Abstract: A method of post chemical mechanical polishing (CMP) cleaning to remove a CMP residue from a surface of an object is disclosed. The object is placed within a pressure chamber. The pressure chamber is pressurized. A supercritical carbon dioxide process is performed to remove a residual CMP residue from the surface of the object. The pressure chamber is vented.

Abstract: A device is used to extract manure from bedding material in a manner that maximizes the amount of manure extracted from the bedding material. The device includes a detachable scoop head having a plurality of apertures, a detachable motor assembly coupled to the scoop head for vibrating the device, and a detachable handle coupled to the motor assembly via a connector. The handle can include a power pack for supplying electrical power to the motor assembly. The apertures are preferably formed between elongated elements. The power pack, which can be housed within the handle, forms a counterweight to the scoop head when the device is lifted. The device can further include a stand having a release mechanism coupled to the device, wherein the release mechanism releases the stand in a fully deployed position to facilitate raising the scoop head.

Abstract: A device is used to extract manure from bedding material in a manner that maximizes the amount of manure extracted from the bedding material. The device includes a detachable scoop head having a plurality of apertures, a detachable motor assembly coupled to the scoop head for vibrating the device, and a detachable handle coupled to the motor assembly via a connector. The handle can include a power pack for supplying electrical power to the motor assembly. The apertures are preferably formed between elongated elements. The power pack, which can be housed within the handle, forms a counterweight to the scoop head when the device is lifted. The device can further include a stand having a release mechanism coupled to the device, wherein the release mechanism releases the stand in a fully deployed position to facilitate raising the scoop head.

Abstract: A method of post chemical mechanical polishing (CMP) cleaning to remove a CMP residue from a surface of an object is disclosed. The object is placed within a pressure chamber. The pressure chamber is pressurized. A supercritical carbon dioxide process is performed to remove a residual CMP residue from the surface of the object. The pressure chamber is vented.

Abstract: A method of removing Chemical Mechanical Polishing (CMP) residue from a semiconductor substrate is disclosed. The semiconductor substrate with the CMP residue on a surface is placed within a pressure chamber. The pressure chamber is then pressurized. Supercritical carbon dioxide and a solvent are introduced into the pressure chamber. The supercritical carbon dioxide and the chemical are maintained in contact with the semiconductor substrate until the CMP residue is removed from the semiconductor substrate. The pressure chamber is then flushed and vented.

Abstract: A method of removing Chemical Mechanical Polishing (CMP) residue from a semiconductor substrate is disclosed. The semiconductor substrate with the CMP residue on a surface is placed within a pressure chamber. The pressure chamber is then pressurized. Supercritical carbon dioxide and a solvent are introduced into the pressure chamber. The supercritical carbon dioxide and the chemical are maintained in contact with the semiconductor substrate until the CMP residue is removed from the semiconductor substrate. The pressure chamber is then flushed and vented.

Abstract: The system and method for molecular contamination control permits purging a SMIF pod to desired levels of relative humidity, oxygen, or particulates. The SMIF pod includes an inlet port including a check valve and filter assembly for supplying a clean, dry gaseous working fluid to maintain low levels of moisture, oxygen, and particulate content around materials contained in the SMIF pod. The SMIF pod outlet port, which also includes a check valve and filter assembly, is connected with an evacuation system. Flow of purge gas inside the SMIF pod can be directed with one or more nozzle towers to encourage laminar flow inside the pod, and one or more outlet towers., having a function similar to that of the inlet tower, may also be provided. The purge gas can be dried by exposure to a desiccant, heated to temperatures between about 100° C. and about 120° C., and can be tested for baseline constituent levels prior to or after introduction into a SMIF pod.

Abstract: The system and method for molecular contamination control permits purging a SMIF pod to desired levels of relative humidity, oxygen, or particulates. The SMIF pod includes an inlet port including a check valve and filter assembly for supplying a clean, dry gaseous working fluid to maintain low levels of moisture, oxygen, and particulate content around materials contained in the SMIF pod. The SMIF pod outlet port, which also includes a check valve and filter assembly, is connected with an evacuation system. Flow of purge gas inside the SMIF pod can be directed with one or more nozzle towers to encourage laminar flow inside the pod, and one or more outlet towers, having a function similar to that of the inlet tower, may also be provided. The purge gas can be dried by exposure to a desiccant, heated to temperatures between about 100° C. and about 120° C., and can be tested for baseline constituent levels prior to or after introduction into a SMIF pod.

