Patents by Inventor Glenn G. Eagle

Glenn G. Eagle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11624012
    Abstract: Epoxy adhesives are made using core-shell rubbers and small amounts if any of other elastomeric materials. The epoxy adhesives contain a mixture of latent curing agents and/or high levels of calcium oxide. The adhesives exhibit excellent bonding properties even when an open or closed bead is exposed to humid air for prolonged periods before the epoxy adhesive is cured.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: April 11, 2023
    Assignee: DDP Speciality Electronic Materials US, LLC
    Inventor: Glenn G. Eagle
  • Publication number: 20190284454
    Abstract: Epoxy adhesives are made using core-shell rubbers and small amounts if any of other elastomeric materials. The epoxy adhesives contain a mixture of latent curing agents and/or high levels of calcium oxide. The adhesives exhibit excellent bonding properties even when an open or closed bead is exposed to humid air for prolonged periods before the epoxy adhesive is cured.
    Type: Application
    Filed: October 4, 2017
    Publication date: September 19, 2019
    Inventor: Glenn G. Eagle
  • Patent number: 10392539
    Abstract: Aspects of the present invention provide a one component epoxy adhesive composition having improved impact resistance at low temperatures, such as ?40° C. or less. In a first aspect, the adhesive includes one or more epoxy resins; at least one polyurethane based toughener; at least one amphipathic block copolymer; and one or more epoxy curing agents. In a further, aspect epoxy adhesive compositions having improved wash off resistance are also provided.
    Type: Grant
    Filed: August 13, 2015
    Date of Patent: August 27, 2019
    Assignee: Dow Global Technologies LLC
    Inventors: Gary L. Jialanella, Andreas Lutz, Eric E. Cole, Glenn G. Eagle, Rajesh H. Turakhia, Yanli Feng
  • Patent number: 10150893
    Abstract: An uncured adhesive contains 2 to 10 weight percent of particles of a semi-crystalline organic material, preferably a polyester having a number-average molecular weight of 2000 to 10,000, a hydroxyl number of 10 to 60, and a melting temperature of 50 to 125° C. The adhesive is applied by heating it just prior to application, to melt the particles. After application, the adhesive is cooled to below the melting temperature of the semi-crystalline organic material, and then cured. The process allows the adhesive to be stored and pumped at ambient temperatures, due to the moderate viscosity of the material. Upon melting and re-cooling the semi-crystalline organic material, the adhesive assumes a high yield stress that imparts very good wash-off resistance. In preferred embodiments, the adhesive composition includes an epoxy resin and an epoxy curing agent.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: December 11, 2018
    Assignee: Dow Global Technologies LLC
    Inventors: Glenn G. Eagle, Michael R. Golden, Andreas Lutz
  • Patent number: 10047250
    Abstract: A new adhesive composition containing glass beads and having unique properties in automotive related applications. The method of making such new adhesive composition.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: August 14, 2018
    Assignee: Dow Global Technologies LLC
    Inventors: Glenn G. Eagle, Andreas Lutz
  • Patent number: 9951256
    Abstract: Epoxy adhesive compositions contain a heat-activatable catalyst. The heat-activatable catalyst includes a tertiary amine catalyst and a novolac resin that has a weight average molecular weight of at least 3000. One-component epoxy adhesive formulations that contain the heat-activatable catalyst have unexpectedly good storage stability.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: April 24, 2018
    Assignee: Dow Global Technologies LLC
    Inventors: Ming Ming, Shaoguang Feng, Yan Fei Liu, Robert D J Froese, Andreas Lutz, Glenn G. Eagle, Gary L. Jialanella, Eric E. Cole, Michael R. Golden
  • Patent number: 9840646
    Abstract: The present invention provides low polyphenols (such as bisphenol A) tougheners for epoxy adhesives. The tougheners, and adhesives comprising the tougheners exhibit enhanced viscosity stability, e.g., compared to tougheners prepared from higher amounts of bisphenol A (and epoxy adhesives comprising them).
