Abstract: A measurement system used in a manufacturing line for micro-devices includes: a plurality of measurement devices in which each device performs measurement processing on a substrate; and a carrying system to perform delivery of a substrate with the plurality of measurement devices. The plurality of measurement devices includes a first measurement device that acquires position information on a plurality of marks formed on a substrate, and a second measurement device that acquires position information on a plurality of marks formed on a substrate. Position information on a plurality of marks formed on a substrate can be acquired under a setting of a first predetermined condition in the first measurement device, and position information on a plurality of marks formed on another substrate can be acquired under a setting of a second predetermined condition different from the first predetermined condition in the second measurement device.

Abstract: A measurement system used in a manufacturing line for micro-devices includes: a plurality of measurement devices in which each device performs measurement processing on a substrate; and a carrying system to perform delivery of a substrate with the plurality of measurement devices. The plurality of measurement devices includes a first measurement device that acquires position information on a plurality of marks formed on a substrate, and a second measurement device that acquires position information on a plurality of marks formed on a substrate. Position information on a plurality of marks formed on a substrate can be acquired under a setting of a first predetermined condition in the first measurement device, and position information on a plurality of marks formed on another substrate can be acquired under a setting of a second predetermined condition different from the first predetermined condition in the second measurement device.

Abstract: In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.

Abstract: A measurement system to be used in a micro-device manufacturing line is equipped with: a plurality of measurement devices which performs measurement processing on each substrate; and a controller that can control the plurality of measurement devices, and the plurality of measurement devices includes at least one first measurement device which acquires position information of a plurality of marks formed on a substrate.

Abstract: A measurement system to be used in a manufacturing line for micro-devices is provided independently from an exposure apparatus. The measurement system has measurement devices that each performs measurement processing on substrates (e.g., substrates that have gone through at least one processing but before being coated with a sensitive agent), and a carrying system for performing delivery of substrates to/from the measurement devices. The measurement devices include a first measurement device that acquires position information on a plurality of marks formed on a substrate under a setting of a first condition, and a second measurement device that acquires position information on a plurality of marks formed on another substrate (e.g., another substrate included in the same lot as the substrate on which acquiring position information is performed under the setting of the first condition in the first measurement device) under a setting of a first condition.

Abstract: A measurement system to be used in a manufacturing line for micro-devices is provided independently from an exposure apparatus. The measurement system has measurement devices that each performs measurement processing on substrates (e.g., substrates that have gone through at least one processing but before being coated with a sensitive agent), and a carrying system for performing delivery of substrates to/from the measurement devices. The measurement devices include a first measurement device that acquires position information on a plurality of marks formed on a substrate under a setting of a first condition, and a second measurement device that acquires position information on a plurality of marks formed on another substrate (e.g., another substrate included in the same lot as the substrate on which acquiring position information is performed under the setting of the first condition in the first measurement device) under a setting of a first condition.

Abstract: A measurement system to be used in a manufacturing line for micro-devices is provided independently from an exposure apparatus. The measurement system has measurement devices that each performs measurement processing on substrates (e.g., substrates that have gone through at least one processing but before being coated with a sensitive agent), and a carrying system for performing delivery of substrates to/from the measurement devices. The measurement devices include a first measurement device that acquires position information on a plurality of marks formed on a substrate under a setting of a first condition, and a second measurement device that acquires position information on a plurality of marks formed on another substrate (e.g., another substrate included in the same lot as the substrate on which acquiring position information is performed under the setting of the first condition in the first measurement device) under a setting of a first condition.

Abstract: In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.

Abstract: In a carrier system, a chuck unit is used to hold a placed wafer from above, and vertical-motion pins use suction to hold the wafer from below. Then, the chuck unit and the vertical-motion pins are subsequently lowered until a bottom surface of the wafer comes into contact with a wafer table. During the lowering, the holding force exerted by the chuck unit and the arrangement of chuck members are optimally adjusted such that, as a result of the restraint of the wafer by the chuck unit and the vertical-motion pins, localized surplus-restraint is imparted to the wafer, and warping does not occur.

Abstract: A wafer holding apparatus for holding a wafer including a wafer holder on which the wafer is placed; and a lift pin that is configured to be lifted up and down with respect to the wafer holder in a direction along a normal line of a placement surface of the wafer, the lift pin includes a tip part, the tip part includes: a bottom part that forms a suction region for sucking a rear surface of the wafer; and a convex part that supports the rear surface of the wafer in the suction region. When a substrate is placed on a target position, it is possible to prevent a local deterioration of flatness of the substrate even if the substrate is large.

Abstract: A manufacturing method of an exposure apparatus includes adjusting a positioning device that determines a positional relation at the time of docking between a body and a stage module such that a positional relation between an absolute reference surface of a metrology frame of the body and a stage position reference surface of the stage module becomes a desired relation. Accordingly, after that, only by docking the body and the stage module with each other via the positioning device, the positional relation between the absolute reference surface of the body and the stage position reference surface of the stage module becomes a desired relation.

