Abstract: A method for determining bone mass density (BMD) of a patient includes obtaining X-ray scan data of a region of interest (ROI) of the patient using an energy discriminating photon counting radiation detector, and calculating the bone mass density (BMD) of the region of interest of the patient based on detected X-ray photon counts within three or more energy bins.

Abstract: A radiation detector unit includes a read-out integrated circuit (ROIC) including a plurality of core circuit blocks located on a continuous uninterrupted substrate adjacent to one another along a first direction, and a plurality of radiation sensors bonded to a front side surface of the ROIC, where each radiation sensor of the plurality of radiation sensors is bonded to a respective core circuit block of the plurality of core circuit blocks of the ROIC. Additional embodiments include detector modules and detector arrays formed by assembling the detector units, and methods of operating and manufacturing the same.

Abstract: Various aspects include methods compensating for Compton scattering effects in pixel radiation detectors. Various aspects may include determining whether gamma ray detection events occurred in two or more detector pixels within an event frame, determining whether the gamma ray detection events occurred in detector pixels within a threshold distance of each other in response to determining that gamma ray detection events occurred in two or more detector pixels within the event frame, and recording the two or more gamma ray detection events as a single gamma ray detection event having an energy equal to the sum of measured energies of the two or more gamma ray detection events located in a detector pixel having a highest measured energy in response to determining that the gamma ray detection events occurred in detector pixels within the threshold distance of each other.

Abstract: Various aspects include methods of compensating for issues caused by charge sharing between pixels in pixel radiation detectors. Various aspects may include measuring radiation energy spectra with circuitry capable of registering detection events occurring simultaneous or coincident in two or more pixels, adjusting energy measurements of simultaneous-multi-pixel detection events by a charge sharing correction factor, and determining a corrected energy spectrum by adding the adjusted energy measurements of simultaneous-multi-pixel detection events to energy spectra of detection events occurring in single pixels. Adjusting energy measurements of simultaneous-multi-pixel detection events may include multiplying measured energies of simultaneous-multi-pixel detection events by a factor of one plus the charge sharing correction factor.

Abstract: A radiation detector unit includes an interposer, at least one radiation sensor bonded to a front side of an interposer, an application-specific integrated chip (ASIC) bonded to a backside of the interposer, a carrier board bonded to the backside of the interposer and located on a backside of the ASIC, and at least one flex cable assembly attached to a respective side of the carrier board.

Abstract: Various aspects include methods of compensating for issues caused by charge sharing between pixels in pixel radiation detectors. Various aspects may include measuring radiation energy spectra with circuitry capable of registering detection events occurring simultaneous or coincident in two or more pixels, adjusting energy measurements of simultaneous-multi-pixel detection events by a charge sharing correction factor, and determining a corrected energy spectrum by adding the adjusted energy measurements of simultaneous-multi-pixel detection events to energy spectra of detection events occurring in single pixels. Adjusting energy measurements of simultaneous-multi-pixel detection events may include multiplying measured energies of simultaneous-multi-pixel detection events by a factor of one plus the charge sharing correction factor.

Abstract: Various aspects include methods of compensating for issues caused by charge sharing between pixels in pixel radiation detectors. Various aspects may include measuring radiation energy spectra with circuitry capable of registering detection events occurring simultaneous or coincident in two or more pixels, adjusting energy measurements of simultaneous-multi-pixel detection events by a charge sharing correction factor, and determining a corrected energy spectrum by adding the adjusted energy measurements of simultaneous-multi-pixel detection events to energy spectra of detection events occurring in single pixels. Adjusting energy measurements of simultaneous-multi-pixel detection events may include multiplying measured energies of simultaneous-multi-pixel detection events by a factor of one plus the charge sharing correction factor.

Abstract: Various aspects include methods compensating for Compton scattering effects in pixel radiation detectors. Various aspects may include determining whether gamma ray detection events occurred in two or more detector pixels within an event frame, determining whether the detection events occurred in detector pixels within a threshold distance of each other in response to determining that detection events occurred in two or more detector pixels within the event frame, and recording the two or more detection events as a single detection event having an energy equal to the sum of the measured energies of the two or more detection events located in the detector pixel having a highest measured energy in response to determining that the detection events occurred in detector pixels within the threshold distance of each other.

Abstract: Various aspects include methods of compensating for issues caused by charge sharing between pixels in pixel radiation detectors. Various aspects may include measuring radiation energy spectra with circuitry capable of registering detection events occurring simultaneous or coincident in two or more pixels, adjusting energy measurements of simultaneous-multi-pixel detection events by a charge sharing correction factor, and determining a corrected energy spectrum by adding the adjusted energy measurements of simultaneous-multi-pixel detection events to energy spectra of detection events occurring in single pixels. Adjusting energy measurements of simultaneous-multi-pixel detection events may include multiplying measured energies of simultaneous-multi-pixel detection events by a factor of one plus the charge sharing correction factor.

