Abstract: A family of slurries useful in modifying exposed surfaces of wafers for semiconductor fabrication are provided along with methods of modifying exposed surfaces of wafers for semiconductor fabrication utilizing such a family of working slurries, and semiconductor wafers.

Abstract: The present invention relates to a process for the preparation of substituted alkanesulfonates by the reaction of an aqueous metal substituted 2-hydroxyethanesulfonate with a nucleophile. 2-Alkylaminoalkanesulfonate is formed when the nucleophile is an amine. The invention also relates to the optimization of reaction conditions to produce an optimum yield.

Abstract: A family of slurries are disclosed which are useful in modifying exposed surfaces of wafers for semiconductor fabrication are provided along with methods of modifying exposed surfaces of wafers for semiconductor fabrication utilizing such a family of working slurries, and semiconductor wafers. The slurries of the invention are comprised of a liquid carrier; a sulfur-bearing compounds capable of converting copper to copper sulfide; optionally, abrasive particles (polishing agent; optionally a chelating agent; optionally a buffering agent; optionally, a stopping compound; optionally, other additives; and optionally, a co-solvent.

Abstract: A family of slurries useful in modifying exposed surfaces of wafers for semiconductor fabrication are provided along with methods of modifying exposed surfaces of wafers for semiconductor fabrication utilizing such a family of working slurries, and semiconductor wafers.

Abstract: A family of slurries useful in modifying exposed surfaces of wafers for semiconductor fabrication are provided along with methods of modifying exposed surfaces of wafers for semiconductor fabrication utilizing such a family of working slurries, and semiconductor wafers.

Abstract: A family of slurries are disclosed which are useful in modifying exposed surfaces of wafers for semiconductor fabrication are provided along with methods of modifying exposed surfaces of wafers for semiconductor fabrication utilizing such a family of working slurries, and semiconductor wafers. The slurries of the invention are comprised of a liquid carrier; a sulfur-bearing compounds capable of converting copper to copper sulfide; optionally, abrasive particles (polishing agent; optionally a chelating agent; optionally a buffering agent; optionally, a stopping compound; optionally, other additives; and optionally, a co-solvent.

Abstract: A family of slurries useful in modifying exposed surfaces of wafers for semiconductor fabrication are provided along with methods of modifying exposed surfaces of wafers for semiconductor fabrication utilizing such a family of working slurries, and semiconductor wafers.

Abstract: This invention describes a computer application system and method for automatically deriving data mappings by processing stored data mappings. Derived data mappings are system generated data mappings. The system comprises a plurality of stored data mappings, a data mapping report generator, and a data mapping tool. Heretofore, data mappings were created by human analysis of data from two or more sources to determine the relationship between data fields. This time consuming process has been eliminated by the present invention. The derived data mappings may be stored for later use or provided to other system programs. The derivation may be performed at various levels of abstraction. Derived data mappings that should not be used are also identified.