Abstract: A fluid-jet precision-dispensing device includes a layer, one or more first holes within the layer, and one or more second holes within the layer. The first holes are adapted to pass fluid therethrough during usage of the device to precisely dispense the fluid at accurately specified locations. The second holes are adapted to not pass the fluid therethrough during usage of the device to precisely dispense the fluid at the accurately specified locations. The second holes may be adapted to at least substantially maximally pass gaseous bubbles therethrough during performance of a priming operation of the device. The second holes may be adapted to at least substantially maximally pass sludge and/or contaminants therethrough during performance of the priming operation of the device.

Abstract: The present invention includes as one embodiment a fluid ejection device for printing ink on a print media, including a flexible circuit with electrical traces, a coverlayer covering the electrical traces and adhering the flexible circuit to the fluid ejection device and at least one mechanical feature located on an outer edge of the flexible circuit near the electrical traces.

Abstract: The present invention includes as one embodiment a fluid ejection device for printing ink on a print media, comprising a flexible circuit with electrical traces, a coverlayer covering the electrical traces and adhering the flexible circuit to the fluid ejection device and at least one mechanical feature located on an outer edge of the flexible circuit near the electrical traces.

Abstract: Electrical operation signals such are transferred between a printer carriage interconnect circuit and a printhead interconnect circuit through conductive pads, some of which are elongated sufficiently to provide multiple conductive contact points. Positioning the elongated pads at an angle relative to a longitudinal axis of an interconnect flex circuit results in a compact flex circuit having voltage, ground and control signal pads.

Abstract: An inkjet printing system having multiple independent power supplies for providing firing energy to the ink ejection elements of one or more printheads. Different ones of the power supplies can be connected to different print cartridges each of which prints a different color ink; to different arrays of ink ejection elements within a single print cartridge, where each array prints a different color ink; or to different sections of the ink ejection element array of a single printhead for a single color ink. The output of each power supply is independently set to an appropriate voltage level for each different print cartridge, ink ejection element array, or section of an array.

Abstract: An interconnection arrangement for an inkjet printing system having multiple power pads, each of which provides power for driving a large number of printhead ink ejection elements. The ink ejection elements of a print cartridge are organized into groups, with power provided to each group by one of the power pads. The firing pulse width of each group is independently set to compensate for the parasitic electrical resistances in the power path of each ink ejection group in the print cartridge so as to eject ink drops of uniform volume required for high quality printed output. In order to transmit the relatively high current levels required to fire a large number of ink ejection elements from a single group at the same time, the interconnection scheme provides multiple bump-and-dimple interconnections with the printer for each power and ground pad on the print cartridge.

Abstract: A process for producing defect free multilayer printed circuit boards using low pressure lamination with a cyanate ester laminate. Alternate layers of cyanate ester core and prepreg materials are stacked and at least partially cured under pressure and elevated temperatures to produce a multilayer laminated printed circuit board. The use of a low pressure cure avoids the storage of stress within the laminate. Such stress would otherwise produce microcracking and/or delamination of the circuit board when the stress is released during the subsequent thermal cycling or exposure to caustics attendant with working and reworking of the printed circuit board.