Patents by Inventor Go Ichinose

Go Ichinose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11915961
    Abstract: A measurement system used in a manufacturing line for micro-devices includes: a plurality of measurement devices in which each device performs measurement processing on a substrate; and a carrying system to perform delivery of a substrate with the plurality of measurement devices. The plurality of measurement devices includes a first measurement device that acquires position information on a plurality of marks formed on a substrate, and a second measurement device that acquires position information on a plurality of marks formed on a substrate. Position information on a plurality of marks formed on a substrate can be acquired under a setting of a first predetermined condition in the first measurement device, and position information on a plurality of marks formed on another substrate can be acquired under a setting of a second predetermined condition different from the first predetermined condition in the second measurement device.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: February 27, 2024
    Assignee: NIKON CORPORATION
    Inventors: Go Ichinose, Tomonori Dosho
  • Publication number: 20220367224
    Abstract: A measurement system used in a manufacturing line for micro-devices includes: a plurality of measurement devices in which each device performs measurement processing on a substrate; and a carrying system to perform delivery of a substrate with the plurality of measurement devices. The plurality of measurement devices includes a first measurement device that acquires position information on a plurality of marks formed on a substrate, and a second measurement device that acquires position information on a plurality of marks formed on a substrate. Position information on a plurality of marks formed on a substrate can be acquired under a setting of a first predetermined condition in the first measurement device, and position information on a plurality of marks formed on another substrate can be acquired under a setting of a second predetermined condition different from the first predetermined condition in the second measurement device.
    Type: Application
    Filed: July 21, 2022
    Publication date: November 17, 2022
    Applicant: NIKON CORPORATION
    Inventors: Go ICHINOSE, Tomonori DOSHO
  • Patent number: 11430684
    Abstract: A measurement system used in a manufacturing line for micro-devices includes: a plurality of measurement devices in which each device performs measurement processing on a substrate; and a carrying system to perform delivery of a substrate with the plurality of measurement devices. The plurality of measurement devices includes a first measurement device that acquires position information on a plurality of marks formed on a substrate, and a second measurement device that acquires position information on a plurality of marks formed on a substrate. Position information on a plurality of marks formed on a substrate can be acquired under a setting of a first predetermined condition in the first measurement device, and position information on a plurality of marks formed on another substrate can be acquired under a setting of a second predetermined condition different from the first predetermined condition in the second measurement device.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: August 30, 2022
    Assignee: NIKON CORPORATION
    Inventors: Go Ichinose, Tomonori Dosho
  • Publication number: 20220155062
    Abstract: A measurement system to be used in a micro-device manufacturing line is equipped with: a plurality of measurement devices which performs measurement processing on each substrate; and a controller that can control the plurality of measurement devices, and the plurality of measurement devices includes at least one first measurement device which acquires position information of a plurality of marks formed on a substrate.
    Type: Application
    Filed: February 7, 2022
    Publication date: May 19, 2022
    Applicant: NIKON CORPORATION
    Inventors: Go ICHINOSE, Yuichi SHIBAZAKI
  • Patent number: 11289362
    Abstract: In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: March 29, 2022
    Assignee: NIKON CORPORATION
    Inventors: Go Ichinose, Taisuke Ibe
  • Patent number: 11274919
    Abstract: A measurement system to be used in a micro-device manufacturing line is equipped with: a plurality of measurement devices which performs measurement processing on each substrate; and a controller that can control the plurality of measurement devices, and the plurality of measurement devices includes at least one first measurement device which acquires position information of a plurality of marks formed on a substrate.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: March 15, 2022
    Assignee: NIKON CORPORATION
    Inventors: Go Ichinose, Yuichi Shibazaki
  • Publication number: 20210272833
    Abstract: A measurement system used in a manufacturing line for micro-devices includes: a plurality of measurement devices in which each device performs measurement processing on a substrate; and a carrying system to perform delivery of a substrate with the plurality of measurement devices. The plurality of measurement devices includes a first measurement device that acquires position information on a plurality of marks formed on a substrate, and a second measurement device that acquires position information on a plurality of marks formed on a substrate. Position information on a plurality of marks formed on a substrate can be acquired under a setting of a first predetermined condition in the first measurement device, and position information on a plurality of marks formed on another substrate can be acquired under a setting of a second predetermined condition different from the first predetermined condition in the second measurement device.