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: December 12, 2017
    Assignee: Dow Global Technologies LLC
    Inventors: Gary L. Jialanella, Glenn G. Eagle, Daniel Schneider, Andreas Lutz
  • Patent number: 9840070
    Abstract: A heat-curable structural adhesive includes a non-rubber-modified epoxy resin, a reaction product of a carboxyl-or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin, a elastomeric toughener containing capped isocyanate groups, one or more epoxy curing agents a moisture scavenger and a heat activatable catalyst comprising a mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin. The structural adhesive develops excellent bonding properties when cured at moderate temperatures, especially from 120 to 170° C., and in addition performs very well in environmental aging stress testing. The adhesive is particularly good for bonding aluminum to another metal, or bonding aluminum to aluminum.
    Type: Grant
    Filed: March 22, 2013
    Date of Patent: December 12, 2017
    Assignee: Dow Global Technologies LLC
    Inventors: Gary L. Jialanella, Glenn G. Eagle, Dakai Ren, Andreas Lutz
  • Publication number: 20170349795
    Abstract: An epoxy adhesive composition having a higher level (at or above 5 wt %) of a blocked tertiary amine catalyst, a urethane toughener, an epoxy resin modified with liquid rubber, a core shell rubber toughener and a combination of liquid and solid epoxy resins and the making thereof.
    Type: Application
    Filed: February 8, 2016
    Publication date: December 7, 2017
    Inventors: Bharati Balijepalli, Glenn G. Eagle
  • Publication number: 20170292049
    Abstract: Aspects of the present invention provide a one component epoxy adhesive composition having improved impact resistance at low temperatures, such as ?40° C. or less. In a first aspect, the adhesive includes one or more epoxy resins; at least one polyurethane based toughener; at least one amphipathic block copolymer; and one or more epoxy curing agents. In a further, aspect epoxy adhesive compositions having improved wash off resistance are also provided.
    Type: Application
    Filed: August 13, 2015
    Publication date: October 12, 2017
    Inventors: Gary L. JIALANELLA, Andreas LUTZ, Eric E. COLE, Glenn G. EAGLE, Rajesh H. TURAKHIA, Yanli FENG
  • Publication number: 20170240778
    Abstract: A new adhesive composition containing glass beads and having unique properties in automotive related applications. The method of making such new adhesive composition.
    Type: Application
    Filed: November 3, 2015
    Publication date: August 24, 2017
    Applicants: Dow Europe GmbH, Dow Global Technologies LLC
    Inventors: Glenn G Eagle, Andreas Lutz
  • Publication number: 20170204301
    Abstract: An uncured adhesive contains 2 to 10 weight percent of particles of a semi-crystalline organic material, preferably a polyester having a number-average molecular weight of 2000 to 10,000, a hydroxyl number of 10 to 60, and a melting temperature of 50 to 125° C. The adhesive is applied by heating it just prior to application, to melt the particles. After application, the adhesive is cooled to below the melting temperature of the semi-crystalline organic material, and then cured. The process allows the adhesive to be stored and pumped at ambient temperatures, due to the moderate viscosity of the material. Upon melting and re-cooling the semi-crystalline organic material, the adhesive assumes a high yield stress that imparts very good wash-off resistance. In preferred embodiments, the adhesive composition includes an epoxy resin and an epoxy curing agent.
    Type: Application
    Filed: July 14, 2015
    Publication date: July 20, 2017
    Applicants: Dow Eurpoe GmbH, Dow Global Technologies LLC
    Inventors: Glenn G EAGLE, Michael R. GOLDEN, Andreas LUTZ
  • Publication number: 20170197397
    Abstract: A heat-curable structural adhesive includes a non-rubber-modified epoxy resin, a reaction product of a carboxyl- or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin, a elastomeric toughener containing capped isocyanate groups, one or more epoxy curing agents a moisture scavenger and a heat activatable catalyst comprising a mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin. The structural adhesive develops excellent bonding properties when cured at moderate temperatures, especially from 120 to 170° C., and in addition performs very well in environmental aging stress testing. The adhesive is particularly good for bonding aluminum to another metal, or bonding aluminum to aluminum.
    Type: Application
    Filed: March 27, 2017
    Publication date: July 13, 2017
    Inventors: Gary L. Jialanella, Glenn G. Eagle, Dakai Ren, Andreas Lutz
  • Patent number: 9346983
    Abstract: A heat-curable structural adhesive includes at least one non-rubber-modified epoxy resin; an optional rubber or toughener, one or more epoxy curing agents, one or more epoxy curing catalysts; and a flame retardant mixture that includes (i) alumina trihydrate, (ii) zinc borate and (iii) melamine or a melamine derivative. The structural adhesive is useful for bonding metals to other materials or metals to other metals. The structural adhesive strongly resists ignition when welding is performed in the presence of the uncured material, and does not interfere significantly with weld performance.
