Abstract: An integrated optical chip has a crystalline structure cut along parallel principal crystallographic planes and a thickness of less than 1.0 mm. An optical signal pathway is disposed generally longitudinally in one of the cut surfaces of the chip, and the chip is attached to a substrate material up to 1.0 mm thick and having similar coefficients of thermal expansion in that principal crystallographic plane. A grounding plane is disposed between the chip and substrate to provide an electrically conductive path between opposite lateral surfaces of the chip. A method of making the chip is also described.

Abstract: An integrated optical chip has a crystalline structure cut along parallel principal crystallographic planes and a thickness of less than 1.0 mm. An optical signal pathway is disposed generally longitudinally in one of the cut surfaces of the chip, and the chip is attached to a substrate material up to 1.0 mm thick and having similar coefficients of thermal expansion in that principal crystallographic plane. A grounding plane is disposed between the chip and substrate to provide an electrically conductive path between opposite lateral surfaces of the chip. A method of making the chip is also described.

Abstract: An active optical device comprises a packaged optical chip, an optical fiber coupled to the chip to receive an optical output from it, and a photodetector located within the package for receiving radiation light responsive to the amplitude of that optical output. The radiation light is produced by destructive interference in a pair of waveguides that merge together at a chosen small angle and sufficiently smoothly for a substantial part of the light (ideally nearly all of it) to propagate through the substrate of the chip close to the output waveguide and preferably in only two directions (corresponding to a first-order diffraction). The optical fiber is coupled to the chip by means of a fiber support (such as a fiber block or a ferrule) made of transparent material, and the photodetector is positioned to receive the radiation light at least partly through the fiber support and at least partly by reflection from the interior of the package.

Abstract: An optical device comprises an optical chip contained in a package formed at least in part of an enclosure wall; the chip provides an optical signal output and an optical monitoring output and the device includes a photodetector responsive to the optical monitor output