    Type: Application
    Filed: May 18, 2021
    Publication date: September 2, 2021
    Applicant: NIKON CORPORATION
    Inventors: Go ICHINOSE, Tomonori DOSHO
  • Patent number: 11107718
    Abstract: A measurement system to be used in a manufacturing line for micro-devices is provided independently from an exposure apparatus. The measurement system has measurement devices that each performs measurement processing on substrates (e.g., substrates that have gone through at least one processing but before being coated with a sensitive agent), and a carrying system for performing delivery of substrates to/from the measurement devices. The measurement devices include a first measurement device that acquires position information on a plurality of marks formed on a substrate under a setting of a first condition, and a second measurement device that acquires position information on a plurality of marks formed on another substrate (e.g., another substrate included in the same lot as the substrate on which acquiring position information is performed under the setting of the first condition in the first measurement device) under a setting of a first condition.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: August 31, 2021
    Assignee: NIKON CORPORATION
    Inventors: Go Ichinose, Tomonori Dosho
  • Patent number: 11069552
    Abstract: A measurement system to be used in a manufacturing line for micro-devices is provided independently from an exposure apparatus. The measurement system has measurement devices that each performs measurement processing on substrates (e.g., substrates that have gone through at least one processing but before being coated with a sensitive agent), and a carrying system for performing delivery of substrates to/from the measurement devices. The measurement devices include a first measurement device that acquires position information on a plurality of marks formed on a substrate under a setting of a first condition, and a second measurement device that acquires position information on a plurality of marks formed on another substrate (e.g., another substrate included in the same lot as the substrate on which acquiring position information is performed under the setting of the first condition in the first measurement device) under a setting of a first condition.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: July 20, 2021
    Assignee: NIKON CORPORATION
    Inventors: Go Ichinose, Tomonori Dosho
  • Patent number: 10777441
    Abstract: A measurement system to be used in a manufacturing line for micro-devices is provided independently from an exposure apparatus. The measurement system has measurement devices that each performs measurement processing on substrates (e.g., substrates that have gone through at least one processing but before being coated with a sensitive agent), and a carrying system for performing delivery of substrates to/from the measurement devices. The measurement devices include a first measurement device that acquires position information on a plurality of marks formed on a substrate under a setting of a first condition, and a second measurement device that acquires position information on a plurality of marks formed on another substrate (e.g., another substrate included in the same lot as the substrate on which acquiring position information is performed under the setting of the first condition in the first measurement device) under a setting of a first condition.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: September 15, 2020
    Assignee: NIKON CORPORATION
    Inventors: Go Ichinose, Tomonori Dosho
  • Publication number: 20200266087
    Abstract: A measurement system to be used in a manufacturing line for micro-devices is provided independently from an exposure apparatus. The measurement system has measurement devices that each performs measurement processing on substrates (e.g., substrates that have gone through at least one processing but before being coated with a sensitive agent), and a carrying system for performing delivery of substrates to/from the measurement devices. The measurement devices include a first measurement device that acquires position information on a plurality of marks formed on a substrate under a setting of a first condition, and a second measurement device that acquires position information on a plurality of marks formed on another substrate (e.g., another substrate included in the same lot as the substrate on which acquiring position information is performed under the setting of the first condition in the first measurement device) under a setting of a first condition.
    Type: Application
    Filed: May 7, 2020
    Publication date: August 20, 2020
    Applicant: NIKON CORPORATION
    Inventors: Go ICHINOSE, Tomonori DOSHO
  • Publication number: 20200176298
    Abstract: In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.
