Abstract: System, methods and apparatus are described that facilitate transmission of data, particularly between two devices within an electronic apparatus. Data is selectively transmitted as N-phase polarity encoded symbols or as packets on differentially driven connectors. A data transfer method comprises encoding data and control signals in a sequence of symbols to be transmitted on a plurality of connectors, and transmitting the sequence of symbols on the plurality of connectors. Each symbol may be transmitted using a combination of a phase state of a first pair of connectors, a polarity of a second pair of connectors, and a selection of at least one undriven connector. Transmission of each symbol in the sequence of symbols may cause a change of state for at least one of the plurality of connectors.

Abstract: System, methods and apparatus are described that facilitate transmission of data, particularly between two devices within an electronic apparatus. Data is selectively transmitted as N-phase polarity encoded symbols or as packets on differentially driven connectors. A data transfer method comprises encoding data and control signals in a sequence of symbols to be transmitted on a plurality of connectors, and transmitting the sequence of symbols on the plurality of connectors. Each symbol may be transmitted using a combination of a phase state of a first pair of connectors, a polarity of a second pair of connectors, and a selection of at least one undriven connector. Transmission of each symbol in the sequence of symbols may cause a change of state for at least one of the plurality of connectors.

Abstract: System, methods and apparatus are described that facilitate transmission of data, particularly between two devices within an electronic apparatus. Data is selectively transmitted as N-phase polarity encoded symbols or as packets on differentially driven connectors. A desired operational mode for communicating between the two devices is determined, an encoder is selected to drive a plurality of connectors communicatively coupling the two devices, and a plurality of drivers is configured to receive encoded data from the encoder and drive the plurality of connectors. Switches may couple outputs of the selected encoder to the plurality of drivers. One or more outputs of another encoder may be caused or forced to enter a high impedance mode.

Abstract: System, methods and apparatus are described that facilitate transmission of data, particularly between two devices within an electronic apparatus. Data is selectively transmitted as N-phase polarity encoded symbols or as packets on differentially driven connectors. A desired operational mode for communicating between the two devices is determined, an encoder is selected to drive a plurality of connectors communicatively coupling the two devices, and a plurality of drivers is configured to receive encoded data from the encoder and drive the plurality of connectors. Switches may couple outputs of the selected encoder to the plurality of drivers. One or more outputs of another encoder may be caused or forced to enter a high impedance mode.

Abstract: System, methods and apparatus are described that facilitate transmission of data, particularly between two devices within an electronic apparatus. Information is transmitted in N-phase polarity encoded symbols. Data is encoded in multi-bit symbols, and the multi-bit symbols are transmitted on a plurality of connectors. The multi-bit symbols may be transmitted by mapping the symbols to a sequence of states of the plurality of connectors, and driving the connectors in accordance with the sequence of states. The timing of the sequence of states is determinable at a receiver at each transition between sequential states. The state of each connector may be defined by polarity and direction of rotation of a multi-phase signal transmitted on the each connector.

Abstract: System, methods and apparatus are described that facilitate transmission of data, particularly between two devices within an electronic apparatus. Data is selectively transmitted as N-phase polarity encoded symbols or as packets on differentially driven connectors. A desired operational mode for communicating between the two devices is determined, an encoder is selected to drive a plurality of connectors communicatively coupling the two devices, and a plurality of drivers is configured to receive encoded data from the encoder and drive the plurality of connectors. Switches may couple outputs of the selected encoder to the plurality of drivers. One or more outputs of another encoder may be caused or forced to enter a high impedance mode.

Abstract: System, methods and apparatus are described that facilitate transmission of data, particularly between two devices within an electronic apparatus. Data is selectively transmitted as N-phase polarity encoded symbols or as packets on differentially driven connectors. A desired operational mode for communicating between the two devices is determined, an encoder is selected to drive a plurality of connectors communicatively coupling the two devices, and a plurality of drivers is configured to receive encoded data from the encoder and drive the plurality of connectors. Switches may couple outputs of the selected encoder to the plurality of drivers. One or more outputs of another encoder may be caused or forced to enter a high impedance mode.

Abstract: System, methods and apparatus are described that facilitate transmission of data, particularly between two devices within an electronic apparatus. Data is selectively transmitted as N-phase polarity encoded symbols or as packets on differentially driven connectors. A data transfer method comprises encoding data and control signals in a sequence of symbols to be transmitted on a plurality of connectors, and transmitting the sequence of symbols on the plurality of connectors. Each symbol may be transmitted using a combination of a phase state of a first pair of connectors, a polarity of a second pair of connectors, and a selection of at least one undriven connector. Transmission of each symbol in the sequence of symbols may cause a change of state for at least one of the plurality of connectors.

Abstract: A structure and method for achieving a flip-chip semiconductor device having plated copper inductors (4), transformers (16), interconnect, and power busing that is electrically superior, lower cost, and provides for higher quality inductors as well as lower losses for on-chip transformers. Providing a solder dam (8, 24, 28) enables the fabrication of flip-chip solder bumps directly on to inductors and transformers.

Abstract: A structure and method for achieving a flip-chip semiconductor device having plated copper inductors (4), transformers (16), interconnect, and power busing that is electrically superior, lower cost, and provides for higher quality inductors as well as lower losses for on-chip transformers. Providing a solder dam (8, 24, 28) enables the fabrication of flip-chip solder bumps directly on to inductors and transformers.

Abstract: An optoelectric interconnect (70) includes an optical fiber (17) coupled to a ferrule (11) and an optoelectric board (20). Metal layer (14) is disposed over a surface (12) of the ferrule (11). An optoelectric device (61) is coupled to the optoelectric board (20) using tape automated bonding tapes (47, 51). The optoelectric board (20) and the ferrule (11) are positioned adjacent each-other so that optical radiation is transmitted from the optoelectric device (61) to the optical fiber (17). The position of the optoelectric device (61) is adjusted to achieve an optimum position which is characterized by a maximum optical radiation transmitted to the optical fiber(17). Upon achieving the optimum position, two bonding strips (54, 56) are fused with the metal layer (14) on the surface (12) of the ferrule (11).

Abstract: A method for encapsulating a surface of an integrated circuit to protect the surface. The surface has an outer peripheral area and an inner area to be encapsulated. A frame is provided for handling an integrated circuit package. A plurality of leads are coupled between the frame and the outer peripheral area. An encapsulation material is dispensed on the outer peripheral area covering and protecting a portion of the leads and integrated circuit. A planar encapsulation material is deposited for covering and protecting the inner area. The planar encapsulation material provides a planar surface.