Patents by Inventor Go HIRAKAWA

Go HIRAKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11309103
    Abstract: A shielded flat cable 1 includes one or more ground wires G1, the ground wires G1 being arrayed parallel to each other, one or more signal wires S1 and S2 arrayed parallel to the one or more ground wires G1, insulating layers 11 and 12 covering the one or more ground wires G1 and the signal wires S1 and S2, and shield layers 21 and 22 provided on outer surfaces of the insulating layers 11 and 12. In a cross-section of the one or more ground wires, the insulating layers 11 and 12 include openings 13 and 14 of which bottoms are respectively an upper surface and a lower surface of one ground wire G1, and the one ground wire G1 and the shield layers 21 and 22 are electrically coupled at the openings 13 and 14, and the signal wires S1 and S2 are surrounded by the one or more ground wires G1 and the shield layers 21 and 22.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: April 19, 2022
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Manabu Nagano, Go Hirakawa, Shin Sato, Tatsuo Matsuda
  • Publication number: 20210166836
    Abstract: A shielded flat cable 1 includes one or more ground wires G1, the ground wires G1 being arrayed parallel to each other, one or more signal wires S1 and S2 arrayed parallel to the one or more ground wires G1, insulating layers 11 and 12 covering the one or more ground wires G1 and the signal wires S1 and S2, and shield layers 21 and 22 provided on outer surfaces of the insulating layers 11 and 12. In a cross-section of the one or more ground wires, the insulating layers 11 and 12 include openings 13 and 14 of which bottoms are respectively an upper surface and a lower surface of one ground wire G1, and the one ground wire G1 and the shield layers 21 and 22 are electrically coupled at the openings 13 and 14, and the signal wires S1 and S2 are surrounded by the one or more ground wires G1 and the shield layers 21 and 22.
    Type: Application
    Filed: April 11, 2019
    Publication date: June 3, 2021
    Inventors: Manabu NAGANO, Go HIRAKAWA, Shin SATO, Tatsuo MATSUDA