Abstract: An optical circuit board including a top face, a bottom face, an optical layer buried between bottom and top faces, the optical layer being adapted to transmit optical signals, an opto-electronic component adapted to emit or receive light transmitted through the optical layer, a solid heat dissipative element adapted to dissipate heat generated at the opto-electronic component.

Abstract: Printed circuit board assembly including an optical subassembly having a carrying face for carrying at least one optoelectronic component in a such way that light emitted from/directed to is transmitted through the optical subassembly; a printed circuit board having a supporting area for supporting the optical subassembly; wherein the printed circuit board supporting area includes a hole lodging at least one part of the optoelectronic component and wherein at least one part of the carrying face is fixed by flip-chip bonding to at least one part of the supporting area.

Abstract: An alignment pin for an optical communication system comprises: a first portion (31) extending along a direction in a receiving hole of a printed circuit board, a second portion (32) extending along this direction in a receiving through hole of an optical coupling device, a third portion (33) extending along this direction in a receiving hole of an external optical component. The pin comprises an abutting surface (35) placed in contact with a parallel complementary surface (36) of the optical coupling device.

Abstract: An optical circuit board including a top face, a bottom face, an optical layer buried between bottom and top faces, the optical layer being adapted to transmit optical signals, an opto-electronic component adapted to emit or receive light transmitted through the optical layer, a solid heat dissipative element adapted to dissipate heat generated at the opto-electronic component.

Abstract: The invention is related to an optical engine comprising: including at least one optoelectronic component for emitting or receiving light; a substrate for carrying the optoelectronic component; an optical coupling device, configured for guiding light between the optoelectronic component and an optical waveguide, fixed to the substrate. At least the substrate and the coupling device comprise include a fixation element and the other one a complementary fixation element, the complementary fixation element cooperating with the fixation element to locate and fix the coupling device to substrate so as to achieve an optical coupling between the optoelectronic component and the optical coupling device.

Abstract: An alignment pin for an optical communication system comprises: a first portion (31) extending along a direction in a receiving hole of a printed circuit board, a second portion (32) extending along this direction in a receiving through hole of an optical coupling device, a third portion (33) extending along this direction in a receiving hole of an external optical component. The pin comprises an abutting surface (35) placed in contact with a parallel complementary surface (36) of the optical coupling device.

Abstract: Printed circuit board assembly including an optical subassembly having a carrying face for carrying at least one optoelectronic component in a such way that light emitted from/directed to is transmitted through the optical subassembly; a printed circuit board having a supporting area for supporting the optical subassembly; wherein the printed circuit board supporting area includes a hole lodging at least one part of the optoelectronic component and wherein at least one part of the carrying face is fixed by flip-chip bonding to at least one part of the supporting area.

Abstract: To simplify the making of a connector of optical ferrules for interconnecting two optical fibers in particular of different types, an adapting space made of a material transparent to light rays is provided. A plate physically representing said space bears, on either side, two convergent lenses. Such an arrangement provides many degrees of freedom to adjust the characteristics of the transmission of light rays from one optical fiber to another optical fiber.

Abstract: In order to make an optical interconnection of either two optical fibers to each other or of one optical fiber with an optoelectronic conversion circuit, it is planned to have a module provided with a body or package in which sections of optical fibers are overmolded. The overmolding on the one hand simplifies industrial-scale manufacture and, on the other hand, enables the adoption, for the optical fiber sections, of shapes such as flared shapes and/or lenses enabling an appropriate refocusing or collimation of the light rays conveyed by these optical fibers.