Patents by Inventor Go Ichinose
Go Ichinose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11915961Abstract: A measurement system used in a manufacturing line for micro-devices includes: a plurality of measurement devices in which each device performs measurement processing on a substrate; and a carrying system to perform delivery of a substrate with the plurality of measurement devices. The plurality of measurement devices includes a first measurement device that acquires position information on a plurality of marks formed on a substrate, and a second measurement device that acquires position information on a plurality of marks formed on a substrate. Position information on a plurality of marks formed on a substrate can be acquired under a setting of a first predetermined condition in the first measurement device, and position information on a plurality of marks formed on another substrate can be acquired under a setting of a second predetermined condition different from the first predetermined condition in the second measurement device.Type: GrantFiled: July 21, 2022Date of Patent: February 27, 2024Assignee: NIKON CORPORATIONInventors: Go Ichinose, Tomonori Dosho
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Publication number: 20220367224Abstract: A measurement system used in a manufacturing line for micro-devices includes: a plurality of measurement devices in which each device performs measurement processing on a substrate; and a carrying system to perform delivery of a substrate with the plurality of measurement devices. The plurality of measurement devices includes a first measurement device that acquires position information on a plurality of marks formed on a substrate, and a second measurement device that acquires position information on a plurality of marks formed on a substrate. Position information on a plurality of marks formed on a substrate can be acquired under a setting of a first predetermined condition in the first measurement device, and position information on a plurality of marks formed on another substrate can be acquired under a setting of a second predetermined condition different from the first predetermined condition in the second measurement device.Type: ApplicationFiled: July 21, 2022Publication date: November 17, 2022Applicant: NIKON CORPORATIONInventors: Go ICHINOSE, Tomonori DOSHO
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Patent number: 11430684Abstract: A measurement system used in a manufacturing line for micro-devices includes: a plurality of measurement devices in which each device performs measurement processing on a substrate; and a carrying system to perform delivery of a substrate with the plurality of measurement devices. The plurality of measurement devices includes a first measurement device that acquires position information on a plurality of marks formed on a substrate, and a second measurement device that acquires position information on a plurality of marks formed on a substrate. Position information on a plurality of marks formed on a substrate can be acquired under a setting of a first predetermined condition in the first measurement device, and position information on a plurality of marks formed on another substrate can be acquired under a setting of a second predetermined condition different from the first predetermined condition in the second measurement device.Type: GrantFiled: May 18, 2021Date of Patent: August 30, 2022Assignee: NIKON CORPORATIONInventors: Go Ichinose, Tomonori Dosho
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Publication number: 20220155062Abstract: A measurement system to be used in a micro-device manufacturing line is equipped with: a plurality of measurement devices which performs measurement processing on each substrate; and a controller that can control the plurality of measurement devices, and the plurality of measurement devices includes at least one first measurement device which acquires position information of a plurality of marks formed on a substrate.Type: ApplicationFiled: February 7, 2022Publication date: May 19, 2022Applicant: NIKON CORPORATIONInventors: Go ICHINOSE, Yuichi SHIBAZAKI
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Patent number: 11289362Abstract: In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.Type: GrantFiled: February 3, 2020Date of Patent: March 29, 2022Assignee: NIKON CORPORATIONInventors: Go Ichinose, Taisuke Ibe
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Patent number: 11274919Abstract: A measurement system to be used in a micro-device manufacturing line is equipped with: a plurality of measurement devices which performs measurement processing on each substrate; and a controller that can control the plurality of measurement devices, and the plurality of measurement devices includes at least one first measurement device which acquires position information of a plurality of marks formed on a substrate.Type: GrantFiled: February 19, 2019Date of Patent: March 15, 2022Assignee: NIKON CORPORATIONInventors: Go Ichinose, Yuichi Shibazaki
