Abstract: A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.

Abstract: An image can be projected in a wide angular range while an increase in a beam diameter is suppressed. A light source device according to the present disclosure includes: a plurality of light emitting elements divided into a plurality of regions; and an optical unit that includes a plurality of first lens groups having a first focal length and corresponding to the regions of the light source unit on a one-to-one basis, and a second lens group having a second focal length and emitting light having passed through the first lens groups. In the optical unit, for each of the regions, the first focal length is smaller than zero, the second focal length is larger than zero, and each composite focal length of each of the first lens groups and the second lens group is larger than the second focal length.

Abstract: The present technology is to provide an image sensor capable of enhancing the security of biometric information and lowering the risk of information leakage. An image sensor 10 includes: a biometric information acquisition unit 102 that acquires biometric information; a storage unit 14 that stores reference information to be compared with the biometric information; and a biometric authentication unit 104 that performs biometric authentication by comparing the biometric information with the reference information. The image sensor 10 further includes an encryption processing unit 105 that encrypts biometric authentication information that authenticates a living organism.

Abstract: A structure for measuring a distance on the basis of the principle of triangulation is simplified. A distance measuring module includes a diffractive optical element, an imaging element, and a distance measuring unit. The diffractive optical element emits a predetermined number of line light beams. The imaging element images the line light beams with which the subject is irradiated. The measuring unit measures a distance from the subject by using triangulation on the basis of the imaged line light beams. Thus, by imaging the line light beams emitted via the diffractive optical element, the distance from the subject is measured with a simple structure.

Abstract: A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.

Abstract: A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.

Abstract: An image sensor includes a pixel array including multiple pixels. A lens is provided on an optical path of incident light to the image sensor. An actuator includes a coil, and supports positioning of the lens according to a driving signal applied to the coil. A position detection coil is arranged such that it magnetically couples with the coil of the actuator. An actuator driver supplies a pulse-shaped driving signal to the coil of the actuator driver. A position detection circuit generates a position detection signal that indicates the position of the lens based on an induced electromotive force that occurs in the position detection coil according to the driving signal, and feeds back the position detection signal to the actuator driver.

Abstract: A size reduction of an image pickup module by using resin molding, including a reduction in height, area, or the like thereof is achieved in an actual product. Provided is a module, including a substrate; a semiconductor component in which a first surface of a semiconductor device manufactured by chip-size packaging is provided and fixed along a plate-shaped translucent member, and a second surface of the semiconductor device is fixed with the second surface caused to face the substrate; a frame portion made of resin and formed on the substrate to surround the semiconductor component; and an interposition member which is made of resin and with which a gap between the semiconductor component and the substrate is filled. The interposition member is connected and fixed to the frame portion to be integrated therewith.

Abstract: The present technology is to provide an image sensor capable of enhancing the security of biometric information and lowering the risk of information leakage. An image sensor 10 includes: a biometric information acquisition unit 102 that acquires biometric information; a storage unit 14 that stores reference information to be compared with the biometric information; and a biometric authentication unit 104 that performs biometric authentication by comparing the biometric information with the reference information. The image sensor 10 further includes an encryption processing unit 105 that encrypts biometric authentication information that authenticates a living organism.

Abstract: The present technology is to provide an image sensor capable of enhancing the security of biometric information and lowering the risk of information leakage. An image sensor 10 includes: a biometric information acquisition unit 102 that acquires biometric information; a storage unit 14 that stores reference information to be compared with the biometric information; and a biometric authentication unit 104 that performs biometric authentication by comparing the biometric information with the reference information. The image sensor 10 further includes an encryption processing unit 105 that encrypts biometric authentication information that authenticates a living organism.

Abstract: An image sensor includes a pixel array including multiple pixels. A lens is provided on an optical path of incident light to the image sensor. An actuator includes a coil, and supports positioning of the lens according to a driving signal applied to the coil. A position detection coil is arranged such that it magnetically couples with the coil of the actuator. An actuator driver supplies a pulse-shaped driving signal to the coil of the actuator driver. A position detection circuit generates a position detection signal that indicates the position of the lens based on an induced electromotive force that occurs in the position detection coil according to the driving signal, and feeds back the position detection signal to the actuator driver.

