Abstract: A controller is used with an anodic bonding system that has a charge flowpath for supplying charge to bond materials together. The controller includes a switch and a circuit. The switch is configured to control a flow of the charge through the charge flowpath. The circuit is configured to monitor a rate of the flow, use the rate to determine an amount of the charge supplied for bonding, and based on the amount or rate, operate the switch to control the flow.

Abstract: A controller is used with an anodic bonding system that has a charge flowpath for supplying charge to bond materials together. The controller includes a switch and a circuit. The switch is configured to control a flow of the charge through the charge flowpath. The circuit is configured to monitor a rate of the flow, use the rate to determine an amount of the charge supplied for bonding, and based on the amount or rate, operate the switch to control the flow.

Abstract: A current measuring circuit for a field emission display includes a testing circuit coupled between a high voltage testing source and the display. The testing circuit includes a sampling circuit formed from a sampling impedance coupled in parallel with a high isolation switch. In one embodiment, the sample circuit is on the high voltage side of the testing source. In another embodiment, the sampling circuit is on the return (low voltage) side of the testing source. In normal operation, the switch is closed to provide the testing voltage directly to the display. During testing, the switch is open so that current flows through the sampling impedance. A sensing circuit coupled to the output of the sampling impedance determines a voltage change in response to opening of the switch. In response to a sensed voltage change, a microprocessor-based controller computes the current drawn by the display.