Abstract: A radiation detector unit includes an interposer, at least one radiation sensor bonded to a front side of an interposer, an application-specific integrated chip (ASIC) bonded to a backside of the interposer, a carrier board bonded to the backside of the interposer and located on a backside of the ASIC, and at least one flex cable assembly attached to a respective side of the carrier board.

Abstract: Various embodiments described herein may include a detector array for a CT imaging system. The detector array includes a pixel array in which each pair of adjacent pixels in the pixel array may be separated by a collimator (e.g., located between each row and column of the pixel array) that absorbs photons and each pixel in the pixel array includes a sub-pixel array. The collimator absorbs photons that strike at a boundary between adjacent pixels. Each sub-pixel may have an anode that is connected to an ASIC channel. When a sub-pixel in a pixel detects a photon, signals of a plurality of sub-pixels in the pixel are automatically summed, including the sub-pixel that detected the photon.

Abstract: A detector element circuit for a CT imaging system may include a plurality of sensors for detecting photons passing through an object and a first electronic component configured to determine an energy of photons detected by the plurality of sensors and generate photon count data, which may be a count of detected photons in one or more energy bins. The detector element circuit may further include a second electronic component configured to receive the photon count data from the first electronic component and is clocked at a first clock rate; a local memory storage configured to receive the photon count data from the second electronic component at the first clock rate and to output the photon count data at a second clock rate.

Abstract: Various embodiments described herein may include a detector array for a CT imaging system. The detector array includes a pixel array in which each pair of adjacent pixels in the pixel array may be separated by a collimator (e.g., located between each row and column of the pixel array) that absorbs photons and each pixel in the pixel array includes a sub-pixel array. The collimator absorbs photons that strike at a boundary between adjacent pixels. Each sub-pixel may have an anode that is connected to an ASIC channel When a sub-pixel in a pixel detects a photon, signals of a plurality of sub-pixels in the pixel are automatically summed, including the sub-pixel that detected the photon.

Abstract: A detector slice circuit for a CT imaging system may include a plurality of sensors for detecting photons passing through an object and a first electronic component configured to determine an energy of photons detected by the plurality of sensors and generate photon count data, which may be a count of detected photons in one or more energy bins. The detector slice circuit may further include a second electronic component configured to receive the photon count data from the first electronic component and is clocked at a first clock rate; a local memory storage configured to receive the photon count data from the second electronic component at the first clock rate and to output the photon count data at a second clock rate.

Abstract: A device includes (a) radiation detector including a semiconductor substrate having opposing front and rear surfaces, a cathode electrode located on the front surface of said semiconductor substrate, and a plurality of anode electrodes on the rear surface of said semiconductor substrate, (b) a printed circuit board, and (c) an electrically conductive polymeric film disposed between circuit board and the anode electrodes. The polymeric film contains electrically conductive wires. The film bonds and electrically connects the printed circuit board and anode electrodes.

Abstract: A device includes (a) radiation detector including a semiconductor substrate having opposing front and rear surfaces, a cathode electrode located on the front surface of said semiconductor substrate, and a plurality of anode electrodes on the rear surface of said semiconductor substrate, (b) a printed circuit board, and (c) an electrically conductive polymeric film disposed between circuit board and the anode electrodes. The polymeric film contains electrically conductive wires. The film bonds and electrically connects the printed circuit board and anode electrodes.

Abstract: A radiation detector is described having a semiconductor substrate with opposing front and rear surfaces, a cathode electrode located on the front surface of said semiconductor substrate, a plurality of anode electrodes located on the rear surface of said semiconductor substrate and a solder mask disposed above the anode electrodes. The solder mask has openings extending to the anode electrodes for placing solder in said openings.

Abstract: A radiation detector includes a semiconductor substrate with opposing front and rear surfaces, where a cathode electrode is located on the front surface, a plurality of anode electrodes located on the rear surface, and an electrically conductive housing is placed in electrical contact with the cathode electrode.

Abstract: A radiation detector includes a semiconductor substrate with opposing front and rear surfaces, where a cathode electrode is located on the front surface, a plurality of anode electrodes located on the rear surface, and an electrically conductive housing is placed in electrical contact with the cathode electrode.

Abstract: A radiation detector is described having a semiconductor substrate with opposing front and rear surfaces, a cathode electrode located on the front surface of said semiconductor substrate, a plurality of anode electrodes located on the rear surface of said semiconductor substrate and a solder mask disposed above the anode electrodes. The solder mask has openings extending to the anode electrodes for placing solder in said openings.