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Publication number: 20210272833Abstract: A measurement system used in a manufacturing line for micro-devices includes: a plurality of measurement devices in which each device performs measurement processing on a substrate; and a carrying system to perform delivery of a substrate with the plurality of measurement devices. The plurality of measurement devices includes a first measurement device that acquires position information on a plurality of marks formed on a substrate, and a second measurement device that acquires position information on a plurality of marks formed on a substrate. Position information on a plurality of marks formed on a substrate can be acquired under a setting of a first predetermined condition in the first measurement device, and position information on a plurality of marks formed on another substrate can be acquired under a setting of a second predetermined condition different from the first predetermined condition in the second measurement device.Type: ApplicationFiled: May 18, 2021Publication date: September 2, 2021Applicant: NIKON CORPORATIONInventors: Go ICHINOSE, Tomonori DOSHO
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Patent number: 11107718Abstract: A measurement system to be used in a manufacturing line for micro-devices is provided independently from an exposure apparatus. The measurement system has measurement devices that each performs measurement processing on substrates (e.g., substrates that have gone through at least one processing but before being coated with a sensitive agent), and a carrying system for performing delivery of substrates to/from the measurement devices. The measurement devices include a first measurement device that acquires position information on a plurality of marks formed on a substrate under a setting of a first condition, and a second measurement device that acquires position information on a plurality of marks formed on another substrate (e.g., another substrate included in the same lot as the substrate on which acquiring position information is performed under the setting of the first condition in the first measurement device) under a setting of a first condition.Type: GrantFiled: May 7, 2020Date of Patent: August 31, 2021Assignee: NIKON CORPORATIONInventors: Go Ichinose, Tomonori Dosho
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Patent number: 11069552Abstract: A measurement system to be used in a manufacturing line for micro-devices is provided independently from an exposure apparatus. The measurement system has measurement devices that each performs measurement processing on substrates (e.g., substrates that have gone through at least one processing but before being coated with a sensitive agent), and a carrying system for performing delivery of substrates to/from the measurement devices. The measurement devices include a first measurement device that acquires position information on a plurality of marks formed on a substrate under a setting of a first condition, and a second measurement device that acquires position information on a plurality of marks formed on another substrate (e.g., another substrate included in the same lot as the substrate on which acquiring position information is performed under the setting of the first condition in the first measurement device) under a setting of a first condition.Type: GrantFiled: May 7, 2020Date of Patent: July 20, 2021Assignee: NIKON CORPORATIONInventors: Go Ichinose, Tomonori Dosho
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Patent number: 10777441Abstract: A measurement system to be used in a manufacturing line for micro-devices is provided independently from an exposure apparatus. The measurement system has measurement devices that each performs measurement processing on substrates (e.g., substrates that have gone through at least one processing but before being coated with a sensitive agent), and a carrying system for performing delivery of substrates to/from the measurement devices. The measurement devices include a first measurement device that acquires position information on a plurality of marks formed on a substrate under a setting of a first condition, and a second measurement device that acquires position information on a plurality of marks formed on another substrate (e.g., another substrate included in the same lot as the substrate on which acquiring position information is performed under the setting of the first condition in the first measurement device) under a setting of a first condition.Type: GrantFiled: March 25, 2019Date of Patent: September 15, 2020Assignee: NIKON CORPORATIONInventors: Go Ichinose, Tomonori Dosho
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Publication number: 20200266087Abstract: A measurement system to be used in a manufacturing line for micro-devices is provided independently from an exposure apparatus. The measurement system has measurement devices that each performs measurement processing on substrates (e.g., substrates that have gone through at least one processing but before being coated with a sensitive agent), and a carrying system for performing delivery of substrates to/from the measurement devices. The measurement devices include a first measurement device that acquires position information on a plurality of marks formed on a substrate under a setting of a first condition, and a second measurement device that acquires position information on a plurality of marks formed on another substrate (e.g., another substrate included in the same lot as the substrate on which acquiring position information is performed under the setting of the first condition in the first measurement device) under a setting of a first condition.Type: ApplicationFiled: May 7, 2020Publication date: August 20, 2020Applicant: NIKON CORPORATIONInventors: Go ICHINOSE, Tomonori DOSHO
