Abstract: An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.

Abstract: An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.

Abstract: An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. In one embodiment, a first drive roller holds a first end of the polishing strip, a second drive roller holds a second end of the polishing strip, and a pair of support rollers contacts the second side of the polishing strip on either end of a polishing strip support. A drive motor is operably connected to the first and second drive rollers for moving the polishing strip in a linear, bi-directional manner.

Abstract: A method and apparatus are disclosed for chemically-mechanically polishing and planarizing semiconductors. An apparatus includes first and second rollers connected by a tension belt. A polishing member is releasably attached to the first and second rollers. A method includes clamping a first portion of a continuous strip of polishing member to a first roller, clamping a second portion of the continuous strip to a second roller, applying a tension to the continuous strip and rotationally reciprocating the rollers while pressing a semiconductor wafer against the continuous strip.

Abstract: A polishing head for performing chemical-mechanical polishing on a linear polisher has a flexible diaphragm coupling between a wafer carrier and a support housing which houses the wafer carrier. The diaphragm allows the carrier to move-substantially in the vertical direction within the housing, but a center shaft assembly limits movement in the horizontal direction.

Abstract: An apparatus for chemically-mechanically polishing a semiconductor wafer comprises a receiving surface attached with a frame; a loading mechanism in contact with the receiving surface, the loading mechanism being configured to load measured portions of a wafer-polishing member containing a fixed abrasive onto the receiving surface; a reciprocation device attached with at least a portion of the receiving surface, the reciprocation device being powered to move the receiving surface in a linear, bi-directional motion; and a wafer holder positioned to releasably hold a wafer adjacent to the receiving surface. Methods of chemically-mechanically polishing semiconductor wafers are also provided.