Patents by Inventor Glenn Heuer

Glenn Heuer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for packaging thermoplastic compositions using a thermally conductive rigid mold
    Patent number: 5715654
    Abstract: A process of continuously packaging a thermoplastic composition such as a pressure sensitive hot melt adhesive. The method includes the steps of (a) forming a thermoplastic film to a rigid mold wherein said film becomes molten at or below the usage temperature of a hot melt adhesive composition, and the mold is in contact with ambient air; (b) dispensing hot melt adhesive into the lined mold; (c) disposing a thermoplastic film on the surface of the mold to form a packaged hot melt adhesive; (d) allowing the hot melt adhesive to reach a state in the presence of ambient air such that the packaged hot melt adhesive is removable from the mold.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: February 10, 1998
    Assignee: H. B. Fuller Licensing and Financing Inc.
    Inventors: Malcolm Taylor, George Bateson, Brian Posner, Glenn Heuer