Abstract: A liquid loop cooling apparatus includes tubing enclosing an interior bore or lumen within which a cooling fluid can circulate, a moveable cold plate rigidly coupled to the tubing, and at least one flexible bellows coupled to the tubing and flexibly enabling movement of the moveable cold plate.

Abstract: A pump assembly includes inlet and outlet interfaces capable of coupling to a liquid cooling loop tubing, a plurality of pump connectors coupled to the inlet and outlet interfaces enabling pluggable connection of a plurality of pumps to the inlet and outlet interfaces, and a controller. The controller is coupled to the plurality of pumps and controls power levels of the individual pumps, enabling control of fluid flow rate in the liquid cooling loop.

Abstract: A heat exchanger includes a tube, and a plurality of fins coupled to the tube having a curved fan-stator shape that facilitates straightening of airflow from a fan.

Abstract: An airflow control apparatus includes a controllable airflow resistance aligned with an airflow path of a plurality of airflow paths, a sensor capable of detecting an airflow condition in at least one of the plurality of airflow paths, and a controller. The controller is coupled to the controllable airflow resistance and to the sensor, and can control the controllable airflow resistance to manage airflow recirculation based on the airflow condition detected by the sensor.

Abstract: A liquid loop cooling apparatus includes rigid or semi-rigid tubing enclosing an interior bore or lumen within which a cooling fluid can circulate among at least one heat-generating component in a closed-loop system. The liquid loop cooling apparatus also includes at least one flexible bellows coupled to the tubing that isolates physical stresses along the tubing.

Abstract: A cooling apparatus for usage in an electronic system, a liquid loop heat exchanger body is configured for attachment to an exterior surface of an electronic system chassis.

Abstract: A liquid loop cooling system, a tubing encloses an interior lumen within which a cooling fluid can circulate. A plurality of heat exchangers is coupled to the tubing and is configured within in a constrained space in conformance to space availability.

Abstract: An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. An evaporator is in thermal communication with at least one of the computer components, and vaporizes a coolant to cool that component. A condenser dissipates heat from the coolant vapor, and provides liquid coolant back to the evaporator. The condenser directs liquid coolant gravitationally downward, making the condenser and evaporator gravity driven. An air mover within the chassis cools the condenser, blows air across other components needing cooling, and removes heated air from the chassis.

Abstract: A cooling device for electronic devices is built comprising at least two fan sinks thermally coupled together such that when one fan sink fails, the remaining fan sinks are able to compensate for the failed fan sink. Optionally, the remaining fan sinks may be controlled to speed up upon detection of a failure, increasing their cooling capacity to compensate for the failed fan sink. Also optionally, a thermal coupling device such as heat pipes may be used as part of the thermal coupling between the fan sinks to increase the cooling efficiency of the remaining fan sinks to the device or devices closest to the failed fan sink. Also optionally, the thermal coupling device may be configured to allow some flexibility in the cooling device assembly allowing for the cooling of non-coplanar electronic devices.

Abstract: A slot filler for usage in a rack cabinet can accept a plurality of stacked electronic devices. The cabinet has an air inlet and exit on mutually opposing sides and a plurality of slots capable of securing the stacked electronic devices. The slot filler comprises a blanking panel capable of covering an entry opening of a slot that is unoccupied by an electronic device, and a body coupled to the blanking panel that emulates dimensions of an electronic device and has a thickness selected so that clearance between the slot filler and an adjacent electronic device leaves an air flow gap from the air inlet to exit that is sufficiently small to create an air flow resistance preventing air from re-circling toward the air inlet.

Abstract: An airflow management apparatus is used in an electronic system and includes a flexible air baffle that mounts on a chassis of an electronic device in an arrangement and obstructs air flow between an air inlet vent and an air exhaust vent of the electronic device. The flexible air baffle has a thickness that extends across a gap to contact an adjacent vertically-stacked electronic device.

Abstract: A bladed server with a chassis having a front and rear is provided. A plurality of blades is disposed within the chassis so that opposing faces and a faceplate of each of the plurality of blades are substantially perpendicular to the front and rear of the chassis. The plurality of blades includes at least one server blade. One or more fans are located at at least one of the front and rear of the chassis such that a flow-path at at least one of an inlet and exit of the one or more fans is substantially parallel to the opposing faces and faceplate of each of the plurality of blades.

Abstract: An apparatus in one example comprises one or more control components that regulate one or more thermal test components to adjust one or more emulated operational characteristics for one or more electronic devices. The thermal test components are coupled with one or more rack-mount frames. The thermal test components create the emulated operational characteristics for the one or more electronic devices to generate one or more emulated environmental effects. The one or more control components obtain one or more measurements of one or more of the one or more emulated operational characteristics and the one or more emulated environmental effects. The one or more control components make a prediction of one or more of one or more actual operational characteristics and one or more actual environmental effects of the one or more electronic devices through employment of one or more of the one or more measurements.

Abstract: An apparatus in one example comprises one or more control components that emulate one or more operational characteristics of one or more electronic devices through employment of one or more thermal components coupled with a frame.

Abstract: One or more heat exchanger components of an apparatus are in major part operably locatable outside a computer chassis and serve to reduce one or more temperatures of one or more heat producing components supported with the computer chassis.

Abstract: A fan rotor system for cooling an electronic system includes a rotor body configured to be rotated by a fan motor and at least one collapsible fan blade mounted on the rotor body for moving cooling air through the electronic system. The at least one collapsible fan blade has a first air driving position, wherein the fan blade moves cooling air in a desired direction for cooling the electronic system, and a second air passage position, wherein the at least one collapsible fan blade is collapsed to allow cooling air to pass the at least one collapsible fan blade with less drag than when the at least one collapsible fan blade is in the first air driving position. The at least one collapsible fan blade is movable between the first air driving position when the rotor body is rotating and the second air passage position when the rotor body is not rotating.

Abstract: A bladed server with a chassis having a front and rear is provided. A plurality of blades is disposed within the chassis so that opposing faces and a faceplate of each of the plurality of blades are substantially perpendicular to the front and rear of the chassis. The plurality of blades includes at least one server blade. One or more fans are located at at least one of the front and rear of the chassis such that a flow-path at at least one of an inlet and exit of the one or more fans is substantially parallel to the opposing faces and faceplate of each of the plurality of blades.