Abstract: A wafer carrier head assembly for holding a wafer in chemical mechanical planarization applications is dis;losed that includes a downwardly protruding wafer retaining ring that moves independent of the wafer carrier head and retains an edge of the wafer on said polishing surface. An adjustable wafer holding mechanism that applies one of a uniform downward force and a uniform upward force to the wafer is also included. Application of the upward force allows the wafer holding mechanism to retain and transport the wafer to a polishing surface. Application of the downward force allows the wafer holding mechanism to retain the wafer on the polishing surface and allows the wafer to be uniformly polished. The wafer carrier head assembly herein disclosed is also configured to pivotally accommodate changes in parallelism between the wafer and the polishing surface when the wafer is being polished.

Abstract: A system for rinsing and cleaning a wafer carrier and a semiconductor wafer mounted thereon during a polishing process is provided. The system comprises a head spray assembly that includes a spray nozzle and a spray cavity. At least a part of the head spray assembly is moveably positionable between a park position and a spray position. The spray position is proximate to the wafer carrier such that liquid discharged from the spray nozzle is in liquid communication with the wafer carrier and the semiconductor wafer. The liquid as well as the materials rinsed from the wafer carrier and semiconductor wafer may be retained in the spray cavity and channeled out of the head spray assembly.

Abstract: A system and method for rinsing and cleaning a wafer carrier and a semiconductor wafer mounted thereon during a chemical mechanical planarization (CMP) process is provided. The system includes a head spray assembly that comprises a plurality of spray nozzles positioned therein. The head spray assemble is moveably positionable between a park position and a spray position. The spray position is adjacent the wafer carrier such that liquid discharged from the spray nozzles is in liquid communication with the wafer carrier, the semiconductor wafer and the interior of the head spray assembly. The system provides aggressive and uniform cleaning and rinsing while containing and collecting the liquid discharged from the spray nozzles and the materials rinsed from the wafer carrier and semiconductor wafer.

Abstract: A system and method for detachably securing a locking mechanism to a housing is provided. The locking mechanism comprises a cam ring, a retention ring and a plurality of locking elements. The cam ring and the retention ring are slidably coupled and concentric with respect to each other. The locking elements are movably disposed within the cam ring and the retention ring. When a rotational force is applied to the locking mechanism, the locking elements move between a first position and a second position. The housing is positioned adjacent the locking elements and concentric with the locking mechanism. In the second position, the locking elements engage an engagement mechanism on the housing.

Abstract: An apparatus for dispensing media is provided. The apparatus has a rotating element having a cylindrical bore with a first end and a second end where the rotating element rotates the first end and the second end. The apparatus also includes a housing which has a fixed input port and a fixed output port where the housing encloses the rotating element. The first end and the second end of the rotating element intermittently switches between being aligned with the fixed input port and the fixed output port and being aligned with the fixed output port and the fixed input port, respectively. The apparatus also has a cylindrical piston contained within the cylindrical bore where the cylindrical piston has a length that is less than the cylindrical bore and switches from being closer to the fixed input port and the fixed output port.

Abstract: A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be passively rotated by contact with the polishing pad, or actively reciprocated, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.

Abstract: A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be passively rotated by contact with the polishing pad, or actively reciprocated, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.

Abstract: A process for extracting precious metal from volcanic ore includes the steps of crushing the ore, heating the ore in a hydrogen atmosphere to soften oxide mineral encapsulating the precious metal, cooling the ore, grinding the ore, and processing the ore to extract precious metal.

Abstract: The ticket dispenser includes lower and upper overlying support plates which define a ticket material passageway therebetween. A reel support is mounted on one end and cutting apparatus are mounted on the other end of the support plates. A feed slot is formed in the upper support plate and a feed pawl reciprocates in the feed slot. A feed pawl cam urges the feed pawl downwardly into engagement with the ticket material in the passageway as the feed pawl moves toward the cutting apparatus, and urges the feed pawl upwardly away from the ticket material as the feed pawl moves away from the cutting apparatus. As the feed pawl reaches the end of its feeding stroke, the cutting apparatus cuts off the portion of the ticket material that has been pushed beyond the cutting means, and feed out apparatus pulls additional ticket material from the reel.