Patents by Inventor Glenn Lai

Glenn Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6795957
    Abstract: An IC layout tool determines areas of an IC layout in which to provide power wire interconnection vias by first querying a “world” HV tree keeping track of power wires and other objects within the IC layout to determine areas of overlap between power wires residing on differing layers of the layout. The layout tool then creates a separate via HV tree identifying positions of “via boxes” residing on areas of each layer of the IC between overlapping power wires. The tool manipulates the data stored in the via HV tree to partition and merge adjacent via boxes residing on each layer as necessary to produce via boxes indicating positions of a set of unobstructed, rectangular areas of each layer of the layout in which vias may be placed to interconnect overlapping power wires. The IC layout tool then places vias in each rectangular area of each layer the via HV tree indicates is being occupied by via boxes.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: September 21, 2004
    Assignee: Cadence Design Systems, Inc.
    Inventors: Glenn Lai, Jong Chang Lee
  • Publication number: 20030140327
    Abstract: An IC layout tool determines areas of an IC layout in which to provide power wire interconnection vias by first querying a “world” HV tree keeping track of power wires and other objects within the IC layout to determine areas of overlap between power wires residing on differing layers of the layout. The layout tool then creates a separate via HV tree identifying positions of “via boxes” residing on areas of each layer of the IC between overlapping power wires. The tool manipulates the data stored in the via HV tree to partition and merge adjacent via boxes residing on each layer as necessary to produce via boxes indicating positions of a set of unobstructed, rectangular areas of each layer of the layout in which vias may be placed to interconnect overlapping power wires. The IC layout tool then places vias in each rectangular area of each layer the via HV tree indicates is being occupied by via boxes.
    Type: Application
    Filed: December 18, 2002
    Publication date: July 24, 2003
    Inventors: Glenn Lai, Jong Chang Lee