Abstract: The invention provides a device for generating energy, utilizing a fuel cell. Air is freely guided to the fuel cell, while a fuel gas is provided to the fuel cell from a pressurized fuel supply via a regulator. The portable power supply is most applicable to use with handheld electric devices, and contains a fuel storage means (110) for storing a supply of fuel, a fuel delivery means (120) connected to the fuel storage means, an energy conversion device (140) connected to the fuel delivery means for converting the fuel to electricity. The fuel storage means, the fuel delivery means, and the energy conversion device are all contained in a volume less than 500 cubic centimeters.

Abstract: An antenna (100) includes a radiating element (202) covered with a protective jacket having at least one pocket selectively located therein. The at least one pocket (102) is filled with a material (105) having an absorptive index substantially higher than the index of the protective jacket (102). This material imposes substantial restriction to the free radiation of radio frequency energy. Conversely, the remainder of the jacket (102) with no pockets provides for the unrestricted radiation of the radio frequency energy therethrough. As a result the antenna (100) directionally radiates energy without the use of reflectors or additional radiating elements.

Abstract: A solderless electrical interconnection is made using electrically conductive hook fasteners (15) that are embedded in a substrate (12). The upper part (20) of the fastener is exposed on the top side of the substrate, the central part (22) is embedded within the substrate itself, and the lower or hook portion (17) of the fastener protrudes from the bottom side of the substrate. Electrically conductive pathways (30), defined on the top side of the substrate, make contact with the exposed upper part of the hook fastener. The electrically conductive runners on the top side have a continuous signal path through the substrate to the bottom side of the substrate via the electrically conductive hook fastener. The hook fastener (15) is engaged to electrically conductive loop fasteners (60) on a second substrate (70) in order to create a solderless electrical interconnection and mechanical interlocking between the two substrates.

Abstract: An automated method of predicting the number of defects that will occur during the manufacturing of a new electronic assembly design on a specific assembly line. Defective components are counted (214) as they are manufactured on an assembly line (210). The counted defects are stored in a historical database (220) and the defect rate is calculated. A bill of material for the new electronic design (230) is enumerated and information associated with each component is extracted from a library database (240) into a quality forecasting engine (250). The quality forecasting engine imports the enumerated bill of material and imports the stored defect rate from the historical database to perform a calculation of a predicted number of defects (260) for said new electronic assembly using the extracted library information.

Abstract: A one-way optical communication system adapted for vehicular use. A light-readable indicia (35) is embedded in a window or mounted on an exterior portion of a moving motor vehicle (10). The indicia (15) is transparent to visible light and is reflective to infrared or ultraviolet light, making it generally invisible to the unaided human eye. A beam (30) of infrared or ultraviolet light located in a fixed position remote from the moving vehicle illuminates the indicia and portions of the beam are reflected from the illuminated indicia in a representative pattern. The reflected beam is detected by a fixed sensor (25), which provides an electrical signal. The signal is analyzed to determine the identity of the motor vehicle.

Abstract: A multipoint electrical interconnection (10) provides a plurality of electrical pathways between electrically conductive hooks (15) on a substrate (12) and an electrical component (50). A plurality of electrically conductive hooks generally formed in the shape of a `J` have a head portion (20) affixed to the substrate such that a hook portion (17) protrudes above the substrate. An electrically conductive portion of a component is disposed against the substrate such that it contacts at least three of the electrically conductive hooks and deforms the hooks. The deformed hooks provide a spring force to effect a multipoint electrical connection.

Abstract: An adaptable mold assembly (10) consists of two mold bases (100, 102). One or both of the mold bases has at least one interchangeable portion (104, 105) removably mounted on the mold base, whose function is to actuate in a direction different from the draw direction. The interchangeable portion is typically used to facilitate the removal of the molded part from the mold, and often functions as a mold slide or pull. The ability to interchange and reconfigure the mold base reduces tooling costs and adds design flexibility to the tool. In another embodiment of the invention, the function of the interchangeable portion (106) is to provide process monitoring, process control or process optimization.

Abstract: A process for designing and optimally fabricating a plastic object begins by creating a surface model (215) of the object on a digital computer. The surface model contains information about the exterior of the product. A set of constraints (222) that are based on physical attributes of the product and resources available to make the product is defined, and is used to determine an optimum path (223) through a set of manufacturing processes (230) by selecting certain of those processes. A precedence relationship between the selected processes creates a set of interconnected activities. The surface model is processed (224) to convert the databank supporting the model to information that is usable by the selected processes, and this information is sent to the selected processes. Each process performs an activity in accordance with the defined precedence relationship, so that an output of the last one of the selected processes is the plastic object (235).

Abstract: A process for molding dimensionally accurate plastic articles using a low pressure injection molding technique. The process utilizes a two-piece silicone rubber mold having a cavity representative of the shape of the article to be molded. The mold is substantially encased on all sides in a rigid mold box to prevent deformation of the cavity during the molding process (10). The mold box and the encased mold are placed in a vacuum chamber, and a vacuum is drawn on the chamber to evacuate the cavity (20). A predetermined amount of a reactive mixture is simultaneously mixed and injected under pressure into the mold to form the plastic article (30). The amount of material injected is sufficient to fill the cavity but not sufficient to distort the cavity. The chamber is vented (40) and the mold is removed from the mold box (50). The mold is flexed in order to remove the plastic article from the mold (60).

Abstract: A portable battery charger (102) for use with a variety of battery packs (106) is capable of determining and applying the appropriate charge voltage and current. Electronic circuitry (128) within the portable battery charger identifies the type of battery pack to be charged and selects the appropriate set of battery banks (120) in the charger. Sensors (132) determine the state of charge of the battery pack and a controller (128) controls the functions of the charger. A multiplicity of connectors (314) on the portable battery charger are provided to allow connection to a variety of battery packs. The charger first identifies the type of battery pack and determines the charging profile to be used to charge the battery pack. The charging profile is set in the portable charger by selecting the appropriate sources of electrical power, and the battery pack is then appropriately charged.