    Type: Grant
    Filed: March 22, 2013
    Date of Patent: May 24, 2016
    Assignee: Dow Global Technologies LLC
    Inventors: Glenn G. Eagle, Andreas Lutz, Gary L. Jialanella
  • Publication number: 20160040049
    Abstract: The present invention provides low polyphenols (such as bisphenol A) tougheners for epoxy adhesives. The tougheners, and adhesives comprising the tougheners exhibit enhanced viscosity stability, e.g., compared to tougheners prepared from higher amounts of bisphenol A (and epoxy adhesives comprising them).
    Type: Application
    Filed: October 21, 2015
    Publication date: February 11, 2016
    Inventors: Gary L. Jialanella, Glenn G. Eagle, Daniel Schneider, Andreas Lutz
  • Publication number: 20150166857
    Abstract: Epoxy adhesive compositions contain a heat-activatable catalyst. The heat-activatable catalyst includes a tertiary amine catalyst and a novolac resin that has a weight average molecular weight of at least 3000. One-component epoxy adhesive formulations that contain the heat-activatable catalyst have unexpectedly good storage stability.
    Type: Application
    Filed: March 3, 2015
    Publication date: June 18, 2015
    Inventors: Ming Ming, Shaoguang Feng, Yan Fei Liu, Robert DJ Froese, Andreas Lutz, Glenn G. Eagle, Gary L. Jialanella, Eric E. Cole, Michael R. Golden
  • Patent number: 9000120
    Abstract: Epoxy adhesive compositions contain a heat-activatable catalyst. The heat-activatable catalyst includes a tertiary amine catalyst and a novolac resin that has a weight average molecular weight of at least 3000. One-component epoxy adhesive formulations that contain the heat-activatable catalyst have unexpectedly good storage stability.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: April 7, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Ming Ming, Shaoguang Feng, Yan Fei Liu, Andreas Lutz, Robert D. Froese, Glenn G. Eagle, Gary L. Jialanella, Eric E. Cole, Michael R. Golden
  • Publication number: 20150025176
    Abstract: A heat-curable structural adhesive includes at least one non-rubber-modified epoxy resin; an optional rubber or toughener, one or more epoxy curing agents, one or more epoxy curing catalysts; and a flame retardant mixture that includes (i) alumina trihydrate, (ii) zinc borate and (iii) melamine or a melamine derivative. The structural adhesive is useful for bonding metals to other materials or metals to other metals. The structural adhesive strongly resists ignition when welding is performed in the presence of the uncured material, and does not interfere significantly with weld performance.
    Type: Application
    Filed: March 22, 2013
    Publication date: January 22, 2015
    Inventors: Glenn G. Eagle, Andreas Lutz, Gary L. Jialanella
  • Publication number: 20150001281
    Abstract: A heat-curable structural adhesive includes a non-rubber-modified epoxy resin, a reaction product of a carboxyl- or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin, a elastomeric toughener containing capped isocyanate groups, one or more epoxy curing agents a moisture scavenger and a heat activatable catalyst comprising a mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin. The structural adhesive develops excellent bonding properties when cured at moderate temperatures, especially from 120 to 170° C., and in addition performs very well in environmental aging stress testing. The adhesive is particularly good for bonding aluminum to another metal, or bonding aluminum to aluminum.
    Type: Application
    Filed: March 22, 2013
    Publication date: January 1, 2015
    Inventors: Gary L. Jialanella, Glenn G. Eagle, Dakai Ren, Andreas Lutz
  • Publication number: 20140171550
    Abstract: The present invention provides low polyphenols (such as bisphenol A) tougheners for epoxy adhesives. The tougheners, and adhesives comprising the tougheners exhibit enhanced viscosity stability, e.g., compared to tougheners prepared from higher amounts of bisphenol A (and epoxy adhesives comprising them).
    Type: Application
    Filed: July 16, 2012
    Publication date: June 19, 2014
    Inventors: Gary L. Jialanella, Glenn G. Eagle, Daniel Schneider, Andreas Lutz