Patents by Inventor Glenn Gengel
Glenn Gengel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220198118Abstract: An apparatus and method of manufacturing a motherboard is disclosed. The motherboard can include one or more electrochromic devices. The apparatus can include a central processing unit that executes instructions. The instructions and method can include mapping the motherboard, analyzing one or more electrochromic devices within a batch to determine a yield of each of the one or more electrochromic devices, prioritizing the one or more electrochromic devices based on the yield, and placing a first electrochromic device on the motherboard, where the first electrochromic device has the highest priority of the one or more electrochromic devices within the batch.Type: ApplicationFiled: December 17, 2021Publication date: June 23, 2022Inventors: Glenn GENGEL, Dallas AKRE, Steve PALM, Brian RUEHLE
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Patent number: 8516683Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.Type: GrantFiled: July 14, 2009Date of Patent: August 27, 2013Assignee: Alien Technology CorporationInventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph
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Patent number: 7615479Abstract: An electronic assembly. The assembly includes a substrate, a plurality of recessed regions, and a plurality of functional blocks. Each functional block is deposited in one of the recessed regions. A substantial amount of the plurality of functional blocks is recessed below a top surface of the substrate. Substantial amount is defined by any one of less than 10% of said functional blocks protrudes above the top surface of the substrate; less than 1% of the functional blocks protrudes above the top surface of the substrate; more than 90% of the functional blocks are recessed below the top surface of the substrate; or more than 99% of the functional blocks are recessed below the top surface of the substrate.Type: GrantFiled: June 22, 2005Date of Patent: November 10, 2009Assignee: Alien Technology CorporationInventors: Gordon S. W. Craig, Mark A. Hadley, Susan Swindlehurst, Ali A. Tootoonchi, Eric Kanemoto, Eric Jonathan Snyder, Scott Herrmann, Glenn Gengel, Lily Liong
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Publication number: 20090271973Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.Type: ApplicationFiled: July 14, 2009Publication date: November 5, 2009Inventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph
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Patent number: 7559131Abstract: Methods of making a radio frequency identification (RFID) tag. A flexible strap is provided by disposing a plurality of RFID chips on a first web of flexible material and removing the flexible strap from the first web and attaching the flexible strap to an antenna on a flexible substrate.Type: GrantFiled: July 2, 2007Date of Patent: July 14, 2009Assignee: Alien Technology CorporationInventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph
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Publication number: 20090056113Abstract: Methods and apparatuses for an electronic assembly. The method comprises depositing a functional block into a recessed region, forming dielectric layer selectively over at least one of a selected portion of the functional block and a selected portion of the first substrate; and forming one or more electrical interconnections to the functional block. The recessed region is formed on a first substrate. The depositing of the functional block occurs on a continuous web line and using a Fluidic Self Assembly process. The functional block has a width-depth aspect ratio that substantially matches a width-depth aspect ratio of said recessed region which is one of equal to or less than 10.5:1, and equal to or less than 7.5:1.Type: ApplicationFiled: November 10, 2008Publication date: March 5, 2009Inventors: Gordon S.W. Craig, Ali A. Tootoonchi, Scott Herrmann, Glenn Gengel, Randy Eisenhardt
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Patent number: 7452748Abstract: Methods and apparatuses for an electronic assembly. The method comprises depositing a functional block into a recessed region, forming dielectric layer selectively over at least one of a selected portion of the functional block and a selected portion of the first substrate; and forming one or more electrical interconnections to the functional block. The recessed region is formed on a first substrate. The depositing of the functional block occurs on a continuous web line and using a Fluidic Self Assembly process. The functional block has a width-depth aspect ratio that substantially matches a width-depth aspect ratio of said recessed region which is one of equal to or less than 10.5:1, and equal to or less than 7.5:1.Type: GrantFiled: June 22, 2005Date of Patent: November 18, 2008Assignee: Alien Technology CorporationInventors: Gordon S. W. Craig, Ali A. Tootoonchi, Scott Herrmann, Glenn Gengel, Randy Eisenhardt
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Publication number: 20080036087Abstract: Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.Type: ApplicationFiled: October 9, 2007Publication date: February 14, 2008Inventors: Jeffrey Jacobsen, Glenn Gengel, Mark Hadley, Gordon Craig, John Smith