Abstract: A method of removing Chemical Mechanical Polishing (CMP) residue from a semiconductor substrate is disclosed. The semiconductor substrate with the CMP residue on a surface is placed within a pressure chamber. The pressure chamber is then pressurized. Supercritical carbon dioxide and a solvent are introduced into the pressure chamber. The supercritical carbon dioxide and the chemical are maintained in contact with the semiconductor substrate until the CMP residue is removed from the semiconductor substrate. The pressure chamber is then flushed and vented.

Abstract: The system and method for molecular contamination control permits purging a SMIF pod to desired levels of relative humidity, oxygen, or particulates. The SMIF pod includes an inlet port including a check valve and filter assembly for supplying a clean, dry gaseous working fluid to maintain low levels of moisture, oxygen, and particulate content around materials contained in the SMIF pod. The SMIF pod outlet port, which also includes a check valve and filter assembly, is connected with an evacuation system. Flow of purge gas inside the SMIF pod can be directed with one or more nozzle towers to encourage laminar flow inside the pod, and one or more outlet towers,, having a function similar to that of the inlet tower, may also be provided. The purge gas can be dried by exposure to a desiccant, heated to temperatures between about 100° C. and about 120° C., and can be tested for baseline constituent levels prior to or after introduction into a SMIF pod.

Abstract: The docking and purging system docks a modular isolation container for substrates used in manufacturing integrated circuits for purging and processing in a processing environment. A door portion of the docking and purging system includes a shelf for receiving the modular isolation container before insertion in a docking chamber formed in the housing connected for communication with the processing environment. A vacuum manifold with suction cups is provided for gripping and removing the modular isolation container door to allow access to the interior chamber of the modular isolation container. The docking chamber and interior chamber of the modular isolation container can also be purged of particulate contaminates by filtered air or inert gas ducted to the docking chamber.

Abstract: Abrasive components and water are recovered from an aqueous chemical mechanical slurry used for planarization of semiconductor materials. The slurry effluent is preferably brought to a neutral pH, and cooled to a temperature between about 0.degree. C. and about 15.degree. C. An electrical potential can be applied to the slurry effluent to facilitate agglomeration and separation of particles of abrasive material in the slurry effluent. In one embodiment, the slurry effluent is introduced into a process chamber at ambient temperature and pressure, and supernatant liquid separated from the process chamber is then subjected to a reduction of pressure in a vacuum chamber to cause gas entrapped in the supernatant liquid to bubble to the surface of the supernatant liquid for further separation and collection of water and abrasive particles from the slurry effluent. In another embodiment, slurry effluent is filtered through one or more self-cleaning reversible gross particle filter assemblies.

Abstract: The apparatus for the continuous separation of liquid and relatively fine particles from a liquid slurry includes one or more centrifuge vessels disposed about a longitudinal axis of rotation, and a driver for rotating the centrifuge vessel or vessels. A feed inlet introduces the liquid slurry into each centrifuge vessel, each of which extends at an oblique angle to the axis. A first outlet is provided adjacent to the inner end for the lighter liquid component, and a second outlet is provided adjacent to the outer end for the heavier solid particle component. The inlet of the each centrifuge vessel is preferably located between the first end and the second end, and the second outlet preferably comprises a plurality of solids removal capillary passages connected to a continuous solids removal tube, which can be connected to a source of vacuum to form a vacuum chamber for withdrawing the solids. A supernatant liquid collection chamber is also connected to the first outlet for receiving the supernatant liquid.

Abstract: The system and method for molecular contamination control permits purging a SMIF pod to desired levels of relative humidity, oxygen, or particulates. The SMIF pod includes an inlet port including a check valve and filter assembly for supplying a clean, dry gaseous working fluid to maintain low levels of moisture, oxygen, and particulate content around materials contained in the SMIF pod. The SMIF pod outlet port, which also includes a check valve and filter assembly, is connected with an evacuation system. Flow of purge gas inside the SMIF pod can be directed with one or more nozzle towers to encourage laminar flow inside the pod, and one or more outlet towers, having a function similar to that of the inlet tower, may also be provided. The purge gas can be dried by exposure to a desiccant, heated to temperatures between about 100.degree. C. and about 120.degree. C., and can be tested for baseline constituent levels prior to or after introduction into a SMIF pod.

