carrier includes a substrate composed of a material that has a coefficient of thermal expansion that substantially matches that of an interconnect bridge. The alignment carrier further includes a plurality of solder balls located on the substrate and configured for alignment of two or more semiconductor die.Type: ApplicationFiled: October 4, 2019Publication date: April 8, 2021Inventors: Thomas Weiss, Charles L. Arvin, Glenn A. Pomerantz, Rachel E. Olson, Mark W. Kapfhammer, Bhupender Singh
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Patent number: 7781232Abstract: Methods and reworked intermediate and resultant electronic modules made thereby, whereby a component in need of rework is located and removed from the module to reveal encapsulated solder connections residing within an underfill matrix. Heights of both the solder connections and underfill matrix are reduced, followed by etching the solder out of the solder connections to form openings within the underfill matrix. The underfill material is then removed to expose metallurgy of the substrate. A blank having a release layer with an array of solder connections is aligned with the exposed metallurgy, and this solder array is transferred from the blank onto the metallurgy. The transferred solder connections are then flattened using heat and pressure, followed by attaching solder connections of a new component to the flattened solder connections and underfilling these reworked solder connections residing between the new chip and substrate.Type: GrantFiled: January 17, 2008Date of Patent: August 24, 2010Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Benjamin V. Fasano, Mario J. Interrante, Glenn A. Pomerantz
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Publication number: 20090184407Abstract: Methods and reworked intermediate and resultant electronic modules made thereby, whereby a component in need of rework is located and removed from the module to reveal encapsulated solder connections residing within an underfill matrix. Heights of both the solder connections and underfill matrix are reduced, followed by etching the solder out of the solder connections to form openings within the underfill matrix. The underfill material is then removed to expose metallurgy of the substrate. A blank having a release layer with an array of solder connections is aligned with the exposed metallurgy, and this solder array is transferred from the blank onto the metallurgy. The transferred solder connections are then flattened using heat and pressure, followed by attaching solder connections of a new component to the flattened solder connections and underfilling these reworked solder connections residing between the new chip and substrate.Type: ApplicationFiled: January 17, 2008Publication date: July 23, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles L. Arvin, Benjamin V. Fasano, Mario J. Interrante, Glenn A. Pomerantz
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Patent number: 7294909Abstract: A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.Type: GrantFiled: April 5, 2005Date of Patent: November 13, 2007Assignee: International Business Machines CorporationInventors: Jon A. Casey, James G. Balz, Michael Berger, Jerome Cohen, Charles Hendricks, Richard Indyk, Mark LaPlante, David C. Long, Lori A. Maiorino, Arthur G. Merryman, Glenn A. Pomerantz, Robert A. Rita, Krystyna W. Semkow, Patrick E. Spencer, Brian R. Sundlof, Richard P. Surprenant, Donald R. Wall, Thomas A. Wassick, Kathleen M. Wiley
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Publication number: 20050176255Abstract: A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.Type: ApplicationFiled: April 5, 2005Publication date: August 11, 2005Inventors: Jon Casey, James Balz, Michael Berger, Jerome Cohen, Charles Hendricks, Richard Indyk, Mark LaPlante, David Long, Lori Maiorino, Arthur Merryman, Glenn Pomerantz, Robert Rita, Krystyna Semkow, Patrick Spencer, Brian Sundlof, Richard Surprenant, Donald Wall, Thomas Wassick, Kathleen Wiley
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Patent number: 6916670Abstract: A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.Type: GrantFiled: February 4, 2003Date of Patent: July 12, 2005Assignee: International Business Machines CorporationInventors: Jon A. Casey, James G. Balz, Michael Berger, Jerome Cohen, Charles Hendricks, Richard Indyk, Mark LaPlante, David C. Long, Lori A. Maiorino, Arthur G. Merryman, Glenn A. Pomerantz, Robert A. Rita, Krystyna W. Semkow, Patrick E. Spencer, Brian R. Sundlof, Richard P. Surprenant, Donald R. Wall, Thomas A. Wassick, Kathleen M. Wiley
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Patent number: 6835260Abstract: Methods to create raised pedestal parts in ceramic substrates sintered under a load. The invention uses a patterned, buried, non-sintering layer that provides the needed transfer of load during the sintering process to the raised or pedestal portion of the substrate while maintaining dimensional control of the metallized features on the surface of the pedestal base. The methods involve cutting channels in the ceramic substrate corresponding in position to the perimeter of the opening in the patterned non-sintering contact sheet. The channels may be cut either before or after the sintering of the ceramic substrates.Type: GrantFiled: October 4, 2002Date of Patent: December 28, 2004Assignee: International Business Machines CorporationInventors: Benjamin V. Fasano, David H. Gabriels, Richard F. Indyk, Glenn A. Pomerantz, Richard A. Shelleman
