Patents by Inventor Glenn C. Mandigo

Glenn C. Mandigo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compositions for insulator and metal CMP and methods relating thereto
    Patent number: 6607424
    Abstract: A composition is provided which is useful for the polishing of a semiconductor wafer substrate comprising an organic polymer having a backbone comprised of at least 16 carbon atoms, the polymer having a plurality of moieties with affinity to surface groups on the semiconductor wafer surface. Another composition is provided which is useful for the polishing of a semiconductor wafer substrate comprising a surfactant having a carbon chain backbone comprised of at least 16 carbon atoms.
    Type: Grant
    Filed: August 22, 2000
    Date of Patent: August 19, 2003
    Assignee: Rodel Holdings, Inc.
    Inventors: Wesley D. Costas, James Shen, Glenn C. Mandigo, Terence M. Thomas, Craig D. Lack, Ross E. Barker, II
  • Chemical mechanical planarization of metal substrates
    Patent number: 6602436
    Abstract: A method of polishing a wafer in a carrier by a polishing pad, controlling a ratio of platen speed to carrier speed (PS to CS) within a specific range, or controlling a first polishing step with a PS to CS ratio in the range of about 150:1 to about 1:150 followed by a second polishing step with a platen speed of about 0 to 20 rpm while maintaining the carrier speed used in the first polishing step, which maximizes clearing of residual material removed from a patterned wafer surface by polishing.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: August 5, 2003
    Assignee: Rodel Holdings, Inc
    Inventors: Glenn C. Mandigo, Ross E. Barker, II, Craig D. Lack, Ian G. Sullivan, Wendy B. Goldberg
  • Polishing composition
    Publication number: 20020062600
    Abstract: A polishing composition for chemical mechanical polishing of semiconductor wafers having a copper metal circuit includes, an aqueous composition having a pH of under 5.0, and polyacrylic acid having a number average molecular weight of about 20,000-150,000, or blends of high and low number average molecular weight polyacrylic acids.
    Type: Application
    Filed: August 9, 2001
    Publication date: May 30, 2002
    Inventors: Glenn C. Mandigo, Terence M. Thomas, Craig D. Lack, Ross E. Lack, Jinru Bian, Tirthankar Ghosh
  • Chemical mechanical planarization of metal substrates
    Publication number: 20020058426
    Abstract: A method of polishing a wafer in a carrier by a polishing pad, controlling a ratio of platen speed to carrier speed (PS to CS) within a specific range, or controlling a first polishing step with a PS to CS ratio in the range of about 150:1 to about 1:150 followed by a second polishing step with a platen speed of about 0 to 20 rpm while maintaining the carrier speed used in the first polishing step, which maximizes clearing of residual material removed from a patterned wafer surface by polishing.
    Type: Application
    Filed: August 9, 2001
    Publication date: May 16, 2002
    Inventors: Glenn C. Mandigo, Ross E. Barker, Craig D. Lack, Ian G. Sullivan, Wendy B. Goldberg