Patents by Inventor Glenn Forman
Glenn Forman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11309304Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: GrantFiled: April 18, 2018Date of Patent: April 19, 2022Assignee: General Electric CompanyInventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Publication number: 20180240789Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: ApplicationFiled: April 18, 2018Publication date: August 23, 2018Inventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Patent number: 10014286Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: GrantFiled: May 8, 2009Date of Patent: July 3, 2018Assignee: General Electric CompanyInventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Patent number: 8940582Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: GrantFiled: August 19, 2013Date of Patent: January 27, 2015Assignee: General Electric CompanyInventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Publication number: 20130344653Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: ApplicationFiled: August 19, 2013Publication date: December 26, 2013Applicant: General Electric CompanyInventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Patent number: 8611706Abstract: The present disclosure includes apparatus, system, and method embodiments that provide micro electro mechanical system optical switching and methods of manufacturing switches. For example, one optical switch embodiment includes at least one micro electro mechanical system type pivot mirror structure disposed along a path of an optical signal, the structure having a mirror and an actuator, and the mirror having a pivot axis along a first edge and having a second edge rotatable with respect to the pivot axis, the mirror being capable of and arranged to be actuated to pivot between a position parallel to a plane of an optical signal and a position substantially normal to the plane of the optical signal.Type: GrantFiled: November 10, 2008Date of Patent: December 17, 2013Assignee: Lockheed Martin CorporationInventors: Kevin J. Thorson, Rick C. Stevens, Charles J. Kryzak, Brian S. Leininger, William P. Kornrumpf, Glenn A. Forman, Joseph A. Iannotti, Olga B. Spahn, William D. Cowan, Daryl J. Dagel
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Patent number: 8536700Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: GrantFiled: May 5, 2011Date of Patent: September 17, 2013Assignee: General Electric CompanyInventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Publication number: 20120171816Abstract: An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side, the first side having a plurality of contact locations and a plurality of non-contact locations. The package includes a plurality of components, each component having a first surface and a second surface, wherein the first surface of each of the plurality of components is affixed to a corresponding one of the plurality of contact locations of the dielectric film absent a layer of adhesive therebetween that is distinct from a material of the dielectric film.Type: ApplicationFiled: December 15, 2011Publication date: July 5, 2012Inventors: Christopher James Kapusta, Glenn Forman, James Sabatini
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Patent number: 8026608Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: GrantFiled: March 24, 2009Date of Patent: September 27, 2011Assignee: General Electric CompanyInventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Publication number: 20110210440Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: ApplicationFiled: May 5, 2011Publication date: September 1, 2011Inventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Publication number: 20110156261Abstract: An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side, the first side having a plurality of contact locations and a plurality of non-contact locations. The package includes a plurality of components, each component having a first surface and a second surface, wherein the first surface of each of the plurality of components is affixed to a corresponding one of the plurality of contact locations of the dielectric film absent a layer of adhesive therebetween that is distinct from a material of the dielectric film.Type: ApplicationFiled: March 24, 2009Publication date: June 30, 2011Inventors: Christopher James Kapusta, Glenn Forman, James Sabatini
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Publication number: 20100244225Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: ApplicationFiled: March 24, 2009Publication date: September 30, 2010Inventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Publication number: 20100244226Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: ApplicationFiled: May 8, 2009Publication date: September 30, 2010Inventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Publication number: 20080057623Abstract: A flexible electronic circuit member formed of a plurality of dielectric layers includes a plurality of thinned semiconductor chips embedded within the circuit member for increased levels of integration and component density. The thinned semiconductor chips may include various integrated circuits thereon. They may be formed on various substrates and using various technologies and the embedded, thinned semiconductor chips are interconnected by a patterned interconnect that extends between and through the respective dielectric layers. A method for forming the flexible circuit member includes joining semiconductor chips to a mounting apparatus using a releasable bonding layer then forming thinned semiconductor chips that are joined to respective dielectric layers that combine to form the flexible electronic circuit member. The releasable bonding layer is removed after the thinned semiconductor chips are joined to the respective dielectric layers used in combination to form the electronic circuit member.Type: ApplicationFiled: October 31, 2007Publication date: March 6, 2008Inventors: Glenn Forman, Kelvin Ma