    Type: Application
    Filed: February 3, 2020
    Publication date: June 4, 2020
    Applicant: NIKON CORPORATION
    Inventors: Go ICHINOSE, Taisuke IBE
  • Patent number: 10586728
    Abstract: In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: March 10, 2020
    Assignee: NIKON CORPORATION
    Inventors: Go Ichinose, Taisuke Ibe
  • Publication number: 20190287837
    Abstract: A measurement system to be used in a manufacturing line for micro-devices is provided independently from an exposure apparatus. The measurement system has measurement devices that each performs measurement processing on substrates (e.g., substrates that have gone through at least one processing but before being coated with a sensitive agent), and a carrying system for performing delivery of substrates to/from the measurement devices. The measurement devices include a first measurement device that acquires position information on a plurality of marks formed on a substrate under a setting of a first condition, and a second measurement device that acquires position information on a plurality of marks formed on another substrate (e.g., another substrate included in the same lot as the substrate on which acquiring position information is performed under the setting of the first condition in the first measurement device) under a setting of a first condition.
    Type: Application
    Filed: March 25, 2019
    Publication date: September 19, 2019
    Applicant: NIKON CORPORATION
    Inventors: Go ICHINOSE, Tomonori DOSHO
  • Publication number: 20190257647
    Abstract: A measurement system to be used in a micro-device manufacturing line is equipped with: a plurality of measurement devices which performs measurement processing on each substrate; and a controller that can control the plurality of measurement devices, and the plurality of measurement devices includes at least one first measurement device which acquires position information of a plurality of marks formed on a substrate.
    Type: Application
    Filed: February 19, 2019
    Publication date: August 22, 2019
    Applicant: NIKON CORPORATION
    Inventors: Go ICHINOSE, Yuichi SHIBAZAKI
  • Publication number: 20190172745
    Abstract: In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.
    Type: Application
    Filed: February 5, 2019
    Publication date: June 6, 2019
    Applicant: NIKON CORPORATION
    Inventors: Go ICHINOSE, Taisuke IBE
  • Patent number: 10242903
    Abstract: In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: March 26, 2019
    Assignee: NIKON CORPORATION
    Inventors: Go Ichinose, Taisuke Ibe
  • Publication number: 20180174884
    Abstract: A wafer holding apparatus for holding a wafer including a wafer holder on which the wafer is placed; and a lift pin that is configured to be lifted up and down with respect to the wafer holder in a direction along a normal line of a placement surface of the wafer, the lift pin includes a tip part, the tip part includes: a bottom part that forms a suction region for sucking a rear surface of the wafer; and a convex part that supports the rear surface of the wafer in the suction region. When a substrate is placed on a target position, it is possible to prevent a local deterioration of flatness of the substrate even if the substrate is large.
    Type: Application
    Filed: December 18, 2017
    Publication date: June 21, 2018
    Applicant: NIKON CORPORATION
    Inventor: Go ICHINOSE
  • Patent number: 9865494
    Abstract: A wafer holding apparatus for holding a wafer including a wafer holder on which the wafer is placed; and a lift pin that is configured to be lifted up and down with respect to the wafer holder in a direction along a normal line of a placement surface of the wafer, the lift pin includes a tip part, the tip part includes: a bottom part that forms a suction region for sucking a rear surface of the wafer; and a convex part that supports the rear surface of the wafer in the suction region. When a substrate is placed on a target position, it is possible to prevent a local deterioration of flatness of the substrate even if the substrate is large.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: January 9, 2018
    Assignee: NIKON CORPORATION
    Inventor: Go Ichinose
  • Patent number: RE48429
    Abstract: A wafer holding apparatus for holding a wafer including a wafer holder on which the wafer is placed; and a lift pin that is configured to be lifted up and down with respect to the wafer holder in a direction along a normal line of a placement surface of the wafer, the lift pin includes a tip part, the tip part includes: a bottom part that forms a suction region for sucking a rear surface of the wafer; and a convex part that supports the rear surface of the wafer in the suction region. When a substrate is placed on a target position, it is possible to prevent a local deterioration of flatness of the substrate even if the substrate is large.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: February 9, 2021
    Assignee: NIKON CORPORATION
    Inventor: Go Ichinose