Abstract: Abrasive components and water are recovered from an aqueous chemical mechanical slurry used for planarization of semiconductor materials. The slurry effluent is preferably brought to a neutral pH, and cooled to a temperature between about 0.degree. C. and about 15.degree. C. An electrical potential can be applied to the slurry effluent to facilitate agglomeration and separation of particles of abrasive material in the slurry effluent. In one embodiment, the slurry effluent is introduced into a process chamber at ambient temperature and pressure, and supernatant liquid separated from the process chamber is then subjected to a reduction of pressure in a vacuum chamber to cause gas entrapped in the supernatant liquid to bubble to the surface of the supernatant liquid for further separation and collection of water and abrasive particles from the slurry effluent. In another embodiment, slurry effluent is filtered through one or more self-cleaning reversible gross particle filter assemblies.

Abstract: The apparatus for the continuous separation of liquid and relatively fine particles from a liquid slurry includes one or more centrifuge vessels disposed about a longitudinal axis of rotation, and a driver for rotating the centrifuge vessel or vessels. A feed inlet introduces the liquid slurry into each centrifuge vessel, each of which extends at an oblique angle to the axis. A first outlet is provided adjacent to the inner end for the lighter liquid component, and a second outlet is provided adjacent to the outer end for the heavier solid particle component. The inlet of the each centrifuge vessel is preferably located between the first end and the second end, and the second outlet preferably comprises a plurality of solids removal capillary passages connected to a continuous solids removal tube, which can be connected to a source of vacuum to form a vacuum chamber for withdrawing the solids. A supernatant liquid collection chamber is also connected to the first outlet for receiving the supernatant liquid.

Abstract: The system and method for molecular contamination control permits purging a SMIF pod to desired levels of relative humidity, oxygen, or particulates. The SMIF pod includes an inlet port including a check valve and filter assembly for supplying a clean, dry gaseous working fluid to maintain low levels of moisture, oxygen, and particulate content around materials contained in the SMIF pod. The SMIF pod outlet port, which also includes a check valve and filter assembly, is connected with an evacuation system. Flow of purge gas inside the SMIF pod can be directed with one or more nozzle towers to encourage laminar flow inside the pod, and one or more outlet towers, having a function similar to that of the inlet tower, may also be provided. The purge gas can be dried by exposure to a desiccant, heated to temperatures between about 100.degree. C. and about 120.degree. C., and can be tested for baseline constituent levels prior to or after introduction into a SMIF pod.

Abstract: The docking and purging system docks a modular isolation container for substrates used in manufacturing integrated circuits for purging and processing in a processing environment. A door portion of the docking and purging system includes a shelf for receiving the modular isolation container before insertion in a docking chamber formed in the housing connected for communication with the processing environment. A vacuum manifold with suction cups is provided for gripping and removing the modular isolation container door to allow access to the interior chamber of the modular isolation container. The docking chamber and interior chamber of the modular isolation container can also be purged of particulate contaminates by filtered air or inert gas ducted to the docking chamber.

Abstract: The docking and purging system docks a modular isolation container for substrates used in manufacturing integrated circuits for purging and processing in a processing environment. A door portion of the docking and purging system includes a shelf for receiving the modular isolation container before insertion in a docking chamber formed in the housing connected for communication with the processing environment. A vacuum manifold with suction cups is provided for gripping and removing the modular isolation container door to allow access to the interior chamber of the modular isolation container. The docking chamber and interior chamber of the modular isolation container can also be purged of particulate contaminates by filtered air or inert gas ducted to the docking chamber.

Abstract: Apparatus and method for accurate measuring and mixing of chemicals is disclosed. The apparatus includes one or more metered vessels having a container of predetermined volume and at least one constricted vent tube therein. By mounting a sensor on the constricted vent tube, a greatly amplified measurement of the precise chemical volume in the metered vessel is provided. The apparatus and method of the present invention readily lends itself to a variety of applications and can be adapted to handle virtually any form of chemical mixing, diluting, or generating process.