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Publication number: 20070256291Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.Type: ApplicationFiled: July 2, 2007Publication date: November 8, 2007Inventors: Thomas Credelle, Glenn Gengel, Roger Stewart, William Joseph
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Patent number: 7260882Abstract: Methods for making electronic devices with small functional elements supported on a carrier are presented. One method of making an electronic assembly is by first providing the following: a web of flexible material having a plurality of recesses, where each of the recesses containing an RFID chip, a flexible substrate having antennas, straps from the web by a web process, where each of the straps includes at least one RFID chip and a portion of the flexible material. The electronic assembly is formed by attaching the straps to the antennas so that each of the straps is coupled to one of the antennas and the density of the RFID chips on the web is higher than a density of the antennas on the flexible substrate. Other methods of making electronic devices with small functional elements supported on a carrier are disclosed.Type: GrantFiled: July 22, 2005Date of Patent: August 28, 2007Assignee: Alien Technology CorporationInventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph
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Publication number: 20070117274Abstract: An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.Type: ApplicationFiled: January 16, 2007Publication date: May 24, 2007Inventors: Susan Swindlehurst, Mark Hadley, Paul Drzaic, Gordon Craig, Glenn Gengel, Scott Herrmann, Aly Tootoochi, Randolph Eisenhardt
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Patent number: 7214569Abstract: An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.Type: GrantFiled: January 30, 2004Date of Patent: May 8, 2007Assignee: Alien Technology CorporationInventors: Susan Swindlehurst, Mark A. Hadley, Paul S. Drzaic, Gordon S. W. Craig, Glenn Gengel, Scott Hermann, Aly Tootoochi, Randolph W. Eisenhardt
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Patent number: 6985361Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.Type: GrantFiled: September 27, 2004Date of Patent: January 10, 2006Assignee: Alien Technology CorporationInventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph
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Publication number: 20050270757Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.Type: ApplicationFiled: July 22, 2005Publication date: December 8, 2005Inventors: Thomas Credelle, Glenn Gengel, Roger Stewart, William Joseph
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Publication number: 20050181641Abstract: A flexible electronic, Radio Frequency Identification (RF ID) or display device and methods of making the same. The flexible electronic, Radio Frequency Identification (RF ID) or display device comprises a flexible substrate having a top surface and a bottom surface. The top surface comprises electrical components. The flexible substrate comprises openings cutting therethrough from the top surface to the bottom surface. A conductive layer is coupled to the flexible substrate wherein the openings expose at least a portion of the conductive layer. The openings are filled with conductive elements to make first electrical contacts to at least a portion of the conductive layer and second electrical contacts to the electrical components on the flexible substrate.Type: ApplicationFiled: February 8, 2005Publication date: August 18, 2005Inventors: Anno Hermanns, Randolph Eisenhardt, Glenn Gengel
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Publication number: 20050046018Abstract: Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.Type: ApplicationFiled: October 14, 2004Publication date: March 3, 2005Inventors: Jeffrey Jacobsen, Glenn Gengel, Mark Hadley, Gordon Craig, John Smith
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Patent number: 6816380Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.Type: GrantFiled: June 17, 2003Date of Patent: November 9, 2004Assignee: Alien Technology CorporationInventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph
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Publication number: 20040183182Abstract: An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.Type: ApplicationFiled: January 30, 2004Publication date: September 23, 2004Inventors: Susan Swindlehurst, Mark A. Hadley, Paul S. Drzaic, Gordon S.W. Craig, Glenn Gengel, Scott Herrmann, Aly Tootoochi, Randolph W. Eisenhardt
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Publication number: 20030214792Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.Type: ApplicationFiled: June 17, 2003Publication date: November 20, 2003Inventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph
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Patent number: 6606247Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.Type: GrantFiled: May 31, 2001Date of Patent: August 12, 2003Assignee: Alien Technology CorporationInventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph