Abstract: A camera assembly is disclosed which may be implemented on a mail processing system for photographing flats mail items. In one embodiment, the assembly includes lighting components (e.g., light emitting diodes) which are capable of projecting light toward a mail item in a viewing station at a specific angle, which angle may be adjusted to reduce the amount of specular reflection from an item toward a camera. The lighting components may reside in a nose unit which may be easily attached to and detached from the housing for ease of maintenance. The nose unit may be attachable to the housing in a manner which seals the camera and lighting components off from the operating environment, such that airborne dust and debris does not enter the housing or nose unit and damage the camera or lighting components.

Abstract: A mail box configured to contain and reduce exposure to hazardous particulates, which includes a container having a deposit port at an upper end and a collection chamber at a lower end. There is at least one door at the upper end for mail to be placed into the deposit port. A normally open sealable bag is located in the collection chamber for receiving mail and for being sealed when the mail is to be removed from the container. There is a bag holder constructed and arranged to hold a bag in place and normally open so that in a first position, mail placed into the deposit port falls downwardly through the bag holder and into a bag in the collection chamber and which bag may be preliminarily sealed while in this position, and in a second position, the bag may be more securely sealed and removed from the bag holder.

Abstract: A mail box configured to contain and reduce exposure to hazardous particulates, which includes a container having a deposit port at an upper end and a collection chamber at a lower end. There is at least one door at the upper end for mail to be placed into the deposit port. A normally open sealable bag is located in the collection chamber for receiving mail and for being sealed when the mail is to be removed from the container There is a bag holder constructed and arranged to hold a bag in place and normally open so that in a first position, mail placed into the deposit port falls downwardly through the bag holder and into a bag in the collection chamber and which bag may be preliminarily sealed while in this position, and in a second position, the bag may be more securely sealed and removed from the bag holder.

Abstract: A new and improved line scan camera achieves the proper framing of the image field of view by using a first test card to calibrate the true bottom and leading edge portions of the test card which simulate the true bottom and leading portions of an article being scanned or photographed. Still further, the architecture of the electronic chip incorporated within the charge coupled device (CCD) of the camera effectively divides the linear array of pixels into a plurality of channels, and amplifier gain and black offset adjustments are made with respect to exposure levels, characteristic of the pixels disposed at the channel boundaries, under different degrees of input whiteness signals applied to a test card of a predetermined color shade, so as to achieve channel-to-channel seam matching.

Abstract: An apparatus for providing test containers to a test position, includes a track adapted to guide test containers to a test position, a magazine adapted for holding a plurality of test containers and operatively engaged with the track to provide test containers to the track, and a drive mechanism adapted for moving individual test containers from the magazine and along the track to the test position. The magazine for serially providing a plurality of test containers, includes a housing forming a chamber adapted for holding a multiplicity of elongated test containers in parallel and adjacent alignment along a row, a stop element formed at one end of the housing in parallel alignment with the test containers, and a biasing mechanism adapted for physically biasing the row of test containers against the stop element, wherein the one end of the housing including an opening located adjacent to the stop element and adapted to allow test containers to be removed from the chamber.

Abstract: A new and improved line scan camera achieves the proper framing of the image field of view by using a first test card to calibrate the true bottom and leading edge portions of the test card which simulate the true bottom and leading portions of an article being scanned or photographed. Still further, the architecture of the electronic chip incorporated within the charge coupled device (CCD) of the camera effectively divides the linear array of pixels into a plurality of channels, and amplifier gain and black offset adjustments are made with respect to exposure levels, characteristic of the pixels disposed at the channel boundaries, under different degrees of input whiteness signals applied to a test card of a predetermined color shade, so as to achieve channel-to-channel seam matching.