Abstract: A stage device is equipped with a fine movement stage on which a wafer is mounted, a coarse movement stage formed into a frame shape that encloses the periphery of the fine movement stage, which supports the fine movement stage such that the fine movement stage is relatively movable and which is movable along an XY plane, a planar motor that drives the coarse movement stage in a predetermined range within the XY plane, and an actuator that drives the fine movement stage with respect to the coarse movement stage. Therefore, the size, in a direction perpendicular to the XY plane (height direction), of a movable body made up of the fine movement stage and the coarse movement stage can be reduced, compared with a wafer stage having a coarse/fine movement configuration in which the fine movement stage is mounted on the coarse movement stage.

Abstract: Positional information of wafer stages is measured by a plurality of encoder heads, Z heads and the like that a measurement bar placed below surface has, using gratings placed on the lower surface of fine movement stages. Consequently, high-precision measurement of the positional information of the wafer stages can be performed. Further, since a guide surface of the wafer stages is formed by the two guide surface forming members placed side by side via a predetermined clearance, each guide surface forming member is easier to handle and also maintenance of the vicinity of the guide surface forming member is easier to perform, compared with the case where the guide surface forming members are integrated.

Abstract: Positional information of each of wafer stages during exposure and during alignment is measured directly under a projection optical system and directly under a primary alignment system, respectively, by a plurality of encoder heads, Z heads and the like, which a measurement bar placed below surface plates has, using gratings placed on the lower surfaces of fine movement stages. Consequently, high-precision measurement of the positional information of the wafer stages can be performed.

Abstract: When a liquid immersion area (liquid) formed on a wafer stage is moved onto another wafer stage, a fine movement stage position measuring system measures positional information of the wafer stage, interferometers of a coarse movement stage position measuring system measure positional information of the another wafer stage, and different interferometers measure positional information of the wafer stage. Based on these measurement results, the wafer stage and the another wafer stage are made to be in proximity to each other and are driven while the scrum state is maintained, and thereby the liquid immersion area (liquid) formed on the wafer stage can be moved onto the another wafer stage.

Abstract: Positional information of each of wafer stages during exposure and during alignment is measured directly under a projection optical system and directly under a primary alignment system, respectively, by a plurality of encoder heads, Z heads and the like, which a measurement bar placed below surface plates has, using gratings placed on the lower surfaces of fine movement stages. Since a main frame that supports the projection optical system and the measurement bar are separated, deformation of the measurement bar caused by inner stress (including thermal stress) and transmission of vibration or the like from the main frame to the measurement bar, and the like do not occur, which is different from the case where the main frame and the measurement bar are integrated. Consequently, high-precision measurement of the positional information of the wafer stages can be performed.

Abstract: Positional information of each of wafer stages during exposure and during alignment is measured directly under a projection optical system and directly under a primary alignment system, respectively, by a plurality of encoder heads, Z heads and the like, which a measurement bar placed below surface plates has, using gratings placed on the lower surfaces of fine movement stages. Since a main frame that supports the projection optical system and the measurement bar are separated, deformation of the measurement bar caused by inner stress (including thermal stress) and transmission of vibration or the like from the main frame to the measurement bar, and the like do not occur, which is different from the case where the main frame and the measurement bar are integrated. Consequently, high-precision measurement of the positional information of the wafer stages can be performed.

Abstract: At a measurement bar on which a first measurement head group that measures positional information of a fine movement stage that holds a wafer is arranged, various types of measurement instruments, e.g. an aerial image measuring instrument and the like, used in measurement related exposure such as the optical properties of a projection optical system are arranged. The measurement is performed using the various types of measurement instruments and the exposure conditions such as the optical properties of the projection optical system are adjusted based on the result of the measurement, as needed, and thereby the exposure processing can appropriately be performed on the wafer.

Abstract: A maintenance method for performing maintenance of an exposure apparatus including a liquid immersion space-forming member which forms a liquid-immersion area by supplying liquid in a space between an optical member and a substrate; a liquid supply mechanism which supplies the liquid to the liquid-immersion space; a substrate stage which moves the substrate; and a measuring stage on which a reference mark is formed. To clean the liquid-immersion space-forming member, a cleaning liquid is supplied to a space between the measuring stage and the liquid-immersion space-forming member. The exposure apparatus is provided with various types of cleaning mechanisms for cleaning the liquid-immersion space-forming member. The liquid-immersion exposure can be performed while efficiently performing maintenance of the exposure apparatus.

Abstract: A wafer holding apparatus for holding a wafer including a wafer holder on which the wafer is placed; and a lift pin that is configured to be lifted up and down with respect to the wafer holder in a direction along a normal line of a placement surface of the wafer, the lift pin includes a tip part, the tip part includes: a bottom part that forms a suction region for sucking a rear surface of the wafer; and a convex part that supports the rear surface of the wafer in the suction region. When a substrate is placed on a target position, it is possible to prevent a local deterioration of flatness of the substrate even if the substrate is large.