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Publication number: 20200176298Abstract: In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.Type: ApplicationFiled: February 3, 2020Publication date: June 4, 2020Applicant: NIKON CORPORATIONInventors: Go ICHINOSE, Taisuke IBE
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Patent number: 10586728Abstract: In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.Type: GrantFiled: February 5, 2019Date of Patent: March 10, 2020Assignee: NIKON CORPORATIONInventors: Go Ichinose, Taisuke Ibe
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Publication number: 20190287837Abstract: A measurement system to be used in a manufacturing line for micro-devices is provided independently from an exposure apparatus. The measurement system has measurement devices that each performs measurement processing on substrates (e.g., substrates that have gone through at least one processing but before being coated with a sensitive agent), and a carrying system for performing delivery of substrates to/from the measurement devices. The measurement devices include a first measurement device that acquires position information on a plurality of marks formed on a substrate under a setting of a first condition, and a second measurement device that acquires position information on a plurality of marks formed on another substrate (e.g., another substrate included in the same lot as the substrate on which acquiring position information is performed under the setting of the first condition in the first measurement device) under a setting of a first condition.Type: ApplicationFiled: March 25, 2019Publication date: September 19, 2019Applicant: NIKON CORPORATIONInventors: Go ICHINOSE, Tomonori DOSHO
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Publication number: 20190257647Abstract: A measurement system to be used in a micro-device manufacturing line is equipped with: a plurality of measurement devices which performs measurement processing on each substrate; and a controller that can control the plurality of measurement devices, and the plurality of measurement devices includes at least one first measurement device which acquires position information of a plurality of marks formed on a substrate.Type: ApplicationFiled: February 19, 2019Publication date: August 22, 2019Applicant: NIKON CORPORATIONInventors: Go ICHINOSE, Yuichi SHIBAZAKI
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Publication number: 20190172745Abstract: In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.Type: ApplicationFiled: February 5, 2019Publication date: June 6, 2019Applicant: NIKON CORPORATIONInventors: Go ICHINOSE, Taisuke IBE
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Patent number: 10242903Abstract: In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.Type: GrantFiled: November 27, 2013Date of Patent: March 26, 2019Assignee: NIKON CORPORATIONInventors: Go Ichinose, Taisuke Ibe
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Publication number: 20180174884Abstract: A wafer holding apparatus for holding a wafer including a wafer holder on which the wafer is placed; and a lift pin that is configured to be lifted up and down with respect to the wafer holder in a direction along a normal line of a placement surface of the wafer, the lift pin includes a tip part, the tip part includes: a bottom part that forms a suction region for sucking a rear surface of the wafer; and a convex part that supports the rear surface of the wafer in the suction region. When a substrate is placed on a target position, it is possible to prevent a local deterioration of flatness of the substrate even if the substrate is large.Type: ApplicationFiled: December 18, 2017Publication date: June 21, 2018Applicant: NIKON CORPORATIONInventor: Go ICHINOSE
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Patent number: 9865494Abstract: A wafer holding apparatus for holding a wafer including a wafer holder on which the wafer is placed; and a lift pin that is configured to be lifted up and down with respect to the wafer holder in a direction along a normal line of a placement surface of the wafer, the lift pin includes a tip part, the tip part includes: a bottom part that forms a suction region for sucking a rear surface of the wafer; and a convex part that supports the rear surface of the wafer in the suction region. When a substrate is placed on a target position, it is possible to prevent a local deterioration of flatness of the substrate even if the substrate is large.Type: GrantFiled: May 23, 2013Date of Patent: January 9, 2018Assignee: NIKON CORPORATIONInventor: Go Ichinose
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Patent number: RE48429Abstract: A wafer holding apparatus for holding a wafer including a wafer holder on which the wafer is placed; and a lift pin that is configured to be lifted up and down with respect to the wafer holder in a direction along a normal line of a placement surface of the wafer, the lift pin includes a tip part, the tip part includes: a bottom part that forms a suction region for sucking a rear surface of the wafer; and a convex part that supports the rear surface of the wafer in the suction region. When a substrate is placed on a target position, it is possible to prevent a local deterioration of flatness of the substrate even if the substrate is large.Type: GrantFiled: June 8, 2018Date of Patent: February 9, 2021Assignee: NIKON CORPORATIONInventor: Go Ichinose