Abstract: A structure for measuring a distance on the basis of the principle of triangulation is simplified. A distance measuring module includes a diffractive optical element, an imaging element, and a distance measuring unit. The diffractive optical element emits a predetermined number of line light beams. The imaging element images the line light beams with which the subject is irradiated. The measuring unit measures a distance from the subject by using triangulation on the basis of the imaged line light beams. Thus, by imaging the line light beams emitted via the diffractive optical element, the distance from the subject is measured with a simple structure.

Abstract: A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.

Abstract: A solid-state imaging device includes: a pixel unit in which pixels are arranged in a matrix pattern; and a pixel signal read-out unit including an AD conversion unit performing analog-to-digital (AD) conversion of a pixel signal read out from the pixel unit, wherein each pixel included in the pixel unit includes division pixels divided into regions in which photosensitivity levels or electric charge accumulating amounts are different from one another, the pixel signal reading unit includes a normal read-out mode and a multiple read-out mode, and includes a function of changing a configuration of a frame in accordance with a change of the read-out mode, and wherein the AD conversion unit acquires a pixel signal of one pixel by adding the division pixel signals while performing AD conversion for the division pixel signals.

Abstract: A DA converter includes a first DA conversion section for obtaining an analog output signal in accordance with a digital input signal value, and a second DA conversion section for obtaining an analog gain control output signal in accordance with a digital gain control input signal value. In the DA converter, the gain control of the analog output signal generated by the first DA conversion section is performed on the basis of the gain control output signal generated by the second DA conversion section.

Abstract: The present technology is to provide an image sensor capable of enhancing the security of biometric information and lowering the risk of information leakage. An image sensor 10 includes: a biometric information acquisition unit 102 that acquires biometric information; a storage unit 14 that stores reference information to be compared with the biometric information; and a biometric authentication unit 104 that performs biometric authentication by comparing the biometric information with the reference information. The image sensor 10 further includes an encryption processing unit 105 that encrypts biometric authentication information that authenticates a living organism.

Abstract: A camera module of the disclosure includes: an imaging unit that includes a plurality of pixels, acquires a first detection value in one of the pixels in a second term out of a first term, the second term, a third term, and a fourth term that are set in order, acquires a second detection value in the relevant one of the pixels in the fourth term, and obtains a pixel value of the relevant one of the pixels on the basis of a difference between the first and second detection values; a lens unit including a lens and an actuator that drives the lens; and a driver unit that generates a drive signal and drives the actuator using the drive signal, in which the drive signal makes a transition in each of the first and third terms.

Abstract: A camera module of the disclosure includes: an imaging unit that includes a plurality of pixels, acquires a first detection value in one of the pixels in a second term out of a first term, the second term, a third term, and a fourth term that are set in order, acquires a second detection value in the relevant one of the pixels in the fourth term, and obtains a pixel value of the relevant one of the pixels on the basis of a difference between the first and second detection values; a lens unit including a lens and an actuator that drives the lens; and a driver unit that generates a drive signal and drives the actuator using the drive signal, in which the drive signal makes a transition in each of the first and third terms.

Abstract: A DA converter includes a first DA conversion section for obtaining an analog output signal in accordance with a digital input signal value, and a second DA conversion section for obtaining an analog gain control output signal in accordance with a digital gain control input signal value. In the DA converter, the gain control of the analog output signal generated by the first DA conversion section is performed on the basis of the gain control output signal generated by the second DA conversion section.

Abstract: A size reduction of an image pickup module by using resin molding, including a reduction in height, area, or the like thereof is achieved in an actual product. Provided is a module, including a substrate; a semiconductor component in which a first surface of a semiconductor device manufactured by chip-size packaging is provided and fixed along a plate-shaped translucent member, and a second surface of the semiconductor device is fixed with the second surface caused to face the substrate; a frame portion made of resin and formed on the substrate to surround the semiconductor component; and an interposition member which is made of resin and with which a gap between the semiconductor component and the substrate is filled. The interposition member is connected and fixed to the frame portion to be integrated therewith.