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Patent number: 6823585Abstract: A method and structure to form surface plating metallization on a substrate. Two layers of tape are applied to the surface of the substrate. A first path is cut through both layers of tape exposing the substrate surface. The first path connects at least one conductive via on the top surface of the substrate. A second path is cut through the second layer of tape exposing the first layer of tape. The second path is routed from the first path to an edge of the substrate A seed layer is deposited over the surface of the second layer of tape thereby creating a seeded plating path in the first path and a sacrificial seeded conduction path in the second path. Connecting the sacrificial seeded conduction path to a plating potential at the edge of the substrate creates a plated path on the surface of the substrate. The sacrificial path is removed when the tape is removed.Type: GrantFiled: March 28, 2003Date of Patent: November 30, 2004Assignee: International Business Machines CorporationInventors: Mark J. LaPlante, Jon A. Casey, Thomas A. Wassick, David C. Long, Krystyna W. Semkow, Patrick E. Spencer, Robert A. Rita, Richard F. Indyk, Kathleen M. Wiley, Brian R. Sundlof, James Balz, Lori A. Maiorino, Donald R. Wall, Glenn A. Pomerantz
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Publication number: 20040187303Abstract: A method and structure to form surface plating metallization on a substrate. Two layers of tape are applied to the surface of the substrate. A first path is cut through both layers of tape exposing the substrate surface. The first path connects at least one conductive via on the top surface of the substrate. A second path is cut through the second layer of tape exposing the first layer of tape. The second path is routed from the first path to an edge of the substrate A seed layer is deposited over the surface of the second layer of tape thereby creating a seeded plating path in the first path and a sacrificial seeded conduction path in the second path. Connecting the sacrificial seeded conduction path to a plating potential at the edge of the substrate creates a plated path on the surface of the substrate. The sacrificial path is removed when the tape is removed.Type: ApplicationFiled: March 28, 2003Publication date: September 30, 2004Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Mark J. LaPlante, Jon A. Casey, Thomas A. Wassick, David C. Long, Krystyna W. Semkow, Patrick E. Spencer, Robert A. Rita, Richard F. Indyk, Kathleen M. Wiley, Brian R. Sundlof, James Balz, Lori A. Maiorino, Donald R. Wall, Glenn A. Pomerantz
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Publication number: 20040148765Abstract: A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.Type: ApplicationFiled: February 4, 2003Publication date: August 5, 2004Applicant: International Business Machines CorporationInventors: Jon A. Casey, James G. Balz, Michael Berger, Jerome Cohen, Charles Hendricks, Richard Indyk, Mark LaPlante, David C. Long, Lori A. Maiorino, Arthur G. Merryman, Glenn A. Pomerantz, Robert A. Rita, Krystyna W. Semkow, Patrick E. Spencer, Brian R. Sundlof, Richard P. Surprenant, Donald R. Wall, Thomas A. Wassick, Kathleen M. Wiley
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Patent number: 6742530Abstract: A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board.Type: GrantFiled: November 14, 2002Date of Patent: June 1, 2004Assignee: International Business Machines CorporationInventors: Krishna G. Sachdev, James N. Humenik, Chon Cheong Lei, Glenn A. Pomerantz
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Publication number: 20040065401Abstract: Methods to create raised pedestal parts in ceramic substrates sintered under a load. The invention uses a patterned, buried, non-sintering layer that provides the needed transfer of load during the sintering process to the raised or pedestal portion of the substrate while maintaining dimensional control of the metallized features on the surface of the pedestal base. The methods involve cutting channels in the ceramic substrate corresponding in position to the perimeter of the opening in the patterned non-sintering contact sheet. The channels may be cut either before or after the sintering of the ceramic substrates.Type: ApplicationFiled: October 4, 2002Publication date: April 8, 2004Applicant: International Business Machines CorporationInventors: Benjamin V. Fasano, David H. Gabriels, Richard F. Indyk, Glenn A. Pomerantz, Richard A. Shelleman
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Patent number: 6569252Abstract: A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board.Type: GrantFiled: June 30, 2000Date of Patent: May 27, 2003Assignee: International Business Machines CorporationInventors: Krishna G. Sachdev, James N. Humenik, Chon Cheong Lei, Glenn A. Pomerantz