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Publication number: 20060249754Abstract: A flexible electronic circuit member formed of a plurality of dielectric layers includes a plurality of thinned semiconductor chips embedded within the circuit member for increased levels of integration and component density. The thinned semiconductor chips may include various integrated circuits thereon. They may be formed on various substrates and using various technologies and the embedded, thinned semiconductor chips are interconnected by a patterned interconnect that extends between and through the respective dielectric layers. A method for forming the flexible circuit member includes joining conventional semiconductor chips to a mounting apparatus then grinding the semiconductor chips to form thinned semiconductor chips that are joined to respective dielectric layers that combine to form the flexible electronic circuit member.Type: ApplicationFiled: May 3, 2005Publication date: November 9, 2006Inventors: Glenn Forman, Kelvin Ma
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Publication number: 20060126990Abstract: A system for estimating a parameter selected from the group consisting of a current, a magnetic field, or combinations thereof comprises a resonant frequency tunable magneto-optical loop resonator, wherein the loop resonator comprises a magneto-optical sensing element coupled to an optical waveguide, and wherein the loop resonator is configured for receiving an originating optical signal from a broadband light source and providing a modulated signal indicative of the estimated parameter.Type: ApplicationFiled: December 13, 2004Publication date: June 15, 2006Inventors: Kung-Li Deng, Glenn Forman
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Publication number: 20060089546Abstract: A non-intrusive physiological data measurement system and method, as well as an optically induced treatment system, are described. The measurement system includes a monitoring mechanism that includes light emitter modules capable of emitting light at at least two wavelengths. The light emitted from the light emitter modules is transmitted through a subject and to a light receiving mechanism, such as an optical sensor. Physiological data is taken from the received light. The system also can ascertain movement of the subject by obtaining an initial outline of the subject and comparing that outline with a subsequently obtained outline. A therapeutic optic system includes a non-adhering light emitting mechanism for providing light at therapeutic wavelengths.Type: ApplicationFiled: October 27, 2004Publication date: April 27, 2006Inventors: Michael Mahony, John Hershey, Glenn Forman, Harold Tomlinson, William Powell
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Publication number: 20060089558Abstract: A physiological parameter monitoring system and method is described. The system includes a plurality of sensors configured to obtain from a subject at least one observable voltage containing two or more signals. The system also includes a data manager and a data auxiliary device. The data manager is in communication with the plurality of sensors and is configured to assemble and format data obtained by the plurality of sensors. The data manager is configured to isolate one of the two or more signals. The method includes placing a plurality of sensors in communication with a subject, transmitting data from the plurality of sensors to a data manager, and isolating a desired voltage signal from the plurality of voltage signals.Type: ApplicationFiled: October 27, 2004Publication date: April 27, 2006Inventors: Kenneth Welles, John Hershey, Glenn Forman, Jeffrey Ashe, Richard Zinser
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Patent number: 6956796Abstract: High-capacity pick-up mechanisms operable for selectively reading data from and/or writing data to one or more surfaces of one or more optical storage media are disclosed. These mechanisms comprise a first pivotable structure, a second pivotable structure, a first reflective element, a second reflective element, a light source, and a light receiving device. The light source and the light receiving device are remotely located from the reflective elements via the pivotable structures, and only the reflective elements and a portion of the pivotable structure are positioned adjacent the surface of an optical storage medium. High-capacity optical read/write devices and systems comprising these high-capacity pick-up mechanisms are also disclosed.Type: GrantFiled: February 18, 2003Date of Patent: October 18, 2005Assignee: General Electric CompanyInventors: Kelvin Ma, Glenn Forman
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Patent number: RE47651Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: GrantFiled: January 25, 2017Date of Patent: October 15, 2019Assignee: General Electric CompanyInventors: James Sabatini, Christopher James Kapusta, Glenn Forman