Abstract: In a method for making integrated circuits, a semiconductor substrate is provided which carries a plurality of unconnected devices of a first device type at regularly spaced regions of the substrate and a plurality of unconnected devices of a secound, distinct device type at substantially all regions of the substrate other than those carrying devices of the first device type, and at least one interconnection layer is formed on the substrate to interconnect selected ones of the devices of the first device type and the devices of the second device type to define a plurality of integrated circuits. Pad regions may be formed over unconnected devices for connection of the integrated circuits to package terminals. The integrated circuits are separated by regions containing unconnected devices, and the semiconductor substrate may be scribed and broken or otherwise cut in these regions to separate the integrated circuits.

Abstract: An integrated circuit has integrated circuit cells drawn from a library. The cells are rectangular with input lines extending from both sides of the cell to a logic element on the cell and outputs taken from the logic element to both sides of the cell. Input and output lines terminate at connection points. Short linear lengths of conductors selectively interconnect the connection points across the boundary between adjacent cells. The arrangement permits on-cell series and parallel connection of cells.