Abstract: A line scan camera comprises a printed circuit board upon which a charge-coupled device (CCD) is mounted. A lens component is fixed within a lens mount, and the base of the lens mount is adjustably mounted upon an optical bench. Calibration devices adjustably interconnect the lens mount to the printed circuit board and to the optical bench so as to calibrate the positional location of the lens component relative to the charge-coupled device (CCD) and to an object plane past which objects to be scanned and photographed are conveyed. In this manner, the focus distance defined between the lens component and the charge-coupled device (CCD) as well as the focal distance defined between the lens component and the object plane are fixed and do not need any further calibration. The object plane is defined upon the front surface of a sealed housing enclosure and all of the components are disposed within the housing enclosure so as to prevent dust and contaminants from collecting upon the optical components.

Abstract: A line scan camera comprises a printed circuit board upon which a charge-coupled device (CCD) is mounted. A lens component is fixed within a lens mount, and the base of the lens mount is adjustably mounted upon an optical bench. Calibration devices adjustably interconnect the lens mount to the printed circuit board and to the optical bench so as to calibrate the positional location of the lens component relative to the charge-coupled device (CCD) and to an object plane past which objects to be scanned and photographed are conveyed. In this manner, the focus distance defined between the lens component and the charge-coupled device (CCD) as well as the focal distance defined between the lens component and the object plane are fixed and do not need any further calibration. The object plane is defined upon the front surface of a sealed housing enclosure and all of the components are disposed within the housing enclosure so as to prevent dust and contaminants from collecting upon the optical components.

Abstract: A line scan camera comprises a printed circuit board upon which a charge-coupled device (CCD) is mounted. A lens component is fixed within a lens mount, and the base of the lens mount is adjustably mounted upon an optical bench. Calibration devices adjustably interconnect the lens mount to the printed circuit board and to the optical bench so as to calibrate the positional location of the lens component relative to the charge-coupled device (CCD) and to an object plane past which objects to be scanned and photographed are conveyed. In this manner, the focus distance defined between the lens component and the charge-coupled device (CCD) as well as the focal distance defined between the lens component and the object plane are fixed and do not need any further calibration. The object plane is defined upon the front surface of a sealed housing enclosure and all of the components are disposed within the housing enclosure so as to prevent dust and contaminants from collecting upon the optical components.

Abstract: An efficient cooling mechanism for a multi-chip carrier can be provided while conserving board surface area. Flexible circuitized material is used to form multi-chip carriers with air baffle capability. The flex is folded or curved into the desired shape and held in position with a support structure. Bonding sites for chips are located on regions through the carrier. Shapes which provide air baffle capabilities include coils, spring-like coils and serpentines.

Abstract: Electrically conductive lamina are attached by an electrically insulating, thermally conductive adhesive and/or solder to one or more semiconductor devices such as chips and extend beyond the periphery of the chip or chips to form heat sink fins. Electrical connections may be made between such chips through holes (e.g. by a wire or plated through hole) in the electrically conductive lamina lined with an insulating material such as the electrically insulating adhesive to provide a structurally robust assembly. Surface pads and connections may overlie patterns of insulator on the lamina. A further lamina can be wrapped around lateral sides of the assembly to provide further heat sink area and mechanical protection for other heat sink fins. A graphite/carbon fiber composite matrix material is preferred for the lamina and the coefficient of thermal expansion of such materials may be matched to that of the semiconductor material attached thereto.

Abstract: An efficient cooling mechanism for a multi-chip carrier can be provided while conserving board surface area. Flexible circuitized material is used to form multi-chip carriers with air baffle capability. The flex is folded or curved into the desired shape and held in position with a support structure. Bonding sites for chips are located on regions through the carrier. Shapes which provide air baffle capabilities include coils, spring-like coils and serpentines.

Abstract: A multi-chip carrier which uses less lateral mounting space on the surface of a circuit board or card can be formed using flexible circuitized material. Lateral space is compressed by utilizing more vertical space to package chips and components. The problem of cooling multiple chips in a tight space may be accomplished by integrating the heat sink in with the circuit carrier and having the heat sink double as a support structure. A flex material is folded or shaped. Different regions of the flex are used for mounting chips, mounting support mechanisms, or mounting the structure on a carrier or substrate.