Abstract: A liquid crystal display device (11) is made by sputtering a layer of indium-tin oxide and copper on a transparent substrate. This metal layer is photodelineated to form a pattern of electrodes (17) and heating elements (81), the heating elements being interlaced between the electrodes. The heating elements are converted to a more resistive form by applying a constant voltage signal to only the heating elements in an oxygen-containing atmosphere. The assembled LCD has the heating elements on the inside of the display, so that when the heating elements are pulsed, they heat only a portion of the liquid crystal fluid in the immediate proximity. The heaters are activated by a signal from a display driver.

Abstract: A chip carrier (20) includes a substrate (11) having a first copper pattern (12) deposited on a first surface (13), and a second copper pattern (14) deposited on a second surface (16). The second copper pattern (14) is plated with a metallic material to form wire bondable areas (18) on the second copper pattern (14), however, the first copper pattern (12) is substantially devoid of the metallic material. A device (21) is wire bonded to the wire bondable areas (18) of the second copper pattern (14), and a protective covering (23) covers the wire bondable areas (18).

Abstract: A selectively releasing runner and substrate assembly (10) comprises a plurality of conductive runners (16) adhered to a substrate (12). A portion (18) of at least some of the conductive runners have a lower adhesion to the substrate for selectively releasing the conductive runner from the substrate when subjected to thermal stress. The selectively releasing runner and substrate assembly is made by selectively depositing an adhesion layer (14) of a first metal to portions of the surface of the substrate where maximum adhesion is desired. The other portions of the substrate are not covered with the first metal. The first metal layer and the uncovered portions of the substrate surface are covered with a second metal layer (16). The adhesion of the second metal layer to the substrate is less than the adhesion of the second metal layer to the first metal layer, and less than the adhesion of the first metal layer tot he substrate. The second metal layer may be copper.

Abstract: An encapsulated electronic package (10) is made by bonding one or more semiconductor devices or integrated circuits (16) to a printed circuit board with an adhesive (14), and covering with a glob top encapsulant (15). The printed circuit board has a metal circuit pattern (12) on one side, and, optionally, solder pads (27) on the second side. The glob top encapsulant covers the integrated circuit, portions of the metal circuit pattern, and portions of the printed circuit board surface. The printed circuit board, the adhesive, and the encapsulant are all made from the same type of resin. In the preferred embodiment of the invention, the resin used to make the printed circuit board, the adhesive, and the encapsulant is an organosilicon polymer comprised substantially of alternating polycyclic hydrocarbon residues and cyclic polysiloxane or siloxysilane residues linked through carbon-silicon bonds.

Abstract: A selectively releasing runner and substrate assembly 10 comprises a plurality of conductive runners 16 adhered to a substrate 12, a portion 18 of at least some of the conductive runners 16 have a lower adhesion to the substrate for selectively releasing the conductive runner from the substrate when subjected to a predetermined stress.

Abstract: A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 25) of the printed circuit board (22). A protective plastic cover (26) is transfer molded about the semiconductor device (24) covering substantially all of the top side of the printed circuit board (22).

Abstract: A solder interconnection verification system is used in verifying the formation of solder joints which are hidden from view under a component (25). Solder material (28) is attached or reflow soldered to component solder pads (26). The substrate solder pads (22) have a small solderable portion (24) attached to, and extending outward from, the solder pads (22). The component is placed on the substrate (20) and reflow soldered to wet the solder (38) to the substrate solder pads (32 and 34), creating an irregularly shaped solder joint (38). The joint (38) thus formed is inspected using x-rays after reflow.

Abstract: An adhesive material 220 including a fluxing agent and metal particles 240 is applied to either a substrate 200 having a metallization pattern 210 or an electrical component 230. The component 230 is positioned on the substrate 210 and heated. During the heating step, the fluxing agent promotes adhesion of the metal particles 240 to the substrate metallization pattern 210 and the component, and the adhesive material 220 is cured, to mechanically interconnect and encapsulate the substrate 210 and the component 230.

Abstract: Printed circuit patterns are photolithographically defined on a three dimensional "projection" surface (204) of a printed circuit substrate (202) using a projection image aligner and a photomask (210) having a planar image (210A). The geometry of the projection is restricted such that the slope of the projection surface, as measured at any point on the projection surface and relative to a reference plane which is parallel to the focal plane of the projection image aligner, is less than 90 degrees. A solution of photoresist includes a photoresist solvent, a fluorosurfactant and an aromatic hydrocarbon solvent, and is preferably sprayed over the projection surface. In one method of manufacture, the printed circuit substrate is moved from one position to another during the exposure of the photoresist layer (206). In another method, after a first portion of the projection surface is exposed by a first photomask (502), a second photomask (504) is substituted and the remainder of the projection surface exposed.

Abstract: A molded thermoplastic housing (100) includes base (102) and cover (104) members joined by a living hinge (106). The base member (102) includes a peripheral wall (108). Four solderable printed circuit patterns (112, 114, 116 and 118) are vacuum deposited onto the interior and exterior surfaces of both housing members. The printed circuit patterns on opposing surfaces of the base and cover members are joined by conductive through-holes (e.g., 120 and 122), while the printed circuit patterns on the interior surfaces of the base and cover members are joined by an interconnecting printed circuit pattern (124) which is vacuum deposited onto the living hinge. Mylar sheets (132) are adhered to the exterior surface of the housing to insulate the exterior printed circuit patterns. An antenna pattern (126) is also vacuum deposited onto an exterior surface of the housing.