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Publication number: 20030066540Abstract: The present invention relates generally to a new process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, this invention is concerned with removing a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. This invention is also concerned with cleaning of solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board.Type: ApplicationFiled: November 14, 2002Publication date: April 10, 2003Applicant: International Business Machines CorporationInventors: Krishna G. Sachdev, James N. Humenik, Chon Cheong Lei, Glenn A. Pomerantz
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Patent number: 6532654Abstract: A method of forming an electrical connector including providing a metallic sheet having a multitude of connector blanks formed therein, each of the connector blanks having a base portion, a contact portion and a singulation arm; forming each of the connector blanks into a connector having a predetermined shape wherein each of the connectors remain connected to the metallic sheet by their respective singulation arms and wherein the singulation arms are nonplanar with respect to the metallic sheet; joining the base of each of the connectors to a first substrate; and severing the singulation arms to separate each of the connectors from the metallic sheet wherein the base of each of the connectors is joined to the first substrate. In a preferred embodiment, the contact portion contacts a second substrate.Type: GrantFiled: January 12, 2001Date of Patent: March 18, 2003Assignee: International Business Machines CorporationInventors: Luc Gilbert Guerin, Mario J. Interrante, Mark Joseph LaPlante, David Clifford Long, Gregory Blair Martin, Thomas P. Moyer, Glenn A. Pomerantz, Thomas Weiss
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Patent number: 6525009Abstract: An aqueous alkaline cleaning composition for efficient removal of Mo, Cu, W, or Cu/Ni-based conductive paste residue from screening masks, associated screening equipment and the like by using alkali metal salt and/or tetramethyl ammonium salt of polyacrylic acid, acrylic acid-methacrylic acid co-polymer, polyaspartic acid, polylactic acid, poly(acrylic acid-co-maleic anhydride), poly(maleic acid), with excess alkali for pH adjustment in the range of about 11.5-13.5, and a surfactant which may be a medium foam, low foam or no-foam surfactant, and is preferably an amphoteric and/or non-ionic and/or ionic surfactant.Type: GrantFiled: December 7, 2000Date of Patent: February 25, 2003Assignee: International Business Machines CorporationInventors: Krishna G. Sachdev, Glenn A. Pomerantz, Daniel S. Mackin
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Patent number: 6442825Abstract: A fixture for holding a workpiece in a machining apparatus comprises at least one opening having at least one flexible side for elastically holding the workpiece and a slot adjacent each of the at least one side for allowing the side to flex.Type: GrantFiled: December 10, 1999Date of Patent: September 3, 2002Assignee: International Business Machines CorporationInventor: Glenn A. Pomerantz
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Publication number: 20020092164Abstract: A method of forming an electrical connector including providing a metallic sheet having a multitude of connector blanks formed therein, each of the connector blanks having a base portion, a contact portion and a singulation arm; forming each of the connector blanks into a connector having a predetermined shape wherein each of the connectors remain connected to the metallic sheet by their respective singulation arms and wherein the singulation arms are nonplanar with respect to the metallic sheet; joining the base of each of the connectors to a first substrate; and severing the singulation arms to separate each of the connectors from the metallic sheet wherein the base of each of the connectors is joined to the first substrate. In a preferred embodiment, the contact portion contacts a second substrate.Type: ApplicationFiled: January 12, 2001Publication date: July 18, 2002Inventors: Luc Gilbert Guerin, Mario J. Interrante, Mark Joseph LaPlante, David Clifford Long, Gregory Blair Martin, Thomas P. Moyer, Glenn A. Pomerantz, Thomas Weiss
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Publication number: 20020072482Abstract: An aqueous alkaline cleaning composition for efficient removal of Mo, Cu, W, or Cu/Ni-based conductive paste residue from screening masks, associated screening equipment and the like by using alkali metal salt and/or tetramethyl ammonium salt of polyacrylic acid, acrylic acid-methacrylic acid co-polymer, polyaspartic acid, polylactic acid, poly(acrylic acid-co-maleic anhydride), poly(maleic acid), with excess alkali for pH adjustment in the range of about 11.5-13.5, and a surfactant which may be a medium foam, low foam or no-foam surfactant, and is preferably an amphoteric and/or non-ionic and/or ionic surfactant.Type: ApplicationFiled: December 7, 2000Publication date: June 13, 2002Inventors: Krishna G. Sachdev, Glenn A. Pomerantz